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Yin Lin

from San Jose, CA
Age ~59
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Also known as:
Linda Yin, Lin Y Niu, Lin Y Yin, Lin C Yin, Li N Yin, Lin Yim
Related to:
W U ZuolinRudy Larry PadillaWenny W Lin, 30Jun Wang, 56Changcun Lin, 73Hongfan Yin, 92Wuen YinLun Feng, 63Yuwen Lin, 57Ying Ma, 57Lin S Hao, 50Huier LinChongqing Cao, 83Kevin Niu, 29Wei F Lin, 56Weifeng Lin, 55Andy Lin, 37Yi W Lin, 55Jenny C Lin, 33N A Li, 52
Connected to:
Abbie Lin, 37Adie S Lin, 80Adora A Lin, 44Agnes C Lin, 46Aileen Lin, 55Alston C Lin, 27Angela L Lin, 75Angelo C Lin, 60Anne Lin, 45Anya Y Lin, 47

Yin Lin Phones & Addresses

  • San Jose, CA
  • San Bernardino, CA
  • Chino Hills, CA
  • Chandler, AZ
  • Hacienda Heights, CA
  • Long Beach, CA
  • Hacienda Heights, CA
  • Torrance, CA
  • Monterey Park, CA

Resumes

Resumes

Yin Lin Photo 1

Software Engineer

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Location:
P/O Box 5425, Parsippany, NJ
Industry:
Computer Software
Work:
Paypal Feb 2016 - Jul 2018
Software Engineer at Paypal
Palantir Technologies Feb 2016 - Jul 2018
Software Engineer
Ericsson Jun 2015 - Aug 2015
Software Engineer Internship
Education:
Carnegie Mellon University 2014 - 2015
Masters, Computer Engineering Hangzhou Dianzi University 2010 - 2014
Bachelor of Engineering, Bachelors, Electronics Engineering
Skills:
Java
C
C++
Programming
Python
Matlab
Software Development
Linux
Signal Processing
Fpga
C/C++
Cloud Computing
Altium Designer
Machine Learning
Biomedical Engineering
Hadoop
Vhdl
Amazon Web Services
Distributed Systems
Objective C
Feature Selection
Interests:
Science and Technology
Biomedical Engineering
Signal Processing
Languages:
English
Mandarin
Yin Lin Photo 2

Software Engineer

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Location:
San Jose, CA
Work:
Palantir Technologies
Software Engineer
Yin Lin Photo 3

Yin Lin

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Yin Lin Photo 4

Yin Lin

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Yin Lin Photo 5

Yin Lin

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Location:
United States
Yin Lin Photo 6

Yin Lin

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Location:
United States
Yin Lin Photo 7

Yin Lin

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Location:
United States
Yin Lin Photo 8

Yin Lin Phoenix, AZ

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Work:
Hanjin Shipping America Regional Office

Dec 2007 to 2000
Coordinator, Accounts Payable
AAA Arizona
Phoenix, AZ
Jun 2002 to Nov 2007
Lead Agent, Membership Processing
Education:
University of Phoenix
Oct 2013
MBA in Business Administration
Arizona State University
May 2006
BA in Global Business

Business Records

Name / Title
Company / Classification
Phones & Addresses
Yin Ching Lin
President
CHIN CHARNG LIN, D.D.S., INC
1758 Sierra Leone Ave #C, Rowland Heights, CA 91748
1758 Sierra Leone Ave, Whittier, CA 91748
Yin Ching Lin
President
Nguyen, Du Huu DDS Inc
Dentist's Office
1015 Nogales St, Whittier, CA 91748
(626) 965-6723
Yin Fu Lin
President
POLIMAX PLASTICS, INC
2404 Robinson St, Redondo Beach, CA 90278
Yin Ching Lin
President
NEWMAN INTERNATIONAL CORPORATION
12981 Ramona Blvd #H, Baldwin Park, CA 91706
12981 Ramona Blvd, Duarte, CA 91706
Yin Po Lin
President
CHINESE SENIOR CITIZEN CENTER, INC. OF LOS ANGELES
925 N Broadway #201, Los Angeles, CA 90012
Yin L. Lin
Partner
Chinatown Express Number 46
Eating Place · Eating Places
524 N Orange Ave, Monterey Park, CA 91755
(626) 569-9562

Publications

Us Patents

Method For The Cvd Deposition Of A Low Residual Halogen Content Multi-Layered Titanium Nitride Film Having A Combined Thickness Greater Than 1000

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US Patent:
6436820, Aug 20, 2002
Filed:
Feb 3, 2000
Appl. No.:
09/497787
Inventors:
Jianhua Hu - Sunnyvale CA
Yin Lin - Mountain View CA
Fufa Chen - Cupertino CA
Yehuda Demayo - San Jose CA
Ming Xi - Sunnyvale CA
Assignee:
Applied Materials, Inc - Santa Clara CA
International Classification:
H01L 21324
US Classification:
438656, 438663, 438680, 438685, 427255391
Abstract:
The present disclosure pertains to the discovery that TiN films having a thickness of greater than about 400 and, particularly greater than 1000 , and a resistivity of less than about 175 cm, can be produced by a CVD technique in which a series of TiN layers are deposited to form a desired TiN film thickness. Each layer is deposited employing a CVD deposition/treatment step. During a treatment step, residual halogen (typically chlorine) was removed from the CVD deposited film. Specifically, a TiN film having a thickness of greater than about 400 was prepared by a multi deposition/treatment step process where individual TiN layers having a thickness of less than 400 were produced in series to provide a finished TiN layer having a combined desired thickness. Each individual TiN layer was CVD deposited and then treated by exposing the TiN surface to ammonia in an annealing step carried out in an ammonia ambient. The TiN film formed in this manner not only had a resistivity of less than about 175 cm, but was substantially free of micro cracks as well, including films having a thickness greater than 1,000.

Method And Apparatus For Tuning A Plurality Of Processing Chambers

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US Patent:
20030003696, Jan 2, 2003
Filed:
Jun 29, 2001
Appl. No.:
09/896124
Inventors:
Avgerinos Gelatos - Redwood City CA, US
Joel Huston - San Jose CA, US
Lawrence Lei - Milipitas CA, US
Vicky Nguyen - San Jose CA, US
Yin Lin - Palo Alto CA, US
Fong Chang - Los Gatos CA, US
International Classification:
H01L021/36
H01L021/20
C30B001/00
US Classification:
438/485000, 438/507000, 438/935000
Abstract:
Generally, a substrate processing apparatus is provided. In one aspect of the invention, a substrate processing apparatus is provided. In one embodiment, the substrate processing apparatus includes one or more chamber bodies coupled to a gas distribution system. The chamber bodies define at least a first processing region and a second processing region within the chamber bodies. The gas distribution system includes a first, a second and a third gas supply circuit. The first gas supply circuit is teed between the first and second processing regions and is adapted to supply a first processing gas thereto. The second gas supply circuit is coupled to the first processing region and adapted to supply a second process gas thereto. The third gas supply circuit is coupled to the second processing region and is adapted to supply a third process gas thereto. Alternatively, the processing regions may be disposed in a single chamber body.

Method Of Performing Titanium/Titanium Nitride Integration

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US Patent:
62211749, Apr 24, 2001
Filed:
Feb 11, 1999
Appl. No.:
9/248869
Inventors:
Fufa Chen - Cupertino CA
Yin Lin - Mountain View CA
Jianhua Hu - Sunnyvale CA
Frederick Wu - Cupertino CA
Ming Xi - Milpitas CA
Li Wu - Fremont CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
C23C 824
US Classification:
148237
Abstract:
The present invention is a method of wafer processing which improves the reliability of an integrated titanium (Ti)/titanium nitride (TiN) CVD film formed from a reaction of titanium tetrachloride (TiCi. sub. 4) and ammonia (NH. sub. 3). A Ti film is subject to a treatment of NH. sub. 3 gas to render the Ti film unreactive towards attack by chlorine and hydrogen chloride. A thin seed layer of TiN film is deposited upon the treated Ti film using a thermal TiCl. sub. 4 /NH. sub. 3 reaction. Subsequent TiN film deposition upon the seed layer results in a successful integration of a Ti/TiN film stack for a Ti film thickness up to about 300. ANG.

Accessing Endpoints In Logical Networks And Public Cloud Service Providers Native Networks Using A Single Network Interface And A Single Routing Table

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US Patent:
20200177670, Jun 4, 2020
Filed:
Feb 9, 2020
Appl. No.:
16/785620
Inventors:
- Palo Alto CA, US
Sairam Venugopal - San Mateo CA, US
Yin Lin - Mountain View CA, US
Anand Kumar - Sunnyvale CA, US
Nithin Bangalore Raju - Sunnyvale CA, US
Mukesh Hira - Palo Alto CA, US
Ganesan Chandrashekhar - Campbell CA, US
Vivek Agarwal - Campbell CA, US
International Classification:
H04L 29/08
H04L 12/931
H04W 12/00
H04L 29/06
H04L 12/24
Abstract:
A physical host machine of a public cloud system includes a set of processing units for executing instructions stored in non-transitory machine readable media. The physical host machine also includes a physical network interface cars (PNIC) and a non-transitory machine readable medium that stores a data compute node (DCN). The DCN includes first and second applications, first and second logical interfaces, a network stack, and a managed forwarding element (MFE). The first application is connected to the pNIC through the network stack, the first logical interface, and the MFE. The second application is connected to the PNIC through the network stack, the second logical interface, and the MFE.

Packet Communication Between Logical Networks And Public Cloud Service Providers Native Networks Using A Single Network Interface And A Single Routing Table

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US Patent:
20190068493, Feb 28, 2019
Filed:
Aug 24, 2017
Appl. No.:
15/686098
Inventors:
- Palo Alto CA, US
Sairam Venugopal - San Mateo CA, US
Yin Lin - Mountain View CA, US
Anand Kumar - Sunnyvale CA, US
Nithin Bangalore Raju - Santa Clara CA, US
Mukesh Hira - Los Altos CA, US
Ganesan Chandrashekhar - Campbell CA, US
Vivek Agarwal - Campbell CA, US
International Classification:
H04L 12/713
H04L 12/707
H04L 12/46
G06F 9/50
Abstract:
A data compute node executes (i) a set of tenant applications connected to a third party overlay network, (ii) a set of network manager applications, and (iii) a managed forwarding element that includes a pair of overlay and underlay network virtual adapters. A packet that is received from a network manager application and addressed to an underlay network destination is sent to the underlay network destination address through a physical NIC of the host without network address translation or encapsulation. A packet that is received from a tenant application and addressed to an underlay network destination is subject to SNAT and is sent to the underlay network destination address. A packet that is received from a tenant application and is addressed an overlay destination address is encapsulated with the header of the overlay network and is sent to the overlay network destination address through the underlay virtual adapter.

Accessing Endpoints In Logical Networks And Public Cloud Service Providers Native Networks Using A Single Network Interface And A Single Routing Table

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US Patent:
20190068689, Feb 28, 2019
Filed:
Aug 24, 2017
Appl. No.:
15/686093
Inventors:
- Palo Alto CA, US
Sairam Venugopal - San Mateo CA, US
Yin Lin - Mountain View CA, US
Anand Kumar - Sunnyvale CA, US
Nithin Bangalore Raju - Santa Clara CA, US
Mukesh Hira - Los Altos CA, US
Ganesan Chandrashekhar - Campbell CA, US
Vivek Agarwal - Campbell CA, US
International Classification:
H04L 29/08
H04L 12/931
Abstract:
A physical host machine of a public cloud system includes a set of processing units for executing instructions stored in non-transitory machine readable media. The physical host machine also includes a physical network interface cars (PNIC) and a non-transitory machine readable medium that stores a data compute node (DCN). The DCN includes first and second applications, first and second logical interfaces, a network stack, and a managed forwarding element (MFE). The first application is connected to the pNIC through the network stack, the first logical interface, and the MFE. The second application is connected to the PNIC through the network stack, the second logical interface, and the MFE.
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Yin Lin from San Jose, CA, age ~59 Get Report