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Max J Koschmeder

from Oronoco, MN
Age ~63
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Related to:
Jerry E Morgan, 61Charles Elwood Morgan, 92Kristine J Baltzer, 51Marlene J Koschmeder, 62Morgan C Koschmeder, 31
Connected to:
Kay W Koschnick, 85Melissa M Koschnitzke, 39Ralph A Koschnitzke, 57David J Koscho, 49Elizabeth A Koscho, 47Kate Koschoreck, 69Kevin M Koschoreck, 53Walter L Kosciak, 61Brian Koscianski, 39Halina A Koscianska, 69

Max Koschmeder Phones & Addresses

  • 10507 County Road 31, Oronoco, MN 55960 (507) 356-4212
  • Rochester, MN

Work

Company: Benchmark electronics, inc. Nov 1, 2009 Position: Mechanical development engineer

Education

Degree: Bachelors, Bachelor of Science School / High School: Iowa State University 1979 to 1983 Specialities: Mechanical Engineering

Skills

Design For Manufacturing • Mechanical Engineering • Manufacturing • Engineering • Product Design • Solidworks • Root Cause Analysis • Product Development • Failure Analysis • Manufacturing Engineering • Lean Manufacturing • Sheet Metal • Six Sigma • Process Improvement • Process Engineering • Pro Engineer • Inventor • Project Engineering • Mig Welding • Arc Welding • Resistance Welding • Vacuum Deposition • Pcb Design • Dependable Team Player • Business Process Improvement • Assembly • Robotics • Cost Reduction • Laser Engraving • Sputter Deposition

Languages

English • German

Industries

Mechanical Or Industrial Engineering

Resumes

Resumes

Max Koschmeder Photo 1

Mechanical Development Engineer

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Location:
Austin, MN
Industry:
Mechanical Or Industrial Engineering
Work:
Benchmark Electronics, Inc.
Mechanical Development Engineer
Ibm Dec 1, 1983 - Feb 1, 2009
Mechanical Development Engineer
Education:
Iowa State University 1979 - 1983
Bachelors, Bachelor of Science, Mechanical Engineering
Skills:
Design For Manufacturing
Mechanical Engineering
Manufacturing
Engineering
Product Design
Solidworks
Root Cause Analysis
Product Development
Failure Analysis
Manufacturing Engineering
Lean Manufacturing
Sheet Metal
Six Sigma
Process Improvement
Process Engineering
Pro Engineer
Inventor
Project Engineering
Mig Welding
Arc Welding
Resistance Welding
Vacuum Deposition
Pcb Design
Dependable Team Player
Business Process Improvement
Assembly
Robotics
Cost Reduction
Laser Engraving
Sputter Deposition
Languages:
English
German

Publications

Us Patents

Stacked Hole Formed Patterns For Shielding Through An Aperture

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US Patent:
7485813, Feb 3, 2009
Filed:
Mar 16, 2008
Appl. No.:
12/049339
Inventors:
Don Alan Gilliland - Rochester MN, US
Max John-Christopher Koschmeder - Oronoco MN, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 9/00
US Classification:
174383, 174382, 454184
Abstract:
In one embodiment, this invention is about stacking of sheeted material after cuts. The patterns on the separate sheets are aligned for cuts to create through-holes in the stack. The cut material is not removed but simply bent back to form walls for the hole. The materials are pierced and stacked to form holes. Any additional extended walls to the hole can be formed just by adding an additional layer. One embodiment may be just 2 walls that form a 90 degree angle with respect to one another. The extended walls can be slightly bent along their lengths in order to increase their strengths and to ensure their perpendicular standing on the layers. In other embodiments, the extended walls can be equipped with extra features, such as latches, to secure the adjacent extended walls and ensure a 90 degree angle between them.

Method And Apparatus For Grounding A Heat Sink In Thermal Contact With An Electronic Component Using A Grounding Spring Having Multiple-Jointed Spring Fingers

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US Patent:
20070097653, May 3, 2007
Filed:
Nov 3, 2005
Appl. No.:
11/266743
Inventors:
Don Gilliland - Rochester MN, US
Max John Koschmeder - Oronoco MN, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - ARMONK NY
International Classification:
H05K 7/20
US Classification:
361719000
Abstract:
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Method And Apparatus For Grounding A Heat Sink In Thermal Contact With An Electronic Component Using A Grounding Spring Having Multiple-Jointed Spring Fingers

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US Patent:
20080002367, Jan 3, 2008
Filed:
Sep 11, 2007
Appl. No.:
11/853418
Inventors:
Don Gilliland - Rochester MN, US
Max Koschmeder - Oronoco MN, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H05K 7/20
US Classification:
361709000
Abstract:
A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads.

Enhanced Hardware Arrangement For Mounting A Plurality Of Circuit Boards Together

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US Patent:
61099309, Aug 29, 2000
Filed:
Sep 8, 1998
Appl. No.:
9/149144
Inventors:
Max J. Koschmeder - Oronoco MN
James L. Peacock - Rochester MN
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 1200
US Classification:
439 74
Abstract:
An enhanced electrical arrangement for a computer includes a first circuit board, and a second circuit board arranged essentially parallel to the first circuit board. A removable array connector is positionable between the first circuit board and the second circuit board. The array connector causes the first circuit board to be in electrical communication with the second circuit board. A clamping arrangement is provided for urging the first circuit board and the second circuit board toward each other, so as to exert a force against the array connector and cause an electrical connection between the first circuit board and the second circuit board. The clamping arrangement includes a back-up plate positionable adjacent to a major surface of the second circuit board, and an arm pivotally connected to the back-up plate. The arm is pivotable to a closed position so that the arm is located adjacent to a major surface of, and presses against, the first circuit board, to urge the first circuit board and the second circuit board toward each other and exert the force against the array connector. Further, the arm is pivotable to an opened position whereby the force is no longer exerted.
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Max J Koschmeder from Oronoco, MN, age ~63 Get Report