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Martin P Plihal

from Conroe, TX
Age ~60
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Also known as:
Martin Ivana Plihal, Martin Tyana Plihal, Martin Plihalova, Martin Phihal, Plihal Martin, Martin L
Related to:
Ivana PlihalBrandon Plihal, 29Nicole Plihal, 33
Connected to:
Bonnie B Plikaytis, 69Heather A Plikerd, 49Milton D Plikerd, 91Amanda K Plilar, 49Darren C Pliler, 54Jeremy Pliler, 59Jessie G Pliler, 47Helen L Plimmer, 99Lori L Plimmer, 57Scott C Plimmer, 41

Martin Plihal Phones & Addresses

  • Conroe, TX
  • Trinity, FL
  • Surprise, AZ
  • 2728 Alpina Ct, Pleasanton, CA 94588 (925) 699-2422
  • 1794 Magnolia Cir, Pleasanton, CA 94566
  • Albuquerque, NM
  • Beaverton, OR
  • Germantown, MD
  • Gilbert, AZ
  • Rolesville, NC
  • Wade, NC
  • Alameda, CA

Publications

Us Patents

Detection Of Spatially Repeating Signatures

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US Patent:
7006886, Feb 28, 2006
Filed:
Jan 12, 2004
Appl. No.:
10/755546
Inventors:
Patrick Y. Huet - San Jose CA, US
Robinson Piramuthu - San Jose CA, US
Martin Plihal - Pleasanton CA, US
Assignee:
KLA Tencor-Technologies Corporation - Milpitas CA
International Classification:
G06F 19/00
US Classification:
700110, 438 16
Abstract:
A method for analyzing defects on a substrate, including inspecting the substrate to detect the defects, identifying the defects by location, analyzing the defects to detect extended objects, and analyzing the extended objects for repetition across the substrate. Thus, the present invention extends beyond the present analysis methods, by analyzing the extended objects for repetition across the substrate. In this manner, correlation with processing problems can be more readily detected, in cases where the individual defects themselves, of which the extended objects are formed, do not appear to have repeating properties.

Wafer Inspection Systems And Methods For Analyzing Inspection Data

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US Patent:
7227628, Jun 5, 2007
Filed:
Oct 12, 2004
Appl. No.:
10/964585
Inventors:
Paul Sullivan - Campbell CA, US
George Kren - Los Altos Hills CA, US
Eliezer Rosengaus - Palo Alto CA, US
Patrick Huet - San Jose CA, US
Robinson Piramuthu - San Jose CA, US
Martin Plihal - Pleasanton CA, US
Yan Xiong - Sunnyvale CA, US
Assignee:
KLA-Tencor Technologies Corp. - Milpitas CA
International Classification:
G01N 21/88
G06K 9/00
US Classification:
3562374, 3562372, 382145, 25055946
Abstract:
Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

Process Excursion Detection

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US Patent:
7394534, Jul 1, 2008
Filed:
Nov 19, 2003
Appl. No.:
10/717403
Inventors:
Patrick Y. Huet - San Jose CA, US
Robinson Piramuthu - San Jose CA, US
Martin Plihal - Pleasanton CA, US
Christopher W. Lee - San Ramon CA, US
Cho H. Teh - Cupertino CA, US
Yan Xiong - Sunnyvale CA, US
Assignee:
KLA-Tencor Corporation - San Jose CA
International Classification:
G01N 21/00
US Classification:
3562374, 3562375
Abstract:
A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

Wafer Inspection Systems And Methods For Analyzing Inspection Data

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US Patent:
7417724, Aug 26, 2008
Filed:
May 10, 2007
Appl. No.:
11/746884
Inventors:
Paul Sullivan - Campbell CA, US
George Kren - Los Altos Hills CA, US
Eliezer Rosengaus - Palo Alto CA, US
Patrick Huet - San Jose CA, US
Robinson Piramuthu - San Jose CA, US
Martin Plihal - Pleasanton CA, US
Yan Xiong - Sunnyvale CA, US
Assignee:
KLA-Tencor Technologies Corp. - Milpitas CA
International Classification:
G01N 21/88
G06K 9/00
US Classification:
3562372, 3562374, 25055945, 382145
Abstract:
Wafer inspection systems and methods are provided. One inspection system includes a module measurement cell coupled to a host inspection system by a wafer handler. The module measurement cell is configured to inspect a wafer using one or more modes prior to inspection of the wafer by the host inspection system. The one or more modes include backside inspection, edge inspection, frontside macro defect inspection, or a combination thereof. Another inspection system includes two or more low resolution electronic sensors arranged at multiple viewing angles. The sensors are configured to detect light returned from a wafer substantially simultaneously. A method for analyzing inspection data includes selecting a template corresponding to a support device that contacts a backside of a wafer prior to inspection of the backside of the wafer. The method also includes subtracting data representing the template from inspection data generated by inspection of the backside of the wafer.

Methods And Systems For Generating An Inspection Process For An Inspection System

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US Patent:
7570797, Aug 4, 2009
Filed:
May 10, 2005
Appl. No.:
11/125429
Inventors:
David Wang - Sunnyvale CA, US
Patrick Huet - San Jose CA, US
Tong Huang - Sunnyvale CA, US
Martin Plihal - Pleasanton CA, US
Adam Chien-Huei Chen - San Jose CA, US
Mike Van Riet - Morgan Hill CA, US
Stewart Hill - San Jose CA, US
Assignee:
KLA-Tencor Technologies Corp. - Milpitas CA
International Classification:
G06K 9/00
US Classification:
382145, 25055945, 3562374, 3562375, 382143, 382144, 702 83
Abstract:
Methods and systems for generating an inspection process for an inspection system are provided. One computer implemented method includes generating inspection data for a selected defect on a specimen at different values of one or more image acquisition parameters of the inspection system. The method also includes determining which of the different values produces the best inspection data for the selected defect. In addition, the method includes selecting the different values determined to produce the best inspection data as values of the one or more image acquisition parameters to be used for the inspection process.

Process Excursion Detection

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US Patent:
7646476, Jan 12, 2010
Filed:
May 9, 2008
Appl. No.:
12/117823
Inventors:
Patrick Y. Huet - San Jose CA, US
Robinson Piramuthu - San Jose CA, US
Martin Plihal - Pleasanton CA, US
Christopher W. Lee - San Ramon CA, US
Cho H. Teh - Cupertino CA, US
Yan Xiong - Sunnyvale CA, US
Assignee:
KLA-Tencor Corporation - Milpitas CA
International Classification:
G01N 21/00
US Classification:
3562374, 3562375
Abstract:
A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.

Multi-Scale Classification Of Defects

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US Patent:
8165837, Apr 24, 2012
Filed:
Jun 5, 2009
Appl. No.:
12/478844
Inventors:
Saravanan Paramasivam - Rajakilpakkam, IN
Patrick Y. Huet - San Jose CA, US
Martin Plihal - Pleasanton CA, US
Luc Debarge - Dresden, DE
Assignee:
KLA-Tencor Corporation - Milpitas CA
International Classification:
G01N 37/00
US Classification:
702 82, 702 83
Abstract:
A computerized method for categorizing defects on a substrate. A list of defects on the substrate is received as input to a processor, where each defect is represented by a defect location and an associated micro-defect code. The input is analyzed with the processor to detect spatial clusters of defects on the substrate. The spatial clusters are analyzed with the processor to determine which of the spatial clusters represent known macro-defects and which of the spatial clusters represent unknown macro-defects. The micro-defect code associated with each defect that is included in one of the spatial clusters that is determined to be a known macro-defect is changed with the processor with a macro-defect code that is associated solely with the known macro-defect. The processor analyzes the defects that are included in one of the spatial clusters that is determined to be an unknown macro-defect to determine a predominantly occurring micro-defect code. The processor changes the micro-defect code associated with each defect that is included in the one spatial cluster that is determined to be an unknown macro-defect with the predominantly-occurring micro-defect code.

Process Excursion Detection

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US Patent:
8289510, Oct 16, 2012
Filed:
Feb 10, 2011
Appl. No.:
13/024471
Inventors:
Patrick Y. Huet - San Jose CA, US
Robinson Piramuthu - San Jose CA, US
Martin Plihal - Pleasanton CA, US
Christopher W. Lee - San Ramon CA, US
Cho H. Teh - Cupertino CA, US
Yan Xiong - Sunnyvale CA, US
Assignee:
KLA-Tencor Corporation - Milpitas CA
International Classification:
G01N 21/00
US Classification:
3562375
Abstract:
A method for analyzing defect information on a substrate, including logically dividing the substrate into zones, and detecting defects on the substrate to produce the defect information. The defect information from the substrate is analyzed on a zone by zone basis to produce defect level classifications for the defects within each zone. The zonal defect level classifications are analyzed according to at least one analysis method. The defect level classifications are preferably selected from a group of defect level classifications that is specified by a recipe. Preferably, the at least one analysis method includes at least one of zonal defect distribution, automatic defect classification, spatial signature analysis, and excursion detection. The defect level classifications preferably include at least one of individual defect, defect cluster, and spatial signature analysis signature. In one embodiment the defect information is logically divided into configurable zones after the defects on the substrate have been detected.
Control profile
Martin P Plihal from Conroe, TX, age ~60 Get Report