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Warren C Middlekauff

from San Jose, CA
Age ~56
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Also known as:
Warren Claire Middlekauff, Warrer C Middlekauff, Warren C Middlekuff, Craig Middlekauff Warren, Craig Middlekauff Warrer, Warren F
Phone and address:
6145 San Buena Ct, San Jose, CA 95119
(408) 227-4212
Related to:
Lyllian Marie Breitenstein
Connected to:
Hugh E Middlekauff, 83Julie Middlekauff, 82Terry H Middlekauff, 88Carolyn A Middlemist, 82Craig S Middlemas, 45Erin M Middlemas, 34George L Middlemas, 79James C Middlemas, 52John W Middlemas, 107Karl Middleman, 71

Warren Middlekauff Phones & Addresses

  • 6145 San Buena Ct, San Jose, CA 95119 (408) 227-4212
  • 5453 Mayland Ave, San Jose, CA 95138 (408) 227-4212
  • Sacramento, CA
  • Chico, CA
  • Campbell, CA
  • 6145 San Buena Ct, San Jose, CA 95119

Work

Company: Sandisk Apr 1995 Position: Staff mechanical engineer

Education

School / High School: San Jose State University 1990 to 1994

Skills

Semiconductors • Mechanical Design • Engineering • Flash Memory • San

Industries

Semiconductors

Resumes

Resumes

Warren Middlekauff Photo 1

Staff Mechanical Engineer

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Location:
San Francisco, CA
Industry:
Semiconductors
Work:
Sandisk
Staff Mechanical Engineer
Education:
San Jose State University 1990 - 1994
Skills:
Semiconductors
Mechanical Design
Engineering
Flash Memory
San

Publications

Us Patents

Sip Based Flash Memory Card

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US Patent:
D548740, Aug 14, 2007
Filed:
May 19, 2005
Appl. No.:
29/230382
Inventors:
Hem Takiar - Fremont CA, US
Robert C. Miller - San Jose CA, US
Warren Middlekauff - San Jose CA, US
Michael W. Patterson - Portland OR, US
Shrikar Bhagath - San Jose CA, US
Assignee:
SanDisk Corporation - Milpitas CA
International Classification:
1402
US Classification:
D14436

Memory Card With Latching Mechanism For Hinged Cover

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US Patent:
7710736, May 4, 2010
Filed:
Aug 4, 2006
Appl. No.:
11/462430
Inventors:
Warren Middlekauff - San Jose CA, US
Robert C. Miller - San Jose CA, US
Assignee:
SanDisk Corporation - Milpitas CA
International Classification:
H05K 5/03
US Classification:
361737, 361755, 439638, 439 761, 235492, 257679
Abstract:
An enclosed re-programmable non-volatile memory card includes a cover that is hinged to the card to normally cover a set of external contacts to which the memory is connected but which can be rotated out of the way by hand to expose that set of contacts for connection with a mating receptacle of a host device. A second set of electrical contacts having a different pattern than the covered set may also be provided on the card. The covered set of contacts may be in accordance with the universal serial bus (USB) plug standards. A latching mechanism built into the hinged cover holds it firmly in a closed position but allows its manual release to expose the covered set of contacts. One exemplary release mechanism utilizes a resiliently held element that is moveable by hand against the resilience, and another employs a hand slideable latch.

Method For Producing Portable Memory Devices

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US Patent:
7928010, Apr 19, 2011
Filed:
Oct 20, 2006
Appl. No.:
11/551402
Inventors:
Warren Middlekauff - San Jose CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
Assignee:
SanDisk Corporation - Milpitas CA
International Classification:
H01L 21/44
US Classification:
438674
Abstract:
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e. g. , test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

Portable Memory Devices

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US Patent:
8013332, Sep 6, 2011
Filed:
Oct 20, 2006
Appl. No.:
11/551423
Inventors:
Warren Middlekauff - San Jose CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
Assignee:
SanDisk Technologies Inc. - Plano TX
International Classification:
H01L 21/66
US Classification:
257 48, 257E21001, 257E21531, 257E23001, 235492, 361737
Abstract:
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e. g. , test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

System-In-A-Package Based Flash Memory Card

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US Patent:
8022519, Sep 20, 2011
Filed:
May 19, 2005
Appl. No.:
11/133576
Inventors:
Hem Takiar - Fremont CA, US
Robert C. Miller - San Jose CA, US
Warren Middlekauff - San Jose CA, US
Michael W. Patterson - Portland OR, US
Shrikar Bhagath - San Jose CA, US
Assignee:
SanDisk Technologies Inc. - Plano TX
International Classification:
H01L 23/02
US Classification:
257678, 257679, 257681, 257723, 257687, 257E21504
Abstract:
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

System-In-A-Package Based Flash Memory Card

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US Patent:
8637978, Jan 28, 2014
Filed:
Sep 19, 2011
Appl. No.:
13/235781
Inventors:
Hem Takiar - Fremont CA, US
Robert C. Miller - San Jose CA, US
Warren Middlekauff - San Jose CA, US
Michael W. Patterson - Portland OR, US
Shrikar Bhagath - San Jose CA, US
Assignee:
SanDisk Technologies Inc. - Plano TX
International Classification:
H01L 23/12
H01L 23/02
US Classification:
257704, 257679, 257680, 257723, 257E23181
Abstract:
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.

Portable Memory Devices

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US Patent:
20110315987, Dec 29, 2011
Filed:
Sep 2, 2011
Appl. No.:
13/225263
Inventors:
Warren Middlekauff - San Jose CA, US
Robert Miller - San Jose CA, US
Charlie Centofante - Los Altos CA, US
International Classification:
H01L 23/495
H01L 21/66
US Classification:
257 48, 438 15, 257E23031, 257E21529
Abstract:
Improved techniques to produce integrated circuit products are disclosed. The improved techniques permit smaller and less costly production of integrated circuit products. One aspect of the invention concerns covering test contacts (e.g., test pins) provided with the integrated circuit products using printed ink. Once covered with the ink, the test contacts are no longer electrically exposed. Hence, the integrated circuit products are not susceptible to accidental access or electrostatic discharge. Moreover, the integrated circuit products can be efficiently produced in a small form factor without any need for additional packaging or labels to electrically isolate the test contacts.

System-In-A-Package Based Flash Memory Card

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US Patent:
20120009732, Jan 12, 2012
Filed:
Sep 19, 2011
Appl. No.:
13/235852
Inventors:
Hem Takiar - Fremont CA, US
Robert C. Miller - San Jose CA, US
Warren Middlekauff - San Jose CA, US
Michael W. Patterson - Portland OR, US
Shrikar Bhagath - San Jose CA, US
International Classification:
H01L 21/56
US Classification:
438107, 257E21502
Abstract:
A system-in-a-package based flash memory card including an integrated circuit package occupying a small overall area within the card and cut to conform to the shape of a lid for the card. An integrated circuit may be cut from a panel into a shape that fits within and conforms to the shape of lids for a finished memory card, such as for example an SD Card. The integrated circuit package may be a system-in-a-package, a multi-chip module, or other arrangement where a complete electronic system is formed in a single package.
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Warren C Middlekauff from San Jose, CA, age ~56 Get Report