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Yongfu Li

from Midland, MI
Age ~64
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Also known as:
Yong Fu Li, Yongfu Li Wan, Youngfu Li, Li Yongfu, Li Youngfu
Phone and address:
206 Wanetah Dr, Midland, MI 48640
(989) 837-9729
Related to:
Wanyi HuangJian Li, 41Mark Isbister, 63Li Jiang, 52Shaofeng Li, 55
Connected to:
Adeline Li, 33Agatha K Li, 48Aiping Li, 33Aiyi Li, 36Andi Li, 34Andre N Li, 27Anyun Li, 34Banny Li, 51Baozhen Li, 67Beatrice O Li, 68

Yongfu Li Phones & Addresses

  • 206 Wanetah Dr, Midland, MI 48640 (989) 837-9729
  • 2514 Abbott Rd, Midland, MI 48642
  • Columbus, OH

Work

Company: The dow chemical company Jul 2010 to May 2014 Position: Lead chemist

Education

Degree: Master of Science, Masters School / High School: The Ohio State University 1996 to 1999 Specialities: Biophysics

Skills

Polymer Science • Chemistry • Hplc • Polymers • Polymer Characterization • Polymer Chemistry • Ftir • Catalysis • R&D • Analytical Chemistry • Coatings • Organic Chemistry • Materials Science • Adhesives • Tga • Emulsions • Uv/Vis • Resin • Characterization • Ir • Gas Chromatography • Polyurethane • Surface Chemistry • Chromatography • Differential Scanning Calorimetry • Organic Synthesis • Nmr • Spectroscopy • Nanomaterials • Electrochemistry • Powder X Ray Diffraction • Chemical Engineering • High Performance Liquid Chromatography • Research and Development

Languages

English • Mandarin

Industries

Chemicals

Resumes

Resumes

Yongfu Li Photo 1

Research Scientist

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Location:
Midland, MI
Industry:
Chemicals
Work:
The Dow Chemical Company Jul 2010 - May 2014
Lead Chemist
The Dow Chemical Company Jul 2010 - May 2014
Research Scientist
The Dow Chemical Company Sep 2006 - Jun 2010
Senior Chemist
The Dow Chemical Company Jun 2001 - Sep 2006
Chemist
The Ohio State University Aug 1996 - Dec 1999
Research Assistant
Education:
The Ohio State University 1996 - 1999
Master of Science, Masters, Biophysics Hubei Research Institute of Chemistry 1984 - 1987
Master of Science, Masters, Chemistry Fudan University 1978 - 1982
Bachelors, Bachelor of Science, Chemistry
Skills:
Polymer Science
Chemistry
Hplc
Polymers
Polymer Characterization
Polymer Chemistry
Ftir
Catalysis
R&D
Analytical Chemistry
Coatings
Organic Chemistry
Materials Science
Adhesives
Tga
Emulsions
Uv/Vis
Resin
Characterization
Ir
Gas Chromatography
Polyurethane
Surface Chemistry
Chromatography
Differential Scanning Calorimetry
Organic Synthesis
Nmr
Spectroscopy
Nanomaterials
Electrochemistry
Powder X Ray Diffraction
Chemical Engineering
High Performance Liquid Chromatography
Research and Development
Languages:
English
Mandarin

Publications

Us Patents

Aqueous Developable Benzocyclobutene-Based Polymer Composition And Method Of Use Of Such Compositions

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US Patent:
8143360, Mar 27, 2012
Filed:
Oct 12, 2005
Appl. No.:
11/665246
Inventors:
Ying Hung So - Midland MI, US
Edmund J. Stark - Midland MI, US
Shellene K. Thurston - Saginaw MI, US
Kayla J. Gallant (nee Baranck) - Bay City MI, US
Yongfu Li - Midland MI, US
Assignee:
Dow Global Technologies LLC - Midland MI
International Classification:
C08F 32/08
US Classification:
526281, 4302861
Abstract:
The invention is a composition comprising a curable arylcyclobutene based oligomer or polymer and a dissolution inhibitor which comprises a compound comprising at least two diazonaphthoquinone (DNQ) moieties each of which is pendant from different phenyl groups.

Multifunctional Substituted Monomers And Polyarylene Compositions Therefrom

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US Patent:
20070027280, Feb 1, 2007
Filed:
Apr 1, 2004
Appl. No.:
10/549381
Inventors:
Jerry Hahnfeld - Midland MI, US
Robert Hefner - Freeport TX, US
Yongfu Li - Midland MI, US
International Classification:
C08F 38/00
US Classification:
526285000
Abstract:
A compound useful in the formation of polymeric dielectric films for semiconductor devices and the resulting cured films and devices, said compound comprising i) three or more dienophile groups (A-functional groups) and ii) a single ring structure comprising two conjugated carbon-to-carbon double bonds and a leaving group L (collectively referred to as a B-functional group), characterized in that one A-functional group of one molecule of the compound is capable of reaction under cycloaddition reaction conditions with the B-functional group of a second molecule and elimination of the leaving group L, to thereby form a polymer.

Sacrificial Benzocyclobutene Copolymers For Making Air Gap Semiconductor Devices

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US Patent:
7585785, Sep 8, 2009
Filed:
Jan 30, 2004
Appl. No.:
10/544415
Inventors:
Robert A. Kirchhoff - Midland MI, US
Jason Q. Niu - Midland MI, US
Yongfu Li - Midland MI, US
Kenneth L. Foster - Brighton MI, US
Assignee:
Dow Global Technologies - Midland MI
International Classification:
H01L 21/31
US Classification:
438780, 438421, 438781, 257632, 257E21573, 257E21581
Abstract:
A method of forming an air gap within a semiconductor structure by the steps of: (a) using a sacrificial polymer to occupy a space in a semiconductor structure; and (b) heating the semiconductor structure to decompose the sacrificial polymer leaving an air gap within the semiconductor structure, wherein the sacrificial polymer of step (a) is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12) alkyldiol diacrylate (such as bis[3-(4-benzocyclobutenyl)]1,6 hexanediol diacrylate) and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene. In addition, a semiconductor structure, having a sacrificial polymer positioned between conductor lines, wherein the sacrificial polymer is a copolymer of bis[3-(4-benzocyclobutenyl)]1,n (n=2-12)alkyldiol diacrylate and 1,3 bis 2[4-benzocyclobutenyl(ethenyl)]benzene.

Resins For Use As Tie Layer In Multilayer Structure And Multilayer Structures Comprising The Same

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US Patent:
20210002404, Jan 7, 2021
Filed:
Mar 7, 2019
Appl. No.:
16/970497
Inventors:
- Midland MI, US
Rebecca Putans - Midland MI, US
Qichun Wan - Midland MI, US
Yongfu Li - Midland MI, US
Rachel E. M. Brooner - Midland MI, US
Matthew T. Bishop - Midland MI, US
Yong Zheng - Manvel TX, US
International Classification:
C08F 255/02
C08K 5/09
B32B 27/08
B32B 27/32
B32B 15/085
B32B 23/08
B32B 27/30
B32B 27/34
B32B 27/36
B32B 7/12
B65D 65/40
Abstract:
The present invention provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures comprising one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure comprises a maleic anhydride grafted polyolefin, and an inorganic Brønsted acid catalyst. In some aspects, the inorganic Brønsted acid catalyst comprises sodium bisulfate, monosodium phosphate, disodium phosphate, phosphoric acid, or combinations thereof.

Blends Of Okara And A Fiber-Containing Pectin Product

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US Patent:
20190021383, Jan 24, 2019
Filed:
Mar 28, 2017
Appl. No.:
16/067414
Inventors:
- Midland MI, US
Yongfu Li - Midland MI, US
Tirtha Chatterjee - Midland MI, US
Ryan Stempek - Midland MI, US
International Classification:
A23L 29/231
A23L 29/238
A23L 33/185
A23L 11/00
Abstract:
Provided is a composition which comprises (a) okara or whole soy or a mixture thereof, and (b) a fiber-containing pectin product or pectin, wherein the weight ratio between components (a) and (b) is from 0.1:1 to 75:1. The composition is useful for increasing the cohesion of solid food, such as soy patties.

Adhesive Promoters And Methods For Use On Polar Textile To Bond Non-Polar Substrates

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US Patent:
20180187040, Jul 5, 2018
Filed:
May 26, 2016
Appl. No.:
15/740472
Inventors:
- Midland MI, US
Stephanie K. Anderson - Midland MI, US
Patricia A. Peart - Ponca City OK, US
Kyle D. Anderson - Freeport TX, US
Yongfu Li - Midland MI, US
Colin LiPiShan - Freeport TX, US
International Classification:
C09D 153/00
C09D 5/00
Abstract:
The present disclosure provides a primer composition. In an embodiment, the primer composition includes a functionalized polyolefin, a functionalized styrenic block copolymer containing greater than or equal to 20 wt % polymerized styrene, a solvent composition and an isocyanate component. The primer composition is suitable for use as an adhesive layer between a substrate and a polyolefin layer.

Process For Preparing An Aqueous Solution Of A Methylcellulose

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US Patent:
20180042284, Feb 15, 2018
Filed:
Oct 25, 2017
Appl. No.:
15/793208
Inventors:
- Midland MI, US
Kathryn Brown - Mount Pleasant MI, US
David E. Wallick - Midland MI, US
Robert L. Sammler - Midland MI, US
Yongfu Li - Midland MI, US
International Classification:
C08L 1/28
A61K 31/717
C08J 3/075
C08J 3/03
Abstract:
A process for preparing an aqueous solution of a methylcellulose having anhydroglucose units joined by 1-4 linkages wherein hydroxy groups of anhydroglucose units are substituted with methyl groups such that s23/s26 is 0.36 or less,

Process For Preparing An Aqueous Solution Of A Methylcellulose

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US Patent:
20160081384, Mar 24, 2016
Filed:
Apr 8, 2014
Appl. No.:
14/771891
Inventors:
- Midland, MI, US
Kathryn Brown - Mount Pleasant MI, US
David E. Wallick - Midland MI, US
Robert L. Sammler - Midland MI, US
Yongfu Li - Midland MI, US
Assignee:
Dow Global Technologies LLC - Midland MI
International Classification:
A23L 1/308
A61K 31/717
A23L 1/0534
C08J 3/03
C08L 1/28
Abstract:
A process for preparing an aqueous solution of a methylcellulose having anhydroglucose units joined by 1-4 linkages wherein hydroxy groups of anhydroglucose units are substituted with methyl groups such that s23/s26 is 0.36 or less, wherein s23 is the molar fraction of anhydroglucose units wherein only the two hydroxy groups in the 2- and 3-positions of the anhydroglucose unit are substituted with methyl groups and wherein s26 is the molar fraction of anhydroglucose units wherein only the two hydroxy groups in the 2- and 6-positions of the anhydroglucose unit are substituted with methyl groups, comprises the step of mixing the methylcellulose with an aqueous liquid at a temperature of not higher than 10 C. at a shear rate of at least 1000 s.
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Yongfu Li from Midland, MI, age ~64 Get Report