Alice D Zitzmann

6475703, Nov 5, 2002

Dec 1, 1998

09/203148

Delin Li - Canton MI
Achyuta Achari - Canton MI
Alice Dawn Zitzmann - Belleville MI
Brenda Joyce Nation - Troy MI
Edward McLeskey - Waterford MI
Mohan R. Paruchuri - Canton MI
Lakhi Nandlal Goenka - Ann Arbor MI

Visteon Global Technologies, Inc. - Dearborn MI

G03C 556

430313, 430315, 430329, 216 15, 216 16, 216 20, 427404, 427405, 427471, 427532

A multilayer circuit board having air bridge crossover structures and an additive method for producing the same, wherein the circuit includes specially designed metallic fortifying layers to mechanically and/or electrically fortify the circuit.

57387974, Apr 14, 1998

May 17, 1996

8/649377

Robert E. Belke - West Bloomfield MI
Michael G. Todd - South Lyon MI
Andrew Z. Glovatsky - Ypsilanti MI
Alice D. Zitzmann - Dearborn MI

Ford Global Technologies, Inc. - Dearborn MI

B44C 122
C23F 100

216 16

A three dimensional multi-layer circuit structure is formed by partially etching a foil having a coating. A pre-circuit is formed by providing a metal foil, applying a photodefinable photoresist to each side of the metal foil, selectively exposing and developing the photoresist leaving exposed areas and unexposed areas and, plating the unexposed areas with a second metal. The pre-circuit is placed in an etching solution and removed after the etching solution partially etches the metal foil to undercut the second metal. The partially etched pre-circuit is then bent into a predetermined shape. The partially etched pre-circuit is then inserted into a mold cavity so that at least one surface of the circuit structure is adjacent to the mold. The mold is filled with a polymer resin so that the polymer resin encapsulates at least a portion of the partially etched pre-circuit and substantially fills the undercut. The molded circuit structure is then removed from the mold and the metallic foil is further etched to complete the forming of the circuit.

59763914, Nov 2, 1999

Jan 13, 1998

9/006213

Robert Edward Belke - W. Bloomfield MI
Edward P. McLeskey - Waterford MI
John Trublowski - Troy MI
Alice Dawn Zitzmann - Belleville MI

Ford Motor Company - Dearborn MI

B44C 122

216 13

A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.

57543984, May 19, 1998

May 28, 1996

8/654489

Andrew Z. Glovatsky - Ypsilanti MI
Alice Zitzmann - Belleville MI

Ford Motor Company, Inc. - Dearborn MI

H05K 720

361690

A circuit-carrying automotive component and a method of manufacturing the same are provided. In a preferred embodiment of the invention, the component includes a substrate made from a polymer that is molten at a predetermined elevated temperature. The component further includes a circuit board which defines an aperture therethrough adapted to receive the molten polymer at the elevated temperature and a fastener formed from the molten polymer through the aperture. The fastener is integral with the substrate and mechanically secures the circuit board to the substrate. The circuit board is made from a material that is resistant to fusing with the molten polymer at the elevated temperature.