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Vilas N Koinkar

from Starkville, MS
Age ~61
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Also known as:
Vilas N Koinker, Vilas R
Related to:
Arjun KoinkarSeema Koinkar, 52
Connected to:
Christian C Koinonia, 46Darryl M Koins, 49Aakash P Koirala, 27Gita Koirala, 31Govinda Koirala, 38Kabindra Koirala, 35Madan Koirala, 33Madhav Koirala, 33Mamata K Koirala, 44Parbati G Koirala, 49

Vilas Koinkar Phones & Addresses

  • Starkville, MS
  • Zionsville, IN
  • 1050 Beacon Bay Dr, Carlsbad, CA 92011 (760) 899-3429
  • Wilmington, DE
  • San Diego, CA

Publications

Us Patents

Fabrication Of Devices With Fibers Engaged To Grooves On Substrates

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US Patent:
6719608, Apr 13, 2004
Filed:
Apr 19, 2002
Appl. No.:
10/126930
Inventors:
Vilas Koinkar - Carlsbad CA
Timothy C. Collins - Carlsbad CA
Joannes M. Costa - Carlsbad CA
Joseph A. Levert - Vista CA
Assignee:
Oluma, Inc. - Carlsbad CA
International Classification:
B24B 4900
US Classification:
451 8, 451460
Abstract:
Fabrication techniques for polishing fibers engaged in grooves on substrates. A protection template assembly is disclosed to protect the unpolished portions of fibers. Chemical mechanical polishing may be used to achieve high fabrication throughput and high polishing uniformity. Optical monitoring may be used to monitor the polishing in real time.

Fabrication Of Devices With Fibers Engaged To Grooves On Substrates

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US Patent:
6869347, Mar 22, 2005
Filed:
Mar 5, 2004
Appl. No.:
10/794727
Inventors:
Vilas Koinkar - Carlsbad CA, US
Timothy C. Collins - Carlsbad CA, US
Joannes M. Costa - Carlsbad CA, US
Joseph A. Levert - Vista CA, US
Assignee:
Oluma, Inc. - Carlsbad CA
International Classification:
B24B041/06
US Classification:
451364, 451460
Abstract:
Fabrication techniques for polishing fibers engaged in grooves on substrates. A protection template assembly is disclosed to protect the unpolished portions of fibers. Chemical mechanical polishing may be used to achieve high fabrication throughput and high polishing uniformity. Optical monitoring may be used to monitor the polishing in real time.

Polishing Pad Surface On Hollow Posts

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US Patent:
20010039175, Nov 8, 2001
Filed:
Feb 28, 2001
Appl. No.:
09/795243
Inventors:
Reza Golzarian - Santa Clara CA, US
Vilas Koinkar - Carlsbad CA, US
International Classification:
B24D011/00
US Classification:
451/526000, 451/527000, 451/529000, 451/539000
Abstract:
A polishing pad comprising: a base from which extends multiple posts having top surfaces that collectively provide a polishing surface on the polishing pad, and each of the top surfaces being recessed with an opening to provide a second cutting edge on the post, and the opening providing a reservoir for polishing fluid.

Methods For Break-In And Conditioning A Fixed Abrasive Polishing Pad

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US Patent:
20010053660, Dec 20, 2001
Filed:
Jan 4, 2001
Appl. No.:
09/754424
Inventors:
Vilas Koinkar - Wilmington DE, US
Reza Golzarian - Santa Clara CA, US
Matthew VanHanehem - Bear DE, US
Qiuliang Luo - Newport Beach CA, US
James Shen - Aloha OR, US
Peter Burke - Avondale PA, US
International Classification:
B24B001/00
US Classification:
451/056000
Abstract:
The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP). The present invention also relates to a method of determining the wear rate of a fixed abrasive polishing pad.

Control Of Removal Rates In Cmp

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US Patent:
20020019202, Feb 14, 2002
Filed:
Feb 28, 2001
Appl. No.:
09/795241
Inventors:
Terence Thomas - Newark DE, US
Qianqiu (Christine) Ye - Wilmington DE, US
Joseph So - Newark DE, US
Peter Burke - Vancouver WA, US
Vikas Sachan - Richardson TX, US
Elizabeth Langlois - Wilimington DE, US
Keith Pierce - Colorado Springs CO, US
Craig Lack - Wilmington DE, US
David Gettman - Fresno CA, US
Hiroyuki Senoo - Kohriyama-Shi, JP
Kouchi Yoshida - Yamato Kohriyama-Shi, JP
Yoshikazu Nishida - Yamato Kohriyama-shi, JP
Vilas Koinkar - Wilmington DE, US
Raymond Lavoie - Chesapeake City MD, US
International Classification:
B24B007/22
US Classification:
451/057000
Abstract:
A two-step method for chemical mechanical polishing of a semiconductor substrate having successive layers, comprised of, a metal layer, an underlying barrier film and an underlying dielectric layer. The first polishing step is performed utilizing a slurry composition selective to the metal in the metal layer, to remove the metal at a high removal rate during polishing, and the second polishing step is performed utilizing a slurry composition selective to the barrier film and least selective to the metal layer and the underlying dielectric layer. In an alternate embodiment, the second polishing step is performed with a slurry equally selective to the barrier layer and the underlying dielectric layer and least selective to the metal of the metal layer, to remove the barrier layer at a high removal rate during polishing, and level a surface of the dielectric layer to the surface of the metal interconnection structure in the underlying dielectric layer.

Methods For Break-In And Conditioning A Fixed Abrasive Polishing Pad

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US Patent:
20020173235, Nov 21, 2002
Filed:
Mar 29, 2002
Appl. No.:
10/109821
Inventors:
Vilas Koinkar - Wilmington DE, US
Reza Golzarian - Santa Clara CA, US
Matthew VanHanehem - Bear DE, US
Qiuliang Luo - Newport Beach CA, US
James Shen - Portland OR, US
Peter Burke - Avondale PA, US
International Classification:
B24B001/00
US Classification:
451/021000, 451/056000
Abstract:
The present invention relates to methods for break-in and conditioning polishing pads containing a fixed abrasive matrix. The polishing pads are useful for chemical-mechanical polishing (CMP). The present invention also relates to a method of determining the wear rate of a fixed abrasive polishing pad.
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Vilas N Koinkar from Starkville, MS, age ~61 Get Report