Search

Kai Feng

from Rego Park, NY
Age ~38
Get Report
Related to:
Miao H Feng, 53Yuehua Feng, 48Ah Lee Foo Shi
Connected to:
Adrian C Feng, 36Angeline E Feng, 35Benjamin B Feng, 74Bin Feng, 47Chengcheng Feng, 36Chien Feng, 62Chih L Feng, 55Christine Y Feng, 71Chung W Feng, 69Cijian Feng, 41

Kai Feng Phones & Addresses

  • Rego Park, NY
  • Bridgeport, CT
  • Hackensack, NJ

Resumes

Resumes

Kai Feng Photo 1

Kai Feng

View page
Kai Feng Photo 2

Kai Feng

View page
Kai Feng Photo 3

Kai Feng Ithaca, NY

View page
Work:
Shopcube
New York, NY
Sep 2013 to May 2014
Full-time Intern
China Construction Bank
Jiaxing, CN
Jul 2012 to Aug 2012
Finance Intern, Investment Banking and International Trading Department
Hangzhou Xinye Bottle Cap Co., Ltd
Hangzhou, CN
Jun 2010 to Aug 2010
Summer Intern, Sales and Supply Department
University of Wisconsin
Madison, WI
Sep 2009 to Feb 2010
Campus Organization Intern
Education:
Cornell University, School of Operations Research and Information Engineering
Ithaca, NY
Sep 2014
Master of Engineering in Financial Engineering
University of Wisconsin-Madison, School of Business
Madison, WI
May 2013
Bachelor of Business Administration in Finance, Investment and Banking
Kai Feng Photo 4

Kai Feng

View page
Work:
Performance Polymer, Dupont China Holding Company Limited

Jul 2009 to 2000
Operations Manager
DCSE, Dupont China Holding Company Limited

Aug 2008 to Jul 2009
Operations Manager
Kodak (China) Investment Company Limited

Nov 2003 to Jun 2008
PCB Technical Manager, China NDT Product Manager
Sensitizing Department, Kodak (China) Company Limited Shantou Branch

Jun 1998 to Oct 2003
Manager
USD for KCCL Shantou Branch

2001 to 2001
Hyundai Corporation Shantou Office

Aug 1997 to Jun 1998
Sales Executive & Technical Support
Shantou S.E.Z Ronghua Copper Company
Shantou, CN
Oct 1994 to Jul 1997
Supervisor
Beijing Copper Factory

Jul 1993 to Sep 1994
Assistant Engineer, Analysis Laboratory
Education:
Hong Kong University of Science and Technology
2010 to 2012
MBA
Australian Institute of Management
Mar 2003 to Jun 2003
Management Training
Australia Kangan Batman TAFE Business English
May 2003
Central South University of Technology
1989 to 1993
Bachelor in Analysis Chemistry

Publications

Wikipedia References

Kai Feng Photo 5

Kai Z. Feng

Us Patents

Package Integrated Soft Magnetic Film For Improvement In On-Chip Inductor Performance

View page
US Patent:
8338920, Dec 25, 2012
Filed:
May 8, 2007
Appl. No.:
11/690682
Inventors:
John Michael Cotte - New Fairfield CT, US
Hanyi Ding - Essex Junction VT, US
Kai Di Feng - Hopewell Junction NY, US
Zhong-Xiang He - Essex Junction VT, US
Nils D. Hoivik - Pleasantville NY, US
Xuefeng Liu - South Burlington VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23/552
US Classification:
257659, 257700, 257E33056, 438106
Abstract:
An integrated circuit package includes an integrated circuit with one or more on-chip inductors. A package cover covers the integrated circuit. A magnetic material is provided between the integrated circuit and the package cover. The magnetic material may be a soft magnetic thin film. The magnetic material may be affixed to the package cover by an adhesive. The magnetic material may be formed directly on the package cover by one of deposition, sputtering or spraying. The magnetic material may be affixed to the integrated circuit.

Leakage Sensor And Switch Device For Deep-Trench Capacitor Array

View page
US Patent:
8351166, Jan 8, 2013
Filed:
Jul 24, 2009
Appl. No.:
12/508665
Inventors:
Howard H. Chen - Yorktown Heights NY, US
Kai D. Feng - Hopewell Junction NY, US
Louis L. Hsu - Fishkill NY, US
Seongwon Kim - Old Tappan NJ, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01G 7/16
G01R 31/12
US Classification:
361 15, 3613011, 324548, 324522
Abstract:
A high-density deep trench capacitor array with a plurality of leakage sensors and switch devices. Each capacitor array further comprises a plurality of sub-arrays, wherein the leakage in each sub-array is independently controlled by a sensor and switch unit. The leakage sensor comprises a current mirror, a transimpedance amplifier, a voltage comparator, and a timer. If excessive leakage current is detected, the switch unit will automatically disconnect the leaky capacitor module to reduce stand-by power and improve yield. An optional solid-state resistor can be formed on top of the deep trench capacitor array to increase the temperature and speed up the leakage screening process.

Narrow-Band Wide-Range Frequency Modulation Continuous Wave (Fmcw) Radar System

View page
US Patent:
8416121, Apr 9, 2013
Filed:
Dec 8, 2010
Appl. No.:
12/963314
Inventors:
Howard H. Chen - Yorktown Heights NY, US
Kai D. Feng - Hopewell Junction NY, US
Duixian Liu - Yorktown Heights NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01S 7/28
US Classification:
342 70, 342103, 342128, 342196
Abstract:
A frequency modulation continuous wave (FMCW) system includes a first memory receiving a clock signal and storing voltage digital values of I FMCW signals, a second memory receiving the clock signal and storing the voltage digital values of the Q FMCW signals, a first digital-to-analog converter (DAC) connected to the first memory and receiving the clock signal for converting the voltage digital values of the I FMCW signal to a first analog voltage, a second digital-to-analog converter (DAC) connected to the second memory and receiving the clock signal for converting the voltage digital values of the Q FMCW signal to a second analog voltage, an I low-pass filter connected to the first DAC smoothing the I FMCW signal and a Q low-pass filter connected to the second DAC smoothing the Q FMCW signal.
Control profile
Kai Feng from Rego Park, NY, age ~38 Get Report