Victor A Watson

54518180, Sep 19, 1995

Mar 18, 1994

8/210803

Steven S. Chan - Alhambra CA
Russel K. Kam - Torrance CA
Victor J. Watson - Rancho Palos Verdes CA

TRW Inc. - Redondo Beach CA

H01L 2302
H01L 2312

257728

An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the peripheral edge of the base, defining a central aperture. A solid conductive layer substantially covers the first surface of the dielectric substrate and a series of conductive transmission lines are formed on an opposing second surface of the substrate. A dielectric layer is disposed upon and substantially covers the transmission lines and the second surface of the substrate upon which they are formed. A seal ring is disposed upon and the dielectric layer and a conductor electrically connects the device to the transmission lines. A lid is sealed atop the seal ring completes the hermetical seal for the device.

53769015, Dec 27, 1994

May 28, 1993

8/069063

Steven S. Chan - Alhambra CA
Victor J. Watson - Rancho Palos Verdes CA
Cheng C. Yang - Torrance CA
Stuart Kam - Torrance CA

TRW Inc. - Redondo Beach CA

H03H 738

333 33

A hermetically sealable millimeter waveguide launch transition feedthrough for channelling high frequency electrical signals in a circuit which includes at least one waveguide. An aperture is formed in one wall of the waveguide and a conductive pin passes through the aperture. The pin is sealed therein by a dielectric material which surrounds the pin so as to isolate it from the waveguide wall. A probe head is disposed at one end of the conductive pin and within the waveguide. The opposite end of the pin contains a second probe head or other circuit connector. The transition may be effectively implemented in waveguide-to-waveguide or waveguide-to-device applications as well as in colinear device housing applications.