Yasu Osako

8116341, Feb 14, 2012

May 31, 2007

11/756507

Weisheng Lei - Portland OR, US
Yunlong Sun - Beaverton OR, US
Yasu Osako - Lake Oswego OR, US
John Davignon - Hillsboro OR, US
Glenn Simenson - Portland OR, US
Hisashi Matsumoto - Hillsboro OR, US

Electro Scientific Industries, Inc. - Portland OR

H01S 3/109
H01S 3/10
B23K 26/38

372 22, 21912171, 372 23

Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths.

8383984, Feb 26, 2013

Apr 2, 2010

12/753367

Yasu Osako - Lake Oswego OR, US
Daragh Finn - Beaverton OR, US

Electro Scientific Industries, Inc. - Portland OR

B23K 26/00

21912172, 21912167

An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies.

8524127, Sep 3, 2013

Mar 26, 2010

12/732851

Yasu Osako - Lake Oswego OR, US

Electro Scientific Industries, Inc. - Portland OR

B29D 11/00
B29C 35/08

264 138, 264 137, 264 17, 264400, 264494

Methods of manufacturing a panel and resulting panels include a plurality of microholes arranged in a pattern and filled with light transmissive polymeric material. The light transmissive polymeric material occludes the microholes and is set, or cured, by exposure to an energy source using at least two discrete exposure periods separated by an idle or rest period.

8598490, Dec 3, 2013

Mar 31, 2011

13/076810

Andrew Hooper - Portland OR, US
David Barsic - Portland OR, US
Kelly J. Bruland - Portland OR, US
Daragh S. Finn - Beaverton OR, US
Lynn Sheehan - Vancouver WA, US
Xiaoyuan Peng - Portland OR, US
Yasu Osako - Lake Oswego OR, US
Jim Dumestre - Tigard OR, US
William J. Jordens - Beaverton OR, US

Electro Scientific Industries, Inc. - Portland OR

H01L 21/78

21912169, 21912177, 438463, 264400, 264482

Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback.

8609512, Dec 17, 2013

Mar 27, 2009

12/413068

Peter Pirogovsky - Portland OR, US
Jeffery A. Albelo - Portland OR, US
James O'Brien - Bend OR, US
Yasu Osako - Lake Oswego OR, US

Electro Scientific Industries, Inc. - Portland OR

H01L 21/00

438463, 438 33, 438451, 438 68, 438113, 438458, 257E21599, 257E21001

An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.

8208506, Jun 26, 2012

Oct 19, 2010

12/907768

Yasu Osako - Lake Oswego OR, US
Hisashi Matsumoto - Hillsboro OR, US

Electro Scientific Industries, Inc. - Portland OR

H01S 3/10

372 25, 372 13, 372 12, 372 10, 372 16, 372 55

Systems and methods generate laser pulse trains for material processing. In one embodiment, stable laser pulse trains at high repetition rates are generated from a continuous wave (CW) or quasi-CW laser beams. One or more laser pulses in the laser pulse train may be shaped to control energy delivered to a target material. In another embodiment, multiple laser beams are distributed to multiple processing heads from a single laser pulse, CW laser beam, or quasi-CW laser beam. In one such embodiment, a single optical deflector distributes multiple laser beams among respective processing heads.

20050224469, Oct 13, 2005

Nov 29, 2004

11/000333

Donald Cutler - Portland OR, US
Brian Baird - Oregon City OR, US
Richard Harris - Portland OR, US
David Hemenway - Beaverton OR, US
Ho Lo - Portland OR, US
Brady Nilsen - Beaverton OR, US
Yasu Osako - Lake Oswego OR, US
Lei Sun - Portland OR, US
Yunlong Sun - Beaverton OR, US
Mark Unrath - Portland OR, US

B23K026/00

219121600

A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs positioned such that the laser beam passes through the AOMs without being deflected. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head.

20080179304, Jul 31, 2008

Dec 3, 2007

11/949582

Yasu Osako - Lake Oswego OR, US
Mark Unrath - Portland OR, US
Mark Kosmowski - Beaverton OR, US

Electro Scientific Industries, Inc. - Portland OR

B23K 26/08

21912185, 2191216

Systems and methods for laser processing continuously moving sheet material include one or more laser processing heads configured to illuminate the moving sheet material with one or more laser beams. The sheet material may include, for example, an optical film continuously moving from a first roller to a second roller during a laser process. In one embodiment, a vacuum chuck is configured to removably affix a first portion of the moving sheet material thereto. The vacuum chuck controls a velocity of the moving sheet material as the first portion is processed by the one or more laser beams. In one embodiment, a conveyor includes a plurality of vacuum chucks configured to successively affix to different portions of the sheet material during laser processing.