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Boris E Kesil

from Santa Clara, CA
Age ~65
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Also known as:
Boriss E Kesil, David Kesil, Doris Kesil, Boris Kesip
Related to:
Elizabeth G Hines, 42Elena Kesil, 61David Kesil, 43Michelle S Kesil, 27
Connected to:
Susan A Kesil, 50Ashley J Kesilewski, 33Edward Kesisian, 55Filippos Kesisoglou, 47Sebastian Keska, 43Tadeusz W Keska, 83Dhananjay V Keskar, 51Lisamarie H Keskar, 66Mandar R Keskar, 49Frederick Keske, 65

Boris Kesil Phones & Addresses

  • Santa Clara, CA
  • Encinitas, CA
  • 2194 Nimrick Ln, San Jose, CA 95124 (408) 356-2510
  • 5141 Ishimatsu Pl, San Jose, CA 95124 (408) 559-9360
  • 9 Saint Andrews Ct, Palm Coast, FL 32137
  • 7 Ibis Ct N, Palm Coast, FL 32137
  • Los Gatos, CA

Resumes

Resumes

Boris Kesil Photo 1

President

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Location:
Santa Clara, CA
Industry:
Semiconductors
Work:
Adem
President
Education:
South - West Industrial University, Ukraine 1975 - 1980
Master of Science, Masters, Design
Skills:
Engineering
Product Management
Manufacturing
Semiconductor Industry
Machining
Strategic Planning
Engineering Management
Product Development
Product Marketing
Semiconductors
Cross Functional Team Leadership
Electronics
Start Ups
Boris Kesil Photo 2

Mechanical Engineer

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Location:
Santa Clara, CA
Industry:
Mechanical Or Industrial Engineering
Work:
Boris Kesil
Mechanical Engineer
Boris Kesil Photo 3

Boris Kesil

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Location:
Santa Clara, CA
Industry:
Machinery
Boris Kesil Photo 4

Boris Kesil

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Business Records

Name / Title
Company / Classification
Phones & Addresses
Boris Kesil
Owner, President
Adem, LLC
Machine Shop · Mfg Industrial Machinery Engineering Services · Metal Restoration · All Other Miscellaneous General Purpose Machinery Manufactur · Machine Shops
1040 Di Giulio Ave, Santa Clara, CA 95050
(408) 727-8955, (408) 727-2055
Boris Kesil
President
Quartet Mechanics, Limited Liability Company
Design and Sales of Automation Equipment · Fire/Casualty Insurance Carrier
1040 Di Giulio Ave, Santa Clara, CA 95050
900 E Hamilton Ave, Campbell, CA 95008

Publications

Us Patents

Universal Electromagnetic Resonance System For Detecting And Measuring Local Non-Uniformities In Metal And Non-Metal Objects

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US Patent:
6801044, Oct 5, 2004
Filed:
Sep 5, 2003
Appl. No.:
10/654759
Inventors:
Boris Kesil - San Jose CA, 95124
Leonid Velikov - San Carlos CA, 94070
Yuri Vorobyev - San Carlos CA, 94070
International Classification:
G01R 2726
US Classification:
324663, 324662
Abstract:
A universal electromagnetic resonance system is aimed at detecting and measuring local non-uniformities in objects made from conductive or non-conductive materials. The system comprises a composite measuring unit composed of two identical and symmetrically arranged individual oscillation circuits with measurement elements in the form of identical and symmetrically arranged inductive coils or capacitor chips. The unit is connected to an impedance analyzer for supplying RF current and for measuring the voltage signal in the oscillation circuit. Since all the elements of individual oscillation circuits are identical, in the case of non-uniformity of the object on the scanned area, the parameters of the resonance will hanged. This change will violate the symmetry in the operation of the individual oscillation circuits. The variation in measured signal can be calibrated in terms of the target parameter or characteristic of the object.

Method And Apparatus For Measuring Thickness Of Thin Films With Improved Accuracy

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US Patent:
6815958, Nov 9, 2004
Filed:
Feb 7, 2003
Appl. No.:
10/359378
Inventors:
Boris Kesil - San Jose CA
Leonid Velikov - San Carlos CA
Yuri Vorobyev - San Carlos CA
Assignee:
Multimetrixs, LLC - Santa Clara CA
International Classification:
G01R 2726
US Classification:
324662, 324663
Abstract:
The invention relates to an apparatus and method for measuring thickness and deviations from the thickness of very thin conductive coatings on various non-conductive substrates, or of very thin non-conductive coatings on conductive substrates. The apparatus consists of an inductive coil having specific parameters, an external AC generator operating on frequencies, e. g. , from 50 MHz to 2. 5 GHz, preferably from 100 MHz to 200 MHz, and a measuring instrument, such as an oscilloscope, voltmeter, etc. for measuring output of the sensor. The coil has miniature dimensions. The invention is based on the principle that inductive coil of the sensor, active resistance of the coil winding, inherent capacitance of the inductive coil (or a separate capacitor built into the sensors circuit), and the aforementioned AC generator form a parallel oscillating circuit. The apparatus operates on very high resonance frequencies, preferably within the range of 100 to 200 MHz, at which a capacitive coupling is established between the coil of the oscillating circuit and the thin films being measured. By measuring the parameters of the resonance oscillating circuit, it becomes possible to measure film thickness below 500 Angstroms.

Method And Apparatus For Preventing Transfer Of An Object Having Wrong Dimensions Or Orientation

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US Patent:
6831287, Dec 14, 2004
Filed:
Oct 15, 2001
Appl. No.:
09/976890
Inventors:
Boris Kesil - San Jose CA
David Margulis - Campbell CA
Elik Gershenzon - Daly City CA
Assignee:
MultiMetrixs, LLC - Santa Clara CA
International Classification:
G01N 2186
US Classification:
2505593, 25055915, 356638
Abstract:
The invention describes an apparatus for preventing gripping of objects having wrong dimensions or orientation. The apparatus comprises a part handler, e. g. , a holder for parts to be treated in a chemical reactor, where the parts has to be transferred from a working position to a temporary storage. The holder may have different shapes, e. g. , rectangular, elliptical, or circular, and is provided with positioning openings or recesses for engagement with pins or semispherical elements on the engaging surface of the part handler. The apparatus is provided with at least two through beam optical sensor units with adjustable divergence of the light beams emitted from the light emitting to the light-receiving element. The sensor units are located near the edge area of the holder. Position of the holder for aligning with the part handler is determined by combined interaction of the holder edge with the sensor units so that, depending on overlapping of one or two sensors and on the position of the overlapped zone, the apparatus determines whether or not the holder is aligned with the part handler or the gripping operation has to be rejected.

Apparatus And Method For Multiple Identical Continuous Records Of Characteristics On The Surface Of An Object After Selected Stages Of Manufacture And Treatment

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US Patent:
6842025, Jan 11, 2005
Filed:
Oct 29, 2003
Appl. No.:
10/695173
Inventors:
Elik Gershenzon - Daly City CA, US
Boris Kesil - San Jose CA, US
Leonid Velikov - San Carlos CA, US
Yuri Vorobyev - San Carlos CA, US
Assignee:
MultiMetrixs L.L.C. - Santa Clara CA
International Classification:
G01R 3102
G01N 2100
US Classification:
324759, 356 73
Abstract:
An apparatus of the invention is intended for multiple identical continuous records of characteristics on the surface of an object, e. g. , a semiconductor wafer, after selected stages of manufacture and treatment. The apparatus is provided with a rotary table for rotation of the wafer with a mechanism for installing the wafer in a predetermined initial position for starting measurements from the same point after each selected stage of manufacture or treatment. The measurements are synchronized for all sequential manufacturing stages of the wafer and are carried out with the use of a resonance sensor based on the principles of resonance sensor technology. The recorded information is stored on a memory device, and if the final product has a defect or deviations, the stored information can be easily retrieved for revealing the time, place on the product, and the source of the defect. The same records can also be used for correlation between the defects or deviations and the failure of the final product on quality control and even during exploitation of the chip in a semiconductor device.

System And Method For Measuring Characteristics Of Materials With The Use Of A Composite Sensor

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US Patent:
6891380, May 10, 2005
Filed:
Jun 2, 2003
Appl. No.:
10/449892
Inventors:
Boris Kesil - San Jose CA, US
Leonid Velikov - San Carlos CA, US
Yuri Vorobyev - San Carlos CA, US
Assignee:
MultiMetrixs, LLC - Santa Clara CA
International Classification:
G01R027/04
G01R033/12
G01B007/06
US Classification:
324635, 324633, 324230
Abstract:
The system of the invention for measuring characteristics of thin conductive and non-conductive material, such as bulk material or films, is based on the use of a resonance oscillating circuit that incorporates at least two components selected from the group consisting of an inductive coil and a capacitor, which in combination form a sensor that could be approached close to the surface to be measured. The measurement of the film or material characteristics, such as film resistance (film thickness) or a dielectric constant (film thickness) of a non-conductive material, is based on the principle that the sensor is approached to the measured surface at a distance, at which the inductance and capacitance of the sensor generate in the measured material a virtual coil and an additional capacitance, which strongly depend on the characteristics of the measured material. As the sensor approached towards the surface to be measured, the sensor-material system generates a series of resonances having different values of power. One of these resonances can be defined as the so-called full resonance, which is characterized by the maximum value of the power, and hence provides the most accurate measurement and can be used for precisely determining the measurement distance.

Mapping Sensor System For Detecting Positions Of Flat Objects

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US Patent:
6900451, May 31, 2005
Filed:
Nov 8, 2001
Appl. No.:
10/007265
Inventors:
Boris Kesil - San Jose CA, US
David Margulis - Campbell CA, US
Elik Gershenzon - Daly CA, US
Assignee:
Multimextrixs, LLC - Santa Clara CA
International Classification:
G01N021/86
US Classification:
25055936, 25055912
Abstract:
The mapping sensor system of the invention is intended for use with a mechanical arm of an industrial robot which loads and unloads flat circular objects, such as semiconductor wafers, into and from wafer cassettes on operations of processing the semiconductor wafers in stand-alone or cluster machines used in semiconductor production. The mapping system consists of a light source, a light-receiving element, and a light beam shaper. The light source is installed on the front end of the robot arm and directs the light via the beam shaper to the leading edge of the semiconductor wafer. The beam reflected from the wafer edge is sensed by a light-receiving element, such as a photodiode. The shaper modifies the shape and the cross-section of the beam directed towards the wafer so as to provide reflection from the curvilinear surface of the edge, irrespective of the existence of the notch, most optimum for detection by the photodiodes and without generation of false signals. In one embodiment, the beam shaper contains a special objective with a cylindrical lens. In another embodiment, the beam shaper comprises an anamorphotic objective with an array of microlenses.

Method And Apparatus For Precision Measurement Of Film Thickness

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US Patent:
6989675, Jan 24, 2006
Filed:
Mar 13, 2003
Appl. No.:
10/386648
Inventors:
Boris Kesil - San Jose CA, US
Leonid Velikov - San Carlos CA, US
Yuri Vorobyev - San Carlos CA, US
Assignee:
MultiMetrixs LLC - Santa Clara CA
International Classification:
G01R 27/32
US Classification:
324636, 324644
Abstract:
An apparatus for measuring thickness in super-thin films consists of a special resonator unit in the form of an open-bottom cylinder which is connected to a microwave swept frequency microwave source via a decoupler and a matching unit installed in a waveguide that connects the resonator unit with the microwave source. The apparatus operates on the principle that thin metal film F, the thickness of which is to be measured, does not contact the end face of the open bottom of the cylindrical resonator sensor unit and functions as a bottom of the cylindrical body. The design of the resonator excludes generation of modes other than the resonance mode and provides the highest possible Q-factor. As the conductivity directly related to the film thickness, it is understood that measurement of the film thickness is reduced to measurement of the resonance peak amplitudes. This means that superhigh accuracy inherent in measurement of the resonance peaks is directly applicable to the measurement of the film thickness or film thickness deviations.

Precision Soft-Touch Gripping Mechanism For Flat Objects

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US Patent:
7140655, Nov 28, 2006
Filed:
Sep 4, 2001
Appl. No.:
09/944605
Inventors:
Boris Kesil - San Jose CA, US
David Margulis - Campbell CA, US
Elik Gershenzon - Daly CA, US
Assignee:
Multimetrixs LLC - Santa Clara CA
International Classification:
B66C 1/44
B65G 49/07
US Classification:
294104, 414941
Abstract:
A precision soft-touch gripping mechanism has a mounting plate attached to a robot arm. The plate supports a stepper motor. The output shaft of the stepper motor is connected through a spring to an elongated finger that slides in a central longitudinal slot of the plate and supports a first wafer gripping post, while on the end opposite to the first wafer gripping post the mounting plate pivotally supports two L-shaped fingers with a second and third wafer gripping posts on their respective ends. The mounting plate in combination with the first sliding finger and two pivotal fingers forms the end effector of the robot arm which is thin enough for insertion into a wafer-holding slot of a wafer cassette. The end effector is equipped with a mapping sensor for detecting the presence or absence of the preceding wafer, wafer position sensors for determining positions of the wafer with respect to the end effector, and force sensors for controlling the wafer gripping force. Several embodiments relate to different arrangements of gripping rollers and mechanisms for control of the gripping force and speed of gripping required for gripping the wafer with a soft and reliable touch.
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Boris E Kesil from Santa Clara, CA, age ~65 Get Report