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Helga Foulk Phones & Addresses

  • Blue Bell, PA
  • Ambler, PA
  • Media, PA
  • Philadelphia, PA

Work

Company: Lockheed martin Position: Electronics engineering manager at lockheed martin

Skills

Embedded Systems • System Design • Aerospace • Systems Engineering • Engineering Management • Electronics • System Architecture • Security Clearance • Software Engineering • Requirements Management • Simulations • Systems Design • Dod • Space Systems • Earned Value Management • Program Management • Testing • Software Development

Industries

Defense & Space

Resumes

Resumes

Helga Foulk Photo 1

Electronics Engineering Manager At Lockheed Martin

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Location:
497 Electronics Pkwy, Liverpool, NY 13088
Industry:
Defense & Space
Work:
Lockheed Martin
Electronics Engineering Manager at Lockheed Martin
Skills:
Embedded Systems
System Design
Aerospace
Systems Engineering
Engineering Management
Electronics
System Architecture
Security Clearance
Software Engineering
Requirements Management
Simulations
Systems Design
Dod
Space Systems
Earned Value Management
Program Management
Testing
Software Development

Publications

Us Patents

Device For Coupling Drive Circuitry To Electroabsorption Modulator

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US Patent:
6836350, Dec 28, 2004
Filed:
Mar 5, 2004
Appl. No.:
10/793971
Inventors:
Prashant Singh - Eden Prairie MN
Helga Foulk - Ambler PA
Scott Redinger - Breinigsville PA
Todd Tanji - Eagan MN
Keith Maile - New Brighton MN
John Stronczer - Minneapolis MN
Assignee:
T-Networks, Inc. - Allentown PA
AMCC - San Diego CA
International Classification:
G02F 101
US Classification:
359240, 359245, 359246, 359248, 438718
Abstract:
Drive circuitry to provide a DC bias voltage and a high frequency modulation current to an electroabsorption modulator (EAM), including a high frequency modulation current source, a coupling capacitor, and a first DC lead. The drive circuitry may include termination circuitry. One lead of the high frequency modulation current source is electrically coupled to the first semiconductor type contact of the EAM and the other lead of the high frequency modulation current source is electrically coupled to an AC ground. The coupling capacitor includes a first electrode electrically coupled to the second semiconductor type contact of the EAM, a second electrode electrically coupled to the AC ground, and a dielectric layer between the electrodes. The first DC lead is electrically coupled to the EAM-side capacitor electrode and configured to be coupled to a first DC potential.

Device For Coupling Drive Circuitry To Electroabsorption Modulator

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US Patent:
20030090774, May 15, 2003
Filed:
Oct 22, 2002
Appl. No.:
10/277290
Inventors:
Prashant Singh - Eden Prairie MN, US
Helga Foulk - Ambler PA, US
Scott Redinger - Breinigsville PA, US
Todd Tanji - Eagan MN, US
Keith Maile - New Brighton MN, US
John Stronczer - Minneapolis MN, US
International Classification:
G02F001/03
G02F001/07
US Classification:
359/248000
Abstract:
Drive circuitry to provide a DC bias voltage and a high frequency modulation current to an electroabsorption modulator (EAM), including a high frequency modulation current source, a coupling capacitor, and a first DC lead. The drive circuitry may include termination circuitry. One lead of the high frequency modulation current source is electrically coupled to the first semiconductor type contact of the EAM and the other lead of the high frequency modulation current source is electrically coupled to an AC ground. The coupling capacitor includes a first electrode electrically coupled to the second semiconductor type contact of the EAM, a second electrode electrically coupled to the AC ground, and a dielectric layer between the electrodes. The first DC lead is electrically coupled to the EAM-side capacitor electrode and configured to be coupled to a first DC potential.
Helga Talbot Foulk from Blue Bell, PA, age ~53 Get Report