Kyle J. Doyel - Franklin TN, US Michael L. Bixenman - Old Hickory TN, US David T. Lober - Franklin TN, US Wayne Raney - White House TN, US Kevin Soucy - Nashville TN, US
International Classification:
C11D 3/20 C11D 3/30
US Classification:
510175
Abstract:
A composition effective for removing solder fluxes either as a concentrated material or when diluted with water. The composition is effective in removing all types of solder fluxes including rosin type, resin type, no-clean, low residue, lead-free, organic acid and water soluble soldering fluxes. The composition comprises tripropylene glycol butyl ether and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.
Kyle J. Doyel - Franklin TN, US Michael L. Bixenman - Old Hickory TN, US David T. Lober - Franklin TN, US Wayne Raney - White House TN, US Kevin Soucy - Nashville TN, US
Assignee:
Kyzen Corporation - Nashville TN
International Classification:
B08B 3/00 C11D 7/60 C11D 3/60
US Classification:
134 26, 510175
Abstract:
A composition effective for removing solder fluxes either as a concentrated material or when diluted with water. The composition is effective in removing all types of solder fluxes including rosin type, resin type, no-clean, low residue, lead-free, organic acid and water soluble soldering fluxes. The composition comprises tripropylene glycol butyl ether and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.
Cleaning Agent For Removal Of Contaminates From Manufactured Products
Kyle J. Doyel - Franklin TN, US Michael L. Bixenman - Old Hickory TN, US David T. Lober - Franklin TN, US Wayne Raney - White House TN, US Kevin Soucy - Nashville TN, US Ram Wissel - Franklin TN, US
A composition effective for removing contaminates from a manufactured product either as a concentrated material or when diluted with water. The composition designed for effective removal of all types of undesirable contaminates from a manufactured product, including but not limited to, solder flux, oils, greases, soil, and particulate matter. Depending on the nature of the process the cleaning composition maybe used in a multistep process. The composition contains propylene glycol phenyl ether and an alkali and has a pH of greater than 7.5. The composition may contain additional optional solvents and additives to enhance cleaning of articles or to impart other properties to the composition. The composition can be contacted with a surface to be cleaned in a number of ways and under a number of conditions depending on the manufacturing or processing variables present.
