Search

Bin Feng

from Oak Park, CA
Age ~47
Get Report
Also known as:
Bin Fong, Bin Feg
Phone and address:
5176 Evanwood Ave, Calabasas, CA 91377
(818) 588-5918
Related to:
Song Lin, 50Lin C Song, 50
Connected to:
Adrian C Feng, 36Angeline E Feng, 35Benjamin B Feng, 74Chengcheng Feng, 36Chien Feng, 62Chih L Feng, 55Christine Y Feng, 71Chung W Feng, 69Cijian Feng, 41Dazeng Feng, 59

Bin Feng Phones & Addresses

  • 5176 Evanwood Ave, Oak Park, CA 91377 (818) 588-5918
  • Agoura Hills, CA
  • Dulzura, CA
  • Temecula, CA
  • Thousand Oaks, CA
  • Woodland Hills, CA
  • San Diego, CA
  • La Jolla, CA
  • Ventura, CA
  • Playa Vista, CA
  • 5176 Evanwood Ave, Oak Park, CA 91377

Work

Company: Parker hannifin, china Mar 2012 Position: Sales manager & product support manager

Education

School / High School: University of California- San Diego, CA 2002 Specialities: Master of Science in Electrical and Computer Engineering

Resumes

Resumes

Bin Feng Photo 1

Independent Arts And Crafts Professional

View page
Location:
Greater Los Angeles Area
Industry:
Arts and Crafts
Bin Feng Photo 2

Co-Founder And Chief Executive Officer

View page
Location:
5176 Evanwood Ave, Oak Park, CA 91377
Industry:
Electrical/Electronic Manufacturing
Work:
Leadgo America Oct 2013 - Sep 2015
General Sales Manager
Parker Hannifin Mar 2012 - Jul 2013
Sales Manager and Product Support Manager
Microduino Mar 2012 - Jul 2013
Co-Founder and Chief Executive Officer
Da/Pro Dec 2006 - Mar 2012
Engineering Sales and Account Manager
General Photonics | Your Partner In Innovation Jan 2006 - Nov 2006
Applications and Sales Engineer
Education:
Uc San Diego 2002 - 2005
Master of Science, Masters, Electrical Engineering, Applied Physics Fudan University 1996 - 2000
Bachelors, Bachelor of Science, Materials Science
Skills:
New Business Development
Manufacturing
Product Development
Cross Functional Team Leadership
Business Development
Semiconductors
Product Management
Management
Engineering Sales
Marketing
Project Management
Marketing Strategy
Continuous Improvement
Sensors
Erp
Engineering
R&D
Strategic Leadership
Global Business Development
Organizational Development
High Performance Teams
Rubber and Plastics Molding
Optics
Nanotechnology
Solar Energy
Languages:
English
Mandarin
Bin Feng Photo 3

Manager Director

View page
Work:
Usi Chemical America
Manager Director
Education:
Anhui College of Traditional Chinese Medicine
Bin Feng Photo 4

Bin Feng

View page
Bin Feng Photo 5

Bin Feng Oak Park, CA

View page
Work:
Parker Hannifin, China

Mar 2012 to Jul 2013
Sales Manager & Product Support Manager
Da/Pro Rubber, Inc

Dec 2006 to Mar 2012
Sales Engineer
General Photonics
Chino, CA
Jan 2006 to Nov 2006
Applications/Sales Engineer
Education:
University of California
San Diego, CA
2002 to 2005
Master of Science in Electrical and Computer Engineering
Fudan University
1996 to 2000
Bachelor of Science in Materials Science

Publications

Us Patents

Use Of Emt Gene Signatures In Cancer Drug Discovery, Diagnostics, And Treatment

View page
US Patent:
20120302572, Nov 29, 2012
Filed:
Apr 25, 2012
Appl. No.:
13/455972
Inventors:
Julie Kan - San Diego CA, US
Stuart Thomson - Port Washington NY, US
Gretchen M. Argast - Farmingdale NY, US
Matthew E. O'Connor - Massapequa Park NY, US
Murray Robinson - Boston MA, US
Bin Feng - North Reading MA, US
Joerg Heyer - Newton MA, US
Maria I. Chiu - Newton Centre MA, US
Richard Nicoletti - South Borough MA, US
Assignee:
AVEO PHARMACEUTICALS, INC. - Cambridge MA
OSI Pharmaceuticals, LLC - Farmingdale NY
International Classification:
A61K 31/517
A61P 35/00
C40B 30/04
A61K 31/4985
US Classification:
514249, 5142664, 506 9
Abstract:
The present invention provides diagnostic methods for assessing the EMT status of tumor cells, and for predicting the effectiveness of treatment of a cancer patient with an EGFR or IGF-1R kinase inhibitor, utilizing an EMT gene signature index score. The present invention further provides methods for treating patients with cancer that incorporate these methods.

Apparatus And Method For Smart Sand Table Demonstration

View page
US Patent:
20180247568, Aug 30, 2018
Filed:
Feb 26, 2018
Appl. No.:
15/905493
Inventors:
- Westlake Village CA, US
- Beijing, CN
Xi LI - Beijing, CN
Kejia PAN - Beijing, CN
Bin FENG - Westlake Village CA, US
International Classification:
G09B 29/12
Abstract:
Apparatus and method for smart sand table demonstration are provided. The demonstration apparatus includes: a sand table base, a sensor device, a demonstration device and a controller. The sensor device is placed on the sand table base which is also used as a demonstration carrier for the demonstration device. The sensor device includes a sensor module and a first wireless communication module, for monitoring a status of the sensor module and transmit the status information to the controller through a wireless connection. The controller determines demonstration information based at least one of smart demonstration project information and the status information, and transmits the demonstration information to the demonstration device. The demonstration device analyzes the received demonstration information and performs demonstration actions.

Networking Core Device, Wireless Networking Method, And Intelligent Network System, Based On Electronic Module

View page
US Patent:
20180192454, Jul 5, 2018
Filed:
Jan 2, 2018
Appl. No.:
15/859914
Inventors:
- Westlake Village CA, US
- Beijing, CN
Zhenshan WANG - Beijing, CN
Bin FENG - Westlake Village CA, US
International Classification:
H04W 76/10
H04L 12/24
Abstract:
A networking core device, a wireless networking method and an intelligent network system, based on an electronic module are provided. The networking core device includes a function-module processor configured to identify and control at least one functional electronic module electrically connected to the networking core device; an in-group networking member configured to establish a wireless connection between the networking core device and at least one other networking core device based on a first communication protocol; and a controller configured to establish a connection between the networking core device and an intelligent terminal based on a second communication protocol, and receive and process a control signal of the intelligent terminal.

Electrical Modules And Modular Electronic Building Systems

View page
US Patent:
20170150631, May 25, 2017
Filed:
Mar 10, 2016
Appl. No.:
15/066903
Inventors:
- Westlake Village CA, US
- Beijing, CN
ZHENSHAN WANG - Westlake Village CA, US
XI LI - Westlake Village CA, US
BIN FENG - Westlake Village CA, US
International Classification:
H05K 7/02
Abstract:
The present disclosure provides an electrical module and a modular building system including electrical modules. The electrical module includes a housing member including N pin portions and a connecting portion that connects the N pin portions, where N is greater than 1; N conduction members unconnected with each other; and N magnetic members. Each pin portion is a plate having a through-hole towards its thickness direction, and corresponds to one conduction member and one magnetic member. Each conduction member includes: a first part electrically connected with a lead of an electrical component; and a second part electrically connected with the corresponding magnetic member. Each magnetic member fills the through-hole of the corresponding pin portion, and establishes magnetic connection with a magnetic member of another electrical module in thickness direction to allow the two electrical modules to contact and rotate against each other using a contacting point as a rotation pivot.

Electrical Modules And Modular Electronic Building Systems

View page
US Patent:
20160249478, Aug 25, 2016
Filed:
May 26, 2015
Appl. No.:
14/721341
Inventors:
- Oak Park CA, US
- Beijing, CN
BIN FENG - Oak Park CA, US
International Classification:
H05K 7/14
Abstract:
The present disclosure provides an electrical module and a modular electrical building system including electrical modules. The electrical module includes a printed circuit board (PCB), a housing member, one or more magnets, and one or more inter-locking parts. The PCB has a top surface, a bottom surface, and opposite sides between the top surface and the bottom surface. The housing member is attached to each side of two opposite sides of the PCB and includes an opening in a bottom surface. The magnets are arranged within the housing member and are capably of magnetically attaching the electrical module to another electrical module. Each inter-locking part is configured to pass through the housing member on each side of the PCB. Each inter-locking part has a protrusion extending from a top surface of the housing member and is exposed to the opening in the bottom surface of the housing member.
Control profile
Bin Feng from Oak Park, CA, age ~47 Get Report