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Vincent J Kirchhoff

from Morgan Hill, CA
Age ~62
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Also known as:
Vincent Joseph Kirchhoff, Vincent M Kirchhoff, Vince J Kirchhoff, Vince M Kirchhoff, Vince F Kirchhoff, Vincent Joseph Kirchoff
Phone and address:
17210 Copper Hill Dr, Morgan Hill, CA 95037
(408) 779-8825
Related to:
Benjamin Kirchhoff, 39Jennifer L Kirchhoff, 61Vincent Joseph Kirchoff, 62Sally T LambertAudrey D Ross, 94Kevin Lambert, 41Robert B Lambert, 65Jennifer L ArbogastSteven R Coe, 75Linda A Ross, 70Kristen Palese MooreDonald L Palese, 78J M PaleseLaura E Ross, 61Ashley N Chandler, 40Bernard D Arbogast, 60
Connected to:
Alice Kirchhoff, 99Alice P Kirchhofer, 57April D Kirchhoff, 40Brian M Kirchhoff, 49Calvin H Kirchhoff, 97Caryn A Kirchhoff, 37Christopher W Kirchhof, 43Claire A Kirchhoff, 43Daniel W Kirchhoff, 87Daniel C Kirchhofer, 41

Vincent Kirchhoff Phones & Addresses

  • 17210 Copper Hill Dr, Morgan Hill, CA 95037 (408) 779-8825
  • 1898 Harmil Way, San Jose, CA 95125
  • 249 Los Gatos Blvd, Los Gatos, CA 95030
  • Peoria, AZ
  • Santa Clara, CA
  • Poughkeepsie, NY
  • 17210 Copper Hill Dr, Morgan Hill, CA 95037

Publications

Us Patents

Diffusion Bonded Fluid Flow Apparatus Useful In Semiconductor Manufacturing

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US Patent:
20080296351, Dec 4, 2008
Filed:
May 31, 2007
Appl. No.:
11/756248
Inventors:
Mark Crockett - Cupertino CA, US
John W. Lane - San Jose CA, US
Vincent Kirchhoff - Morgan Hill CA, US
Marcel E. Josephson - San Jose CA, US
Hong P. Gao - Austin TX, US
Bhaswan Manjunath - Bangalore, IN
International Classification:
B23K 20/24
US Classification:
228164
Abstract:
The present invention relates to a method of diffusion bonding of steel and steel alloys, to fabricate a fluid delivery system of the kind which would be useful in semiconductor processing and in other applications which require high purity fluid handling.

Stainless Steel Or Stainless Steel Alloy For Diffusion Bonding

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US Patent:
20080296354, Dec 4, 2008
Filed:
May 31, 2007
Appl. No.:
11/756320
Inventors:
MARK CROCKETT - Cupertino CA, US
John W. Lane - San Jose CA, US
Vincent Kirchhoff - Morgan Hill CA, US
Marcel E. Josephson - San Jose CA, US
Hong P. Gao - Austin TX, US
Bhaswan Manjunath - Bangalore, IN
International Classification:
B23K 20/00
C22C 38/18
US Classification:
228193, 420 8
Abstract:
The present invention relates to stainless steel sheets which would be useful in semiconductor processing and in other applications which require high purity fluid handling. The invention also relates to a method of selecting and processing such sheets.

Method Of Improving Surface Roughness Of Fluid Flow Conduits Within A Diffusion Bonded Fluid Flow Structure

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US Patent:
20090057375, Mar 5, 2009
Filed:
Oct 21, 2008
Appl. No.:
12/288604
Inventors:
Mark Crockett - Cupertino CA, US
John W. Lane - Santa Clara CA, US
Vincent Kirchhoff - Morgan Hill CA, US
Marcel E. Josephson - San Jose CA, US
Hong P. Gao - Austin TX, US
Bhaswan Manjunath - Bangalore, IN
International Classification:
B23K 31/12
US Classification:
228103
Abstract:
The present invention relates to a method of diffusion bonding sheets of patterned material to fabricate a fluid delivery system; and particularly relates to a method of improving the interior surface roughness of fluid flow conduits formed within the diffusion bonded fluid delivery system structure.

Method Of Preventing Bonding Between A Load Distribution Block And A Plate Set Of Stacked Sheets During Diffusion Bonding Of A Fluid Flow Structure

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US Patent:
20090072009, Mar 19, 2009
Filed:
Oct 21, 2008
Appl. No.:
12/288631
Inventors:
Mark Crockett - Cupertino CA, US
John W. Lane - Santa Clara CA, US
Vincent Kirchhoff - Morgan Hill CA, US
Marcel E. Josephson - San Jose CA, US
Hong P. Gao - Austin TX, US
Bhaswan Manjunath - Bangalore, IN
International Classification:
B23K 31/02
US Classification:
228190, 228212
Abstract:
The present invention relates to diffusion bonding of patterned sheets to form a fluid flow handling structure, and to a method of preventing bonding between a load distribution block and a plate set of stacked sheets during the diffusion bonding process.
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Vincent J Kirchhoff from Morgan Hill, CA, age ~62 Get Report