Victor A Watson

6638366, Oct 28, 2003

May 15, 2001

09/855962

Michael D. Lammert - Manhattan Beach CA
Victor J. Watson - Rancho Palos Verdes CA
John M. DiMond - San Pedro CA
Michael E. Barsky - Sherman Oaks CA

Northrop Grumman Corporation - Redondo Beach CA

B08B 302

134 33, 134 2, 134 6, 134 7, 134 18, 134144, 134 32

Semiconductor wafer ( ) are uniformly and thoroughly cleaned of particulate and organic contaminants by sweeping the wafer with a hydraulic broom that sprays cleaning solution onto the wafer. The broom contains an aspirating nozzle ( ) for connection to a source of pressurized gas, such as nitrogen, and to a source of cleaning fluid, such as acetone, wherein cleaning fluid aspirated by the gas stream is expressed through the nozzle outlet to impact the surface of the wafer, dislodging particulate matter and dissolving organic contaminants. A programmed controller ( ) controls movement of the hydraulic broom relative to the wafer to ensure that the entire surface is cleaned and permits a variety of sweeping patterns.

54518180, Sep 19, 1995

Mar 18, 1994

8/210803

Steven S. Chan - Alhambra CA
Russel K. Kam - Torrance CA
Victor J. Watson - Rancho Palos Verdes CA

TRW Inc. - Redondo Beach CA

H01L 2302
H01L 2312

257728

An improved millimeter wave device package design in which the package includes a dielectric substrate disposed upon a supporting base such that the substrate extends substantially along the peripheral edge of the base, defining a central aperture. A solid conductive layer substantially covers the first surface of the dielectric substrate and a series of conductive transmission lines are formed on an opposing second surface of the substrate. A dielectric layer is disposed upon and substantially covers the transmission lines and the second surface of the substrate upon which they are formed. A seal ring is disposed upon and the dielectric layer and a conductor electrically connects the device to the transmission lines. A lid is sealed atop the seal ring completes the hermetical seal for the device.

53769015, Dec 27, 1994

May 28, 1993

8/069063

Steven S. Chan - Alhambra CA
Victor J. Watson - Rancho Palos Verdes CA
Cheng C. Yang - Torrance CA
Stuart Kam - Torrance CA

TRW Inc. - Redondo Beach CA

H03H 738

333 33

A hermetically sealable millimeter waveguide launch transition feedthrough for channelling high frequency electrical signals in a circuit which includes at least one waveguide. An aperture is formed in one wall of the waveguide and a conductive pin passes through the aperture. The pin is sealed therein by a dielectric material which surrounds the pin so as to isolate it from the waveguide wall. A probe head is disposed at one end of the conductive pin and within the waveguide. The opposite end of the pin contains a second probe head or other circuit connector. The transition may be effectively implemented in waveguide-to-waveguide or waveguide-to-device applications as well as in colinear device housing applications.