Daniel J Stigliani

20040114859, Jun 17, 2004

Dec 17, 2002

10/321765

Evan Colgan - Chestnut Ridge NY, US
Fuad Doany - Katonah NY, US
Bruce Furman - Poughquag NY, US
Daniel Stigliani - Hopewell Junction NY, US

International Business Machines Corporation - Armonk NY

G02B006/26

385/031000

Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

20040241892, Dec 2, 2004

May 30, 2003

10/250050

Evan Colgan - Chestnut Ridge NY, US
Casimer DeCusatis - Poughkeepsie NY, US
Lawrence Jacobowitz - Wappingers Falls NY, US
Daniel Stigliani - Hopewell Junction NY, US

International Business Machines Corporation - Armonk NY

H01L021/00
H01L033/00

438/022000, 438/029000, 257/098000

An integrated optical transducer assembly includes a substrate and an optoelectronic array attached to the substrate. The optoelectronic array further includes a plurality of individual subunits bonded together to form a single array, with each of the subunits including a defined number of individual optoelectronic elements associated therewith. The elastomeric material maintains an original alignment between the plurality of subunits.

20050025434, Feb 3, 2005

Jul 31, 2003

10/631933

Alan Benner - Poughkeepsie NY, US
Evan Colgan - Chestnut Ridge NY, US
How Lin - Vestal NY, US
John Magerlein - Yorktown Heights NY, US
Frank Pompeo - Redding CT, US
Subhash Shinde - Cortlandt Manor NY, US
Daniel Stigliani - Hopewell Junction NY, US

International Business Machines Corporation - Armonk NY

G02B006/36

385088000

An optoelectronic assembly for a computer system includes an electronic chip(s), a substrate, an electrical signaling medium, an optoelectronic transducer, and an optical coupling guide. The electronic chip(s) is in communication with the substrate, which is in communication with a first end of the electrical signaling medium. A second end of the electrical signaling medium is in communication with the optoelectronic transducer, and includes the optical coupling guide for aligning an optical signaling medium with the optoelectronic transducer. An electrical signal from the electronic chip is communicated to the optoelectronic transducer via the substrate and the electrical signaling medium. The optical transducer and electronic chip(s) share a common heat spreader, and communication to other groups of electronic chip(s) is done without the need for communication via a second level electrical package.

20050058408, Mar 17, 2005

Sep 17, 2003

10/667234

Evan Colgan - Chestnut Ridge NY, US
Bruce Furman - Poughquag NY, US
Daniel Stigliani - Hopewell Junction NY, US

International Business Machines Corporation - Armonk NY

G02B006/43

385089000

An optoelectronic assembly for an electronic system includes a support electronic chip set configured for at least one of providing multiplexing, demultiplexing, coding, decoding and optoelectronic transducer driving and receive functions. A first substrate having a first surface and an opposite second surface is in communication with the support electronic chip set via the first surface while a second substrate is in communication with the second surface of the first substrate. The second substrate is configured for mounting at least one of data processing, data switching and data storage chips. An optoelectronic transducer is in signal communication with the support electronic chip set and an optical fiber array is aligned at a first end with the optoelectronic transducer and with an optical signaling medium at a second end. An electrical signal from the support electronic chip set is communicated to the optoelectronic transducer via an electrical signaling medium, and the support electronic chip set and the optoelectronic transducer share a common thermal path for cooling.

20050169597, Aug 4, 2005

Apr 1, 2005

11/096424

Evan Colgan - Chestnut Ridge NY, US
Fuad Doany - Katonah NY, US
Bruce Furman - Poughquag NY, US
Daniel Stigliani - Hopewell Junction NY, US

G02B006/00

385137000, 385039000

Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

20060221818, Oct 5, 2006

Mar 29, 2005

11/092033

Luiz Alves - Hopewell Junction NY, US
Daniel Casper - Poughkeepsie NY, US
Steven Glassen - Wallkill NY, US
Daniel Stigliani - Hopewell Junction NY, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - ARMONK NY

H04L 1/00

370217000, 370221000, 370242000

A system, method and storage medium for providing redundant I/O access between a plurality of interconnected processor nodes and I/O resources. The method includes determining whether a primary path between the interconnected processor nodes and the I/O resources is operational, where the primary path includes a first processor node and a primary multiplexer. If the primary path is operational, the transactions are routed via the primary path. If the primary path is not operational, the transactions are routed between the interconnected processor nodes and the I/O resources via an alternate path that includes a second processor node and an alternate multiplexer.

20070014527, Jan 18, 2007

Sep 21, 2006

11/524597

Evan Colgan - Chestnut Ridge NY, US
Fuad Doany - Katonah NY, US
Bruce Furman - Poughquag NY, US
Daniel Stigliani - Hopewell Junction NY, US

G02B 6/00

385137000, 385089000

Optical devices, components and methods for mounting optical fibers and for side-coupling light to/from optical fibers using a modified silicon V-groove, or silicon V-groove array, wherein V-grooves, which are designed for precisely aligning/spacing optical fibers, are “recessed” below the surface of the silicon. Optical fibers can be recessed below the surface of the silicon substrate such that a precisely controlled portion of the cladding layer extending above the silicon surface can be removed (lapped). With the cladding layer removed, the separation between the fiber core(s) and optoelectronic device(s) can be reduced resulting in improved optical coupling when the optical fiber silicon array is connected to, e.g., a VCSEL array.

20080256381, Oct 16, 2008

Apr 12, 2007

11/734334

Lawrence Jacobowitz - Wappingers Falls NY, US
Mark B. Ritter - Sherman CT, US
Daniel J. Stigliani - Hopewell Junction NY, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

G06F 1/06

713501

A method of and system for frequency clocking in a processor core are disclosed. In this system, at least one processor core is provided, and that at least one processor core has a clocking subsystem for generating an analog output clock signal at a variable frequency. Digital frequency control data and an analog signal are both transmitted to that at least one processor core; and that processor core uses the received analog signal and digital frequency control data to set the frequency of the output clock signal of the clocking subsystem. In a preferred implementation, multiple cores are asynchronously clocked and the core frequencies are independently set.