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Paul M Goodwin

from Sayreville, NJ
Age ~82
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Also known as:
Paul N Goodwin, Paul S Goodwin, Paul Goodwinjr, Paul Goiodwin, Goodwin Jr Paul
Related to:
Terri Strittmatter Haider, 71Justin T Goodwin, 42Dorothy E GoodwinElon D Goodwin, 52Inda S Steinle, 64Kevin A HaiderMolly B Walker, 43Jean GoodwinMartha Steinle, 72Timothy J HaiderHarry Ralph SteinleTheresa HaiderNatalie A Brewster, 39Margaret M Steinle, 97Ronald N BrewsterTimothy J Haider, 74Jessica A Haider, 43Jean M Goodwin, 67
Connected to:
Adrienne Goodwin, 42Aidan Z Goodwin, 41Aleda P Goodwin, 76Alexcia M Goodwin, 35Amaryllis A Goodwin, 49Amie Goodwin, 51Andre D Goodwine, 33Andrew K Goodwillie, 53Angie M Goodwill, 53Anisa M Goodwin, 55

Paul Goodwin Phones & Addresses

  • Sayreville, NJ
  • Banning, CA
  • Yucaipa, CA
  • West Mansfield, OH
  • Austin, TX
  • Eagle Mountain, UT
  • Nyack, NY
  • Charlotte, NC
  • Brooklyn, NY
  • Denver, CO
  • Beaumont, CA

Work

Company: Villain llc Jun 2013 Position: Staffing / bar manager - thump presents up next

Education

School / High School: Southern Cross University 2007 Specialities: MBA in Business Administration

Professional Records

Medicine Doctors

Paul Goodwin Photo 1

Paul Joshua Goodwin

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Specialties:
General Practice

Resumes

Resumes

Paul Goodwin Photo 2

Paul Goodwin Brooklyn, NY

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Work:
Villain LLC

Jun 2013 to Jun 2013
Staffing / Bar Manager - THUMP presents UP NEXT
Villain LLC

Jun 2013 to Jun 2013
Production Coordinator / Stage Manager, Jameson Black Barrel Lounge - Northside Music Festival
NBC News Education Nation Tour

Feb 2013 to May 2013
Production Coordinator
Eyesight
New York, NY
Feb 2013 to Feb 2013
Production Assistant, Diesel 'Black and Gold
The Say Ok Sundance Lounge

2013 to Jan 2013
Producer
Villain LLC

Nov 2012 to Nov 2012
Production Assistant, The Victorias Secret Fashion Show
The Macy's Parade Pop Up Shop

Nov 2012 to Nov 2012
Producer
Pitchfork CMJ Showcase

Oct 2012 to Oct 2012
Production Manager
Civic Entertainment Group

Sep 2012 to Sep 2012
Production Assistant, NBC News Education Nation
Neverstop

Mar 2012 to Mar 2012
Production Assistant, Sephora Pop Up Store
Neverstop
New York, NY
Feb 2012 to Feb 2012
Assistant Producer, Sephora Sensorium
Sony Music Entertainment / Sony BMG

2005 to 2006
A&R Manager
Sony Music Entertainment

2003 to 2005
Product Manager
Sony Music Entertainment
Brisbane QLD
2002 to 2003
Retail Account Representative
Education:
Southern Cross University
2007 to 2000
MBA in Business Administration
University of Queensland
Brisbane QLD
1995 to 1998
Bachelor of Science in Physiology & Pharmacology

Business Records

Name / Title
Company / Classification
Phones & Addresses
Paul Goodwin
Goodwin Consulting LLC
Business Consulting · Consulting · Business Consulting Services
1311 Pleasant Vly Ave, Banning, CA 92220
Paul M. Goodwin
ROSEPOINTE COTTAGE TEA ROOM, LLC
Paul Goodwin
Vice President
WESTMARK HOTELS, INC
Paul C. Goodwin
PC CONNEX INC
Paul Goodwin
Managing
Colorel Wholesale Blinds, LC
1223 Wilderness Dr, Austin, TX 78746
Paul Goodwin
Executive
MUNICH RE AMERICA CORPORATION
Fire/Casualty Insurance Carrier
555 College Rd E, Princeton, NJ 08543
685 College Rd E, Princeton, NJ 08540
(609) 243-4200, (609) 243-4900
Paul Goodwin
Custom Crushing Industries, LLC
Rock Crushing

Publications

Amazon

Tubeway Daze: The Untold Story Of Tubeway Army

Tubeway Daze: The Untold Story Of Tubeway Army

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Before Gary Numan there was Tubeway Army, and before Tubeway Army there was Gary Webb, a determined and ambitious 16 year old singer/songwriter from West London, who in the punk-assaulted summer of1976, dispensed with full time education to pursue his long held dream of fame and stardom. To assist h...
Author

Paul Goodwin

Binding

Paperback

Pages

106

Publisher

CreateSpace Independent Publishing Platform

ISBN #

1523211547

EAN Code

9781523211548

ISBN #

10

Decision Analysis For Management Judgment

Decision Analysis for Management Judgment

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In an increasingly complex world, decision analysis has a major role to play in helping decision-makers to gain insights into the problems they face. Decision Analysis for Management Judgment is unique in its breadth of coverage of decision analysis methods. It covers both the psychological problems...
Author

Paul Goodwin, George Wright

Binding

Paperback

Pages

468

Publisher

Wiley

ISBN #

0470714395

EAN Code

9780470714393

ISBN #

5

Electric Pioneer Redux: An Armchair Guide To Gary Numan

Electric Pioneer Redux: An Armchair Guide To Gary Numan

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Since his astonishing breakthrough in 1979 with “Are “Friends” Electric?” and “Cars,” Gary Numan has steadily built up a vast body of work. Some of these recordings are well known, some, however, are hopelessly obscure. From his earliest recordings with Tubeway Army in late 1977 to his current, Nu-M...
Author

paul goodwin

Binding

Paperback

Pages

330

Publisher

CreateSpace Independent Publishing Platform

ISBN #

1495278085

EAN Code

9781495278082

ISBN #

4

Decision Analysis For Management Judgment

Decision Analysis for Management Judgment

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Decision Analysis for Management Judgment is unique in its breadth of coverage of decision analysis methods. It covers both the psychological problems that are associated with unaided managerial decision making and thedecision analysis methods designed to overcome them. It is presented and explained...
Author

Paul Goodwin, George Wright

Binding

Paperback

Pages

496

Publisher

Wiley

ISBN #

1118740734

EAN Code

9781118740736

ISBN #

1

By Paul Goodwin Decision Analysis For Management Judgement (5Th Edition)

By Paul Goodwin Decision Analysis for Management Judgement (5th Edition)

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Binding

Paperback

Publisher

Wiley

ISBN #

9

Global Studies: Latin America And The Caribbean (Global Studies (Paperback))

Global Studies: Latin America and the Caribbean (Global Studies (Paperback))

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Global Studies is a unique series designed to provide comprehensive background information and selected world press articles on the regions and countries of the world. Each Global Studies volume includes an annotated listing of World Wide Web sites and is now supported by an online Instructor's Reso...
Author

Paul Goodwin

Binding

Paperback

Pages

320

Publisher

McGraw-Hill Education

ISBN #

0078026261

EAN Code

9780078026263

ISBN #

3

Brexit: Why Britain Voted To Leave The European Union

Brexit: Why Britain Voted to Leave the European Union

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In June 2016, the United Kingdom shocked the world by voting to leave the European Union. As this book reveals, the historic vote for Brexit marked the culmination of trends in domestic politics and in the UK's relationship with the EU that have been building over many years. Drawing on a wealth of ...
Author

Harold D. Clarke, Matthew Goodwin, Paul Whiteley

Binding

Paperback

Pages

272

Publisher

Cambridge University Press

ISBN #

1316605043

EAN Code

9781316605042

ISBN #

2

By Paul Goodwin: Global Studies: Latin America And The Caribbean Fourteenth (14Th) Edition

By Paul Goodwin: Global Studies: Latin America and the Caribbean Fourteenth (14th) Edition

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Latin America and The Caribbean Fourteenth Edition by Paul B. Goodwin
Binding

Paperback

Publisher

14th Edition

ISBN #

6

Isbn (Books And Publications)

Global Studies: Latin America

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Author

Paul B. Goodwin

ISBN #

0073404063

The Caribbean after Grenada: Revolution, Conflict, and Democracy

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Author

Paul B. Goodwin

ISBN #

0275927229

Global Studies: Latin America

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Author

Paul B. Goodwin

ISBN #

0697392910

Latin America

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Author

Paul B. Goodwin

ISBN #

0879674733

An Introduction to the Physics of Nuclear Medicine

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Author

Paul N. Goodwin

ISBN #

0398035695

Global Studies Latin America

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Author

Paul Goodwin

ISBN #

0072365862

Forecasting with Judgment

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Author

Paul Goodwin

ISBN #

0470859393

Decision Analysis for Management Judgment

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Author

Paul Goodwin

ISBN #

0470861088

Us Patents

Active Cooling Methods And Apparatus For Modules

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US Patent:
7289327, Oct 30, 2007
Filed:
Feb 27, 2006
Appl. No.:
11/364489
Inventors:
Paul Goodwin - Austin TX, US
Assignee:
Stakick Group L.P. - Austin TX
International Classification:
H05K 7/20
F28D 15/00
US Classification:
361701, 361699, 361702, 361749, 165 804, 16510433
Abstract:
A circuit module that includes a system for reducing thermal variation and cooling the circuit module. In preferred embodiments, the module includes a thermally-conductive rigid substrate having first and second lateral sides, an edge, and an integrated cooling component. The integrated cooling component reduces thermal variation and cools the circuit module. Flex circuitry populated with a plurality of ICs and exhibiting a connective facility that comprises plural contacts for use with an edge connector is wrapped about the edge of the thermally-conductive substrate. Heat from the plurality of ICs is thermally-conducted by the thermally-conductive substrate to the integrated cooling component.

Inverted Csp Stacking System And Method

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US Patent:
7309914, Dec 18, 2007
Filed:
Jan 20, 2005
Appl. No.:
11/039615
Inventors:
Paul Goodwin - Austin TX, US
Assignee:
Staktek Group L.P. - Austin TX
International Classification:
H01L 23/02
H01L 23/48
H01L 23/52
US Classification:
257686, 257777, 257702, 257E23177
Abstract:
Two or more integrated circuits are stacked into a high density circuit module. The lower IC is inverted. Electrical connection to the integrated circuits is made by module contacts on a flexible circuit extending along the lower portion of the module. In one embodiment, the flexible circuit provides a balanced electrical connection to two CSP integrated circuits. In another embodiment, the flexible circuit provides a balanced electrical connection to inter-flex contacts of additional flexible circuits on two submodules. The additional flexible circuits provide further balanced connections to CSP integrated circuits in each submodule.

High Capacity Thin Module System And Method

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US Patent:
7324352, Jan 29, 2008
Filed:
Mar 1, 2005
Appl. No.:
11/068688
Inventors:
Paul Goodwin - Austin TX, US
Assignee:
Staktek Group L.P. - Austin TX
International Classification:
H05K 1/11
US Classification:
361803, 361749, 174254, 174268, 257668, 257686, 257723, 257726, 257737
Abstract:
Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two or more conductive layers, and may have changes in the layered structure or have split layers.

Die Module System

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US Patent:
7423885, Sep 9, 2008
Filed:
Jun 21, 2005
Appl. No.:
11/157565
Inventors:
James W. Cady - Austin TX, US
Paul Goodwin - Austin TX, US
Assignee:
Entorian Technologies, LP - Austin TX
International Classification:
H05K 1/11
H05K 1/14
US Classification:
361803, 361780, 361785, 361749, 174254
Abstract:
A flex circuit is populated on one or both sides with plural integrated circuit die. In a preferred mode, the flex circuit is populated with flip-chip die. One side of the flex circuit has a connective facility implemented in a preferred mode with edge connector contacts. The flex circuit is disposed about a substrate to form a circuit module that may be inserted into an edge connector such as ones typically found on a computer board.

High Capacity Thin Module System

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US Patent:
7443023, Oct 28, 2008
Filed:
Sep 21, 2005
Appl. No.:
11/231418
Inventors:
James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US
Assignee:
Entorian Technologies, LP - Austin TX
International Classification:
H01L 23/34
H01L 21/00
H05K 7/20
US Classification:
257707, 257713, 257717, 257720, 257730, 361704, 361709, 361718, 361749, 438122
Abstract:
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Circuit Module With Thermal Casing Systems

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US Patent:
7446410, Nov 4, 2008
Filed:
Nov 18, 2005
Appl. No.:
11/283355
Inventors:
James Wilder - Austin TX, US
Mark Wolfe - Round Rock TX, US
Paul Goodwin - Austin TX, US
Assignee:
Entorian Technologies, LP - Austin TX
International Classification:
H01L 23/34
H01L 21/00
H05K 7/20
US Classification:
257707, 257713, 257717, 257720, 257730, 361704, 361709, 361718, 361749, 438122
Abstract:
Flexible circuitry is populated with integrated circuitry (ICs) disposed along one or both of major sides. Contacts are distributed along the flexible circuitry to provide connection between the module and an application environment. The populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or more layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally-conductive materials and one or more thermal spreaders are disposed in thermal contact with at least some of the constituent integrated circuitry of the module. Optionally, as an additional thermal management feature, the module may include a high thermal conductivity thermal sink or area that is disposed proximal to higher thermal energy IC devices. In preferred embodiments, extensions from the substrate body or substrate core encourage reduced thermal variations amongst the ICs of the module while providing an enlarged surface for shedding thermal energy from the module.

High Capacity Thin Module System

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US Patent:
7459784, Dec 2, 2008
Filed:
Dec 20, 2007
Appl. No.:
11/961477
Inventors:
James Wilder - Austin TX, US
Paul Goodwin - Austin TX, US
Mark Wolfe - Round Rock TX, US
Assignee:
Entorian Technologies, LP - Austin TX
International Classification:
H01L 23/34
H01L 21/00
H05K 7/20
US Classification:
257707, 257713, 257717, 257724, 257730, 257E23101, 361709, 361717, 361719, 361749, 438122
Abstract:
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

Stackable Micropackages And Stacked Modules

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US Patent:
7468553, Dec 23, 2008
Filed:
Mar 6, 2007
Appl. No.:
11/682643
Inventors:
Leland Szewerenko - Austin TX, US
Paul Goodwin - Austin TX, US
Assignee:
Entorian Technologies, LP - Austin TX
International Classification:
H01L 23/02
US Classification:
257686, 257E2318
Abstract:
The present invention provides a system and method for devising stackable assemblies that may be then stacked to create a stacked circuit module. One or more integrated circuit (IC) die are disposed on one or more sides of a redistribution substrate that is preferably flexible circuitry. In some preferred embodiments, the die and redistribution substrate are bonded together and wire-bond connected. Two or more stackable assemblies are interconnected through frame members to create low profile high density stacked circuit modules.

Wikipedia References

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Paul Goodwin

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Paul Goodwin (Cricketer)

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Paul Goodwin (Curator)

Control profile
Paul M Goodwin from Sayreville, NJ, age ~82 Get Report