Ching Cheong Tang

6997705, Feb 14, 2006

Dec 7, 2003

10/730150

Ching Chiang Tang - East Palo Alto CA, US

F27D 3/12

432141, 99427, 126 41 C, 126 21 A

A furnace for energy saving and space reduction used in electronic industry assembly, medical sterilization, or food process application is provided. In the furnace there is a number of trays hinged on a pair of continuous chains which movement is in a circle or oval trajectory, or on the rotating beam mechanism constituting as spider web form. A pair of rings is added to restrain the swing movement of each tray via the mechanical linkage during rotation. A dome formed at the top portion inside the furnace is used as an enclosure where the heated inert gas is almost kept. The electric power for heater and blower can be reduced by the natural convection. An opening is located at the lower portion of the furnace; so the operator can do loading and unloading performance.

7857125, Dec 28, 2010

Oct 1, 2008

12/286835

Ching Chiang Tang - East Palo Alto CA, US

B65G 17/16

198799, 198800, 198801

An apparatus for carrying a plurality of vertically hanging trays includes a vertical rotating members comprising a first pair of rotating chains carrying the plurality of trays at respective top bars thereof and a second pair of rotating chains coupled to each top bar through linking bars, the first and second pairs of rotating chains being operatively coupled. The apparatus may be used in a furnace, a cleaning apparatus and a combined furnace cleaning apparatus as well as in medical and other applications.

20060191450, Aug 31, 2006

Feb 13, 2006

11/354201

Ching Tang - East Palo Alto CA, US

F23K 3/00

110267000

An apparatus for carrying a plurality of vertically hanging trays includes a vertical rotating means comprising a first pair of rotating chains carrying the plurality of trays at respective tray apexes and a second pair of rotating chains carrying the trays at respective bases, the first and second pairs of rotating chains being operatively coupled. The apparatus may be used in a furnace, a cleaning apparatus and a combined furnace/cleaning apparatus as well as in medical and other applications.

46576169, Apr 14, 1987

May 17, 1985

6/735821

David W. Benzing - San Jose CA
Jeffrey C. Benzing - San Jose CA
Arthur D. Boren - San Jose CA
Ching C. Tang - San Francisco CA

Benzing Technologies, Inc. - San Jose CA

B44C 122
C03C 1500
C03C 2506

156345

An apparatus for the in-situ cleaning of Low Pressure Chemical Vapor Deposition tube chambers (32) or Reduced Pressure Epitaxy bell jar chambers (42) having a base member (22) to create a vacuum seal upon engagement with the loading end of the chamber, at least one powered electrode (62) which protrudes from the base member into the chamber, at least on grounded electrode (60) which also protrudes from the base member into the chamber, a means for introducing gas (92) into the chamber, and an electrical network (16) that creates a radio frequency electrical field between the powered electrode and the grounded electrode. A plasma is created in the chamber by the interaction of the gas and the RF field, and the plasma etches unwanted deposits from the inner wall of the chamber. Several different configurations of electrode structures are shown.

56262787, May 6, 1997

Nov 20, 1995

8/562542

Ching C. Tang - Fremont CA

B23K 3514

228 563

A solder delivery and array device for soldering electronic components and/or IC chips to printed circuit boards (PCB) or substrates comprises solder performs with predetermined weight, size, shape, and a flexible retaining means with spaced openings according to the layout of pins or leads of the components and/or IC chips. The solder performs are positioned and fixed in the openings through mechanical locking. The devices are located between components and PCB or substrate during the soldering processing. By using these devices, through hole type components and surface mount type parts can be attached onto the PCB through heat reflow soldering at same time without the wave soldering process, and overheating can be avoided during the soldering process especially for the pin grid array component. Another bonus for the application of the device is shorting the required lead time for research and development in new electronic products.

49604880, Oct 2, 1990

Dec 19, 1989

7/455799

Kam S. Law - Union City CA
Cissy Leung - Fremont CA
Ching C. Tang - San Francisco CA
Kenneth S. Collins - San Jose CA
Mei Chang - Cupertino CA
Jerry Y. K. Wong - Union City CA
David Nin-Kou Wang - Cupertino CA

Applied Materials, Inc. - Santa Clara CA

B08B 700
C23F 112
H01L 21306

156643

A process for cleaning a reactor chamber both locally adjacent the RF electrodes and also throughout the chamber and the exhaust system to the including components such as the throttle valve. Preferably, a two-step continuous etch sequence is used in which the first step uses relatively high pressure, close electrode spacing and fluorocarbon gas chemistry for etching the electodes locally and the second step uses relatively lower pressure, farther electrode spacing and fluorinated gas chemistry for etching throughout the chamber and exhaust system. The local and extended etch steps may be used separately as well as together.