Xiang Dai

6923658, Aug 2, 2005

Dec 3, 2003

10/725512

Dan Cromwell - Penryn CA, US
Xiang Dai - Roseville CA, US

Hewlett-Packard Development Company, L.P. - Houston TX

H01R012/00
H05K001/00

439 71, 361762

A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

7372147, May 13, 2008

Jul 2, 2003

10/612663

Xiang Dai - Roseville CA, US
Dan Cromwell - Penryn CA, US

Hewlett-Packard Development Company, L.P. - Houston TX

H01L 23/34
H01L 29/40
H01L 21/00
H05K 7/20

257707, 257706, 257718, 257778, 438108, 361704

A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

20040134680, Jul 15, 2004

Jan 9, 2003

10/339842

Xiang Dai - Roseville CA, US
Mumtaz Hussain - Fort Collins CO, US
Stephen Cromwell - Penryn CA, US
Russell Lewis - Fort Collins CO, US
Laszlo Nobi - Fort Collins CO, US

H05K001/03

174/255000

An assembly is provided having a first circuit board and a second circuit board, each circuit board having a plurality of electrical connection points, electrical connection points on the first circuit board being connected to specified electrical connection points on the second circuit board by solder structures, the first and second circuit boards being stacked with respect to each other and with a defined standoff distance there between, the assembly comprising one or more stops having an inserted portion placed between the first and second circuit board along the perimeter of at least one of the electrical circuit boards, the inserted portion of each of the stops having a fixed, predetermined height.

20040240188, Dec 2, 2004

May 28, 2003

10/447542

Stephen Cromwell - Penryn CA, US
Xiang Dai - Roseville CA, US
Hamid Nikzad - Los Altos CA, US

H05K001/18

361/761000

A component of an attach hardware assembly is configured for use in securing an Application Specific Integrated Circuit (ASIC) to a circuit board as part of the attach hardware assembly and has a protective coating to protect that component from corrosion.

20060156540, Jul 20, 2006

Jan 18, 2005

11/039484

Daniel Cromwell - Penryn CA, US
Alicia Castro - Isabela PR, US
Xiang Dai - Roseville CA, US
Joseph White - Windsor CO, US

Hewlett-Packard Development Company, L.P. - Houston TX

H05K 9/00
B23P 19/00
H05K 3/30

029739000, 174377000, 174260000, 029759000, 029834000, 029832000

A fixture can be placed onto a printed circuit board in an aligned position and a component can be guided into the fixture and onto the printed circuit board. The fixture coarsely aligns the component with the printed circuit board.