Inventors:
Louis Regniere - Boca Raton FL, US
Yakub Aliyu - Palm Beach Gardens FL, US
Rainer M. Schmitt - Palm Beach Gardens FL, US
Theodore M. Johnson - Palm Beach FL, US
Ronald A. Kropp - West Palm Beach FL, US
Christian Liautaud - Boca Raton FL, US
Deda Diatezua - Wellington FL, US
Isaac R. Abothu - Wellington FL, US
De Liufu - Palm Beach Gardens FL, US
Richard Irving - Palm Beach Gardens FL, US
Patrick D. Brown - Lake Worth FL, US
Walter C. Mick - Wellington FL, US
William H. Tanubrata - Lane Park FL, US
Omid S. Jahromi - Playa Vista FL, US
John Boudreaux - Boca Raton FL, US
David B. Clarke - Palm Beach Gardens FL, US
Jack S. Chorpenning - Boynton Beach FL, US
Bryce M. Barbato - Jupiter FL, US
Honorio R. Ulep - Mesa AZ, US
Assignee:
Sonavation, Inc. - Palm Beach Gardens FL
International Classification:
C25D 5/02
Abstract:
Provided herein is a method of making an integrated circuit device using copper metallization on 1-3 PZT composite. The method includes providing an overlay of electroplated immersion of gold (Au) to cover copper metal traces, the overlay preventing oxidation on 1:3 PZT composite with material. Also included is the formation of immersion Au nickel electrodes on the 1-3 PZT composite to achieve pad metallization for external connections.