US Patent:
20230027585, Jan 26, 2023
Inventors:
- Santa Clara CA, US
Ramadass Nagarajan - Portland OR, US
Anand Jayaraman - Sunnyvale CA, US
Vijeta Prasad - Fremont CA, US
Justin Reyes - San Jose CA, US
Gurucharapathy Karthikeyan - Karnataka, IN
International Classification:
H04L 45/745
H04L 49/109
H04L 45/16
Abstract:
In one embodiment, a first chiplet includes: a plurality of agents to generate messages, each of the messages having a destination port identifier comprising a first portion to identify a destination chiplet and a second portion to identify a destination agent on the destination chiplet; a die-to die bridge to couple the first chiplet to a second chiplet; a fabric coupled to the die-to-die bridge to route communications between the plurality of agents, where a first agent is to generate a first message having a first destination port identifier; and a first fabric adapter coupled to the first agent, the first fabric adapter to direct the first message to the die-to-die bridge when the first portion of the first destination port identifier identifies a second chiplet as the destination chiplet. Other embodiments are described and claimed.