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Wojtek J Sudol

from Andover, MA
Age ~67
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Also known as:
Wojtek Roksana Sudol, Wojtek S Sudol, Wojtek T Sudol, Wojtek R Sudol, Walter J Sudol, Wojtek J Udol, Woytek J Sudol, Wojtek T Roksana, Wajtek Udol, Sudol Wojtek
Phone and address:
28 Stirling St, Andover, MA 01810
(978) 470-0247
Related to:
Kate Sudol
Connected to:
Adam Sudol, 99Alison L Sudol, 40Amy A Sudol, 57Anthony Sudol, 60Debra P Sudol, 58Elizabeth Sudol, 46Eva M Sudol, 85Jakub A Sudol, 27Jeff Sudol, 55Kathleen T Sudol, 71

Wojtek Sudol Phones & Addresses

  • 28 Stirling St, Andover, MA 01810 (978) 470-0247 (978) 470-1133
  • 3000 Minuteman Rd, Andover, MA 01810
  • 378 Black Point Rd, Beaver Cove, ME 04441 (207) 695-4333
  • Greenville, ME
  • Georgetown, MA
  • 21 Knollwood Ct, Burlington, MA 01803 (781) 229-1515
  • Winchester, MA
  • North Andover, MA

Work

Company: Philips May 1987 Position: Corporate technical staff

Skills

Medical Devices • Product Development • Design Control • R&D • Design For Manufacturing • Cross Functional Team Leadership • Design of Experiments • Manufacturing • Research and Development • Iso 13485 • Biomedical Engineering

Industries

Medical Devices

Resumes

Resumes

Wojtek Sudol Photo 1

Corporate Technical Staff

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Location:
Andover, MA
Industry:
Medical Devices
Work:
Philips
Corporate Technical Staff
Skills:
Medical Devices
Product Development
Design Control
R&D
Design For Manufacturing
Cross Functional Team Leadership
Design of Experiments
Manufacturing
Research and Development
Iso 13485
Biomedical Engineering

Business Records

Name / Title
Company / Classification
Phones & Addresses
Wojtek Sudol
President
PRESSURE SYSTEMS INCORPORATED
21 Knollwood Ct, Burlington, MA 01803

Publications

Us Patents

Method Of Constructing Segmented Connections For Multiple Elevation Transducers

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US Patent:
6449821, Sep 17, 2002
Filed:
Aug 12, 1999
Appl. No.:
09/373083
Inventors:
Wojtek Sudol - Burlington MA
Francis E. Gurrie - North Andover MA
Assignee:
Koninklijke Philips Electronics, N.V. - Eindhoven
International Classification:
H04R 1700
US Classification:
29 2535, 29852, 29830, 439 67, 439 77
Abstract:
A method for constructing a connection assembly for use in a multiple aperture ultrasonic tranducer including an array of elements for transmitting or receiving signals, wherein each element is comprised of a plurality of segments, and the connection assembly for interconnecting the segments of each elements and for connecting the segments to transmit/receive circuitsto form the aperatures of the array. An isolating layer is superimposed on the segments of the array and a plurality of via openings are formed through the isolating layer. At least one via opening being assocated with each segment of the array and each via opening exposing an area of an assocated segment. A conductive layer is superimposed on the isolating layer, the conductive layer having conduxtive paths interconnecting the segments and connecting the segments to the transmit/receive circuits to form the apertures of the array.

Ultrasonic Transducer Backing Assembly And Methods For Making Same

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US Patent:
6625854, Sep 30, 2003
Filed:
Nov 23, 1999
Appl. No.:
09/448527
Inventors:
Wojtek Sudol - North Andover MA
Francis E. Gurrie - North Andover MA
Rodney J. Solomon - Andover MA
Alec Rooney - Eliot ME
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
H04R 1700
US Classification:
29 2535, 296091, 29594, 29830, 29831, 310 3
Abstract:
An acoustic backing element includes a glass fiber epoxy composite planar substrate to the outer major surfaces of which are applied electrically conductive material. The electrically conductive material may be a conductive layer that is etched to expose electrical contact material in the form of conductive traces. Each conductive trace provides electrical connection between a transducer element and electrical control circuitry typically located on an electrical circuit board. The acoustic backing element provides precisely located electrical contacts for connecting the transducer elements to their control circuitry, while simultaneously providing superior acoustic attenuation. In addition, the thermal coefficient of expansion (TCE) of the glass fiber epoxy composite material comprising the planar substrate can be closely matched to the TCE of the electrical contact material. In this manner, fatigue and failure caused by mechanical stresses between the planar substrate and the electrical contact material due to temperature extremes and temperature cycling are significantly reduced.

Acoustic Imaging System With Non-Focusing Lens

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US Patent:
6632179, Oct 14, 2003
Filed:
Jul 31, 2001
Appl. No.:
09/919122
Inventors:
Martha Grewe Wilson - Andover MA
Wojtek Sudol - Andover MA
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
A61B 800
US Classification:
600460
Abstract:
Acoustic imaging systems are provided. A preferred system includes a transducer lens configured to mate with a transducer body. The transducer lens is configured to propagate acoustic energy. Preferably, the transducer lens is formed, at least partially, of an acoustic-matching material, which exhibits acoustic properties corresponding to acoustic properties of a body to be imaged. Methods also are provided.

Two-Dimensional Transducer Arrays For Improved Field Of View

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US Patent:
7637869, Dec 29, 2009
Filed:
Jun 26, 2004
Appl. No.:
10/560722
Inventors:
Wojtek Sudol - Andover MA, US
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
A61B 8/00
US Classification:
600437, 600447, 600459, 367178
Abstract:
A method and system for using two-dimensional transducer arrays for improving the field of view during an ultrasonic examination are disclosed. The ultrasonic imaging system includes a two-dimensional transducer array with a plurality of acoustic elements, a beam controller, a signal processor, and a display. The beam controller controls a generated acoustic beam capable of being advanced longitudinally or laterally along the two-dimensional transducer array. Additionally, the generated acoustic beam is capable of being phase-shifted by the beam controller. Combining the phase shifting of and advancement of the acoustic beam increases the field of view of the two-dimensional array.

Ultrasound Transducer And Method For Implementing Flip-Chip Two Dimensional Array Technology To Curved Arrays

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US Patent:
7741756, Jun 22, 2010
Filed:
Dec 1, 2004
Appl. No.:
10/596175
Inventors:
Wojtek Sudol - Andover MA, US
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
H01L 41/09
US Classification:
310334
Abstract:
An ultrasound transducer probe () includes a support substrate (), an integrated circuit () and an array of piezoelectric elements (). The support substrate () has a non-linear surface (). The integrated circuit () physically couples to the support substrate () overlying the non-linear surface (), wherein the integrated circuit () substantially conforms to a shape of the non-linear surface (). An array of piezoelectric elements () couples to the integrated circuit ().

Redistribution Interconnect For Microbeamforming(S) And A Medical Ultrasound System

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US Patent:
7795784, Sep 14, 2010
Filed:
Jan 9, 2006
Appl. No.:
11/813259
Inventors:
Richard Davidsen - Everett WA, US
Andrew L. Robinson - Bellevue WA, US
Wojtek Sudol - Andover MA, US
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
H01L 41/08
US Classification:
310334
Abstract:
An ultrasound transducer includes one or more microbeamformer integrated circuit chips, an array of acoustic elements, and a redistribution interconnect coupled via conductive elements between the one or more integrated circuit chips and the array of acoustic elements. The one or more microbeamformer integrated circuit chips each include a plurality of bond pads separated from adjacent ones thereof by a first pitch set. The acoustic elements of the array are separated from adjacent ones thereof by a second pitch set, the second pitch set being different from the first pitch set. In addition, the redistribution interconnect couples on a first side of the redistribution interconnect to the one or more microbeamformer integrated circuit chips via conductive elements. The redistribution interconnect couples on a second side to the array of transducer elements via conductive elements. The redistribution interconnect provides an interconnection between the bond pads of the one or more microbeamformer integrated circuit chips with the first pitch set with corresponding ones of the acoustic elements of the array with the second pitch set.

Transducer Arrays For Medical Ultrasound And Method Of Making The Same

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US Patent:
8169125, May 1, 2012
Filed:
Aug 15, 2005
Appl. No.:
11/573792
Inventors:
Bernard J. Savord - Andover MA, US
Martha Grewe Wilson - Andover MA, US
Wojtek Sudol - Andover MA, US
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
H01L 41/09
US Classification:
310334, 310311
Abstract:
An ultrasound transducer () comprises a combined individual die integrated circuit () and an array of acoustic elements () coupled to the combined individual die integrated circuit via an array of flip-chip bumps (). The combined individual die integrated circuit includes a first integrated circuit die () aligned with at least one additional integrated circuit die (,()). In addition, the first integrated circuit die, the at least one additional die integrated circuits, and the array of acoustic elements together form a large aperture transducer array.

Ultrasound Transducer Featuring A Pitch Independent Interposer And Method Of Making The Same

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US Patent:
8330332, Dec 11, 2012
Filed:
Jul 20, 2007
Appl. No.:
12/446036
Inventors:
Johannes W. Weekamp - Beek en Donk, NL
Samuel R. Peters - Burnham PA, US
Richard E. Davidsen - Andover MA, US
Wojtek Sudol - Andover MA, US
Assignee:
Koninklijke Philips Electronics N.V. - Eindhoven
International Classification:
H01L 41/00
US Classification:
310334
Abstract:
An ultrasound transducer () comprises an application specific integrated circuit (ASIC) (), an array of acoustic elements (), and a pitch independent interposer (). The ASIC () includes a plurality of contact pads () on a surface of the ASIC that are separated from adjacent ones thereof by a first pitch. The acoustic elements () of the array () are separated from adjacent ones thereof by a second pitch. In addition, the pitch independent interposer () features a plurality of conductive elements () separated from adjacent ones thereof by a third pitch different from both the first pitch and the second pitch. The pitch independent interposer () is electrically coupled (i) on a first side to the ASIC via a first subset of the plurality of conductive elements and (ii) on a second side to the array of acoustic elements via a second subset of the plurality of conductive elements, wherein one or more of the plurality of conductive elements () electrically couples a contact pad () of the ASIC () with a corresponding acoustic element () of the array () of acoustic elements.
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Wojtek J Sudol from Andover, MA, age ~67 Get Report