Search

Yankun Fu

from Mebane, NC
Age ~60
Get Report
Also known as:
Yuen Q Fu, N Iu
Related to:
Zhigang G Fu
Connected to:
Bryan Fu, 35Cecilia T Fu, 54Chau Fu, 66Cheong M Fu, 67Chihping Fu, 59Chuanhai Fu, 45Chuck C Fu, 68Chuyong Fu, 49Danling Fu, 73Danni Fu, 34

Yankun Fu Phones & Addresses

  • Mebane, NC
  • 9221 Calabria Dr #217, Raleigh, NC 27617
  • 7822 Spungold St, Raleigh, NC 27617
  • Goldsboro, NC
  • Durham, NC
  • 667 Camino Campana, Santa Barbara, CA 93111 (805) 964-8777
  • 5143 San Lazaro Way, Santa Barbara, CA 93111 (805) 964-8777
  • Morrisville, NC
  • Athens, OH

Work

Position: Clerical/White Collar

Education

Degree: Associate degree or higher

Resumes

Resumes

Yankun Fu Photo 1

Senior Failure Analysis Engineer

View page
Location:
4600 Silicon Dr, Durham, NC 27703
Industry:
Semiconductors
Work:
Cree
Senior Failure Analysis Engineer
Cree Jan 2003 - Jan 2011
Process Development Engineer
Skills:
Semiconductors
Electronics
Semiconductor Industry
Design of Experiments
Failure Analysis
Cvd
Thin Films
Jmp
Spc
Manufacturing
Characterization
Silicon
Cross Functional Team Leadership
Optoelectronics
Engineering
Analog
Engineering Management
Pecvd
Ic
R&D
Product Development
Nanotechnology
Scanning Electron Microscopy
Photolithography
Materials Science
Optics
Lean Manufacturing
Technical Marketing
Labview
Analog Circuit Design
Product Engineering
Device Characterization
Design For Manufacturing
Sensors
Pvd
Afm
Simulations
Electrical Engineering
Fmea
Solid State Lighting
Mixed Signal
Photonics
Metrology
Pcb Design
Process Engineering
Six Sigma
Languages:
Mandarin
Yankun Fu Photo 2

Yankun Fu

View page
Skills:
Powerpoint
Microsoft Office
Customer Service
Windows
Microsoft Excel
Microsoft Word
Yankun Fu Photo 3

Yankun Fu

View page

Publications

Us Patents

Method Of Uniform Phosphor Chip Coating And Led Package Fabricated Using Method

View page
US Patent:
7943952, May 17, 2011
Filed:
Jul 27, 2007
Appl. No.:
11/881683
Inventors:
Ban P. Loh - Durham NC, US
Peter Andrews - Durham NC, US
Yankun Fu - Raleigh NC, US
Michael Laughner - Clayton NC, US
Ronan Letoquin - Durham NC, US
Assignee:
Cree, Inc. - Goleta CA
International Classification:
H01L 33/52
US Classification:
257100, 257 98, 257E33059, 257E33073, 438 26
Abstract:
Methods for fabricating LED packages comprising providing an LED chip and covering at least part of it with a liquid medium. An optical element is provided and placed on the liquid medium. The optical element is allowed to settle to a desired level and the liquid medium is cured. LED packages are also disclosed that are fabricated using the disclosed methods.

Saturated Phosphor Solid State Emitter

View page
US Patent:
20040012027, Jan 22, 2004
Filed:
Jun 12, 2003
Appl. No.:
10/461561
Inventors:
Bernd Keller - Santa Barbara CA, US
James Ibbetson - Santa Barbara CA, US
Yankun Fu - Santa Barbara CA, US
James Seruto - Goleta CA, US
Jayesh Bharathan - Cary NC, US
Assignee:
CREE LIGHTING COMPANY
International Classification:
H01L027/15
US Classification:
257/079000
Abstract:
A high efficiency, high yield solid state emitter package is disclosed exhibiting limited wavelength variations between batches and consistent wavelength and emission characteristics with operation. One embodiment of an emitter package according to the present invention comprises a semiconductor emitter and a conversion material. The conversion material is arranged to absorb substantially all of the light emitting from the semiconductor emitter and re-emit light at one or more different wavelength spectrums of light The conversion material is also arranged so that there is not an excess of conversion material to block the re-emitted light as it emits from the emitter package. The emitter package emitting light at one or more wavelength spectrums from the conversion material's re-emitted light. The semiconductor emitter is preferably a light emitting diode (LED) or laser diode

Semiconductor Light Emitting Device Mounting Substrates Including A Conductive Lead Extending Therein And Methods Of Packaging Same

View page
US Patent:
20060157726, Jul 20, 2006
Filed:
Jan 14, 2005
Appl. No.:
11/035716
Inventors:
Ban Loh - Durham NC, US
Gerald Negley - Carrboro NC, US
Yankun Fu - Santa Barbara CA, US
International Classification:
H01L 33/00
US Classification:
257100000
Abstract:
A mounting substrate for a semiconductor light emitting device includes a thermally conductive mounting block. The mounting block has, in a first face thereof, a cavity that is configured to mount a semiconductor light emitting device therein and to reflect light that is emitted by the semiconductor light emitting device that is mounted therein away from the cavity. A conductive lead inserted into the mounting block extends into the cavity. The conductive lead is electrically isolated from the mounting block and has an exposed contact portion in the cavity. The conductive lead may be a plurality of conductive leads each having an exposed contact portion at different locations in the cavity. Related packaging methods also may be provided.

Wafer Level Phosphor Coating Method And Devices Fabricated Utilizing Method

View page
US Patent:
20080173884, Jul 24, 2008
Filed:
Jan 22, 2007
Appl. No.:
11/656759
Inventors:
Ashay Chitnis - Santa Barbara CA, US
James Ibbetson - Santa Barbara CA, US
Arpan Chakraborty - Goleta CA, US
Eric J. Tarsa - Goleta CA, US
Bernd Keller - Santa Barbara CA, US
James Seruto - Orcutt CA, US
Yankun Fu - Raleigh NC, US
International Classification:
H01L 33/00
US Classification:
257 98, 438 29, 257E33061
Abstract:
Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

Wafer Level Phosphor Coating Method And Devices Fabricated Utilizing Method

View page
US Patent:
20080179611, Jul 31, 2008
Filed:
Sep 7, 2007
Appl. No.:
11/899790
Inventors:
Ashay Chitnis - Goleta CA, US
James Ibbetson - Santa Barbara CA, US
Bernd Keller - Santa Barbara CA, US
David T. Emerson - Chapel Hill NC, US
John Edmond - Cary NC, US
Michael J. Bergmann - Chapel Hill NC, US
Jasper S. Cabalu - Cary NC, US
Jeffrey C. Britt - Cary NC, US
Arpan Chakraborty - Goleta CA, US
Eric Tarsa - Goleta CA, US
James Seruto - Goleta CA, US
Yankun Fu - Raleigh NC, US
International Classification:
H01L 33/00
US Classification:
257 98, 438 27, 257E33061
Abstract:
Methods for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs typically on a substrate. Pedestals are deposited on the LEDs with each of the pedestals in electrical contact with one of the LEDs. A coating is formed over the LEDs with the coating burying at least some of the pedestals. The coating is then planarized to expose at least some of the buried pedestals while leaving at least some of said coating on said LEDs. The exposed pedestals can then be contacted such as by wire bonds. The present invention discloses similar methods used for fabricating LED chips having LEDs that are flip-chip bonded on a carrier substrate and for fabricating other semiconductor devices. LED chip wafers and LED chips are also disclosed that are fabricated using the disclosed methods.

Light Emitting Die (Led) Packages And Related Methods

View page
US Patent:
20120187862, Jul 26, 2012
Filed:
Jul 20, 2011
Appl. No.:
13/187232
Inventors:
Jeffrey Carl Britt - Cary NC, US
Brandon Stanton - Raleigh NC, US
Yankun Fu - Raleigh NC, US
International Classification:
H05B 37/02
H01L 33/58
US Classification:
315291, 257 98, 257E3306
Abstract:
LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.
Control profile
Yankun Fu from Mebane, NC, age ~60 Get Report