Louis Zakraysek

48761206, Oct 24, 1989

Apr 21, 1987

7/040981

Robert E. Belke - Clay NY
Louis Zakraysek - Cicero NY
Walter O. Pillar - New Hartford NY

General Electric Company - Coshocton OH

C09K 1900
B32B 1504
H01B 500
H05K 100

428 1

Disclosed are improved laminates useful in the manufacture of multi-layer printed wiring boards (MLPWB) and laminates. Such improved composites contain at least one layer which is formed from a liquid crystal polymer selected from the group consisting of poly(para-phenylene benzobisthiazole), poly(paraphenylene benzobisoxazole), poly(2,5-benzothiazole), poly(2,5-benzoxazole), and mixtures thereof. The presently preferred liquid crystal polymer comprises poly(para-phenylene benzobisthiazole). The negative coefficient of thermal expansion and high modulus of elasticity of the liquid crystal polymers enable a laminate and MLPWB to be manufactured therefrom having a tailored coefficient of thermal expansion, broadly ranging from about 0 to 15 ppm/. degree. C. MLPWBs constructed of polymeric core layers also are possible utilizing the preferred liquid crystal polymers of the present invention.

48067040, Feb 21, 1989

Jun 8, 1987

7/059030

Robert E. Belke - Clay NY
George F. Trojanowski - Baldwinsville NY
Louis Zakraysek - Cicero NY

General Electric Company - Syracuse NY

H01L 2306

174 524

The invention relates to a metal matrix composite used to support and/or enclose discrete electronic semiconductor devices, monolithic integrated circuits, hybrid circuits, and multi-layer printed wiring boards. The matrices herein disclosed employ aluminum as the matrix with Beta Eucryptite as the additive in a volume percent of up to 60. The preferred range of from 55 to 45 percent by volume of the additive has a coefficient of thermal expansion matching the common semiconductor materials and common ceramics used for electronic enclosures. The composite uses low cost materials, and due to the affinity of the additive to aluminum is easily prepared. The resulting structures have good thermal conductivity and low weight.

46791221, Jul 7, 1987

Jul 11, 1986

6/886751

Robert E. Belke - Clay NY
Raymond A. Shirk - North Syracuse NY
Hsiu H. Lin - Syracuse NY
Louis Zakraysek - Cicero NY

General Electric Company - Syracuse NY

H05K 105

361414

A novel metal core printed circuit board and a method of making it are described. The circuit board comprises a metal substrate, a patternable metal foil, and an insulating layer of thermoplastic resin whose glass transition temperature is exceeded during assembly under pressure to bond the resin to the metal substrate and to the foil by high temperature wetting. The circuit board also provides holes whose interior is lined with a resin united fusing to the resin in the insulating layer by high temperature wetting accompanied by pressure. The thermoplastic resin is a polyetherimide engineering plastic. The layers of the printed circuit board described above, including any additional layers of insulating resin and foil, may be bonded in a single step in a laminating press. The finished circuit board may be a structural component of a chassis, has good heat conductivity, good high voltage performance, is practical for high frequency transmission paths, is tolerant of the high temperature necessary for soldering, and has a high continuous service temperature.