Resumes
Resumes
Yin Foong Phones & Addresses
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Milwaukie, OR
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San Jose, CA
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Santa Clara, CA
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830 Abbott Ave, Milpitas, CA 95035
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1884 Yosemite Dr, Milpitas, CA 95035
Publications
Us Patents
Multi-Chip Module And Method Of Manufacture
View pageUS Patent:
20060249826, Nov 9, 2006
Filed:
May 4, 2005
Appl. No.:
11/125396
Inventors:
Yin Foong - Milpitas CA, US
Cheng Kee - Bayan Lepas Penang, MY
Lay Lee - Penang, MY
Mohamed Abu-Hassan - Pendang, MY
Cheng Kee - Bayan Lepas Penang, MY
Lay Lee - Penang, MY
Mohamed Abu-Hassan - Pendang, MY
International Classification:
H01L 29/74
US Classification:
257685000
Abstract:
A multi-chip module and a method for manufacturing the multi-chip module that mitigates wire breakage. A first semiconductor chip is mounted and wirebonded to a support substrate. A spacer is coupled to the first semiconductor chip. A support material is disposed on the spacer and a second semiconductor chip is positioned on the support material. The second semiconductor chip is pressed into the support material squeezing it into a region adjacent the spacer and between the first and second semiconductor chips. Alternatively, the support material is disposed on the first semiconductor chip and a die attach material is disposed on the spacer. The second semiconductor chip is pressed into the die attach material and the support material, squeezing a portion of the support material over the spacer edges. Wirebonds are formed between the support substrate and the first and second semiconductor chips.