US Patent:
20130070416, Mar 21, 2013
Inventors:
Samuel J. Adducci - Palos Heights IL, US
Andrzej Nicewicz - Glenview IL, US
Assignee:
PANDUIT CORP. - Tinley Park IL
International Classification:
H05K 7/20
Abstract:
A thermal management system for an electronic equipment enclosure is provided. The thermal management system includes an intake duct for routing cold air in the front of the electronic equipment enclosure to the side of electronic equipment enclosure and one or more blanking panels for separating cold air in the front of the electronic equipment enclosure and hot air in the back of the electronic enclosure, as needed, for example, depending on the configuration of the thermal management system and/or the electronic equipment enclosure. The intake duct includes a front cover, which acts as an additional blanking panel, when installed, changing the airflow pattern of the electronic equipment enclosure, for example, from side-to-side to front-to back.