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Venkatraman Iyer Phones & Addresses

  • Austin, TX
  • Round Rock, TX
  • Beaverton, OR
  • 15381 NW Blakely Ln, Portland, OR 97229 (503) 533-2225
  • 8375 Brentwood St, Portland, OR 97225 (503) 297-0631
  • Berkeley, CA

Work

Company: Microchip technology Aug 2016 Position: Staff architect

Education

School / High School: University of California, Berkeley 1984 to 1987 Specialities: Computer Science

Skills

Semiconductors • Embedded Systems • Soc • Asic • Product Management

Industries

Semiconductors

Professional Records

License Records

Venkatraman S Iyer

License #:
24366 - Expired
Issued Date:
Jan 25, 2006
Renew Date:
Jun 1, 2012
Expiration Date:
Nov 30, 2013
Type:
Certified Public Accountant

Resumes

Resumes

Venkatraman Iyer Photo 1

Staff Architect

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Location:
Austin, TX
Industry:
Semiconductors
Work:
Microchip Technology
Staff Architect

Intel Corporation 2005 - Jun 2016
Senior Staff Io Architect

Intel Corporation 2001 - 2004
Staff Platform Applications Engineer

Intel Corporation 1997 - 2000
Senior Io Design Engineer

Intel Corporation 1995 - 1996
Senior Verification Engineer
Education:
University of California, Berkeley 1984 - 1987
Indian Institute of Technology, Bombay 1974 - 1979
Skills:
Semiconductors
Embedded Systems
Soc
Asic
Product Management

Publications

Us Patents

Method And Apparatus For High Speed Signaling

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US Patent:
6359951, Mar 19, 2002
Filed:
Jun 3, 1998
Appl. No.:
09/089923
Inventors:
Jeffrey C. Morriss - Cornelius OR
Venkatraman Iyer - Portland OR
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2300
US Classification:
375377, 370522, 326 86
Abstract:
Briefly, in accordance with one embodiment of the invention, a method of performing high speed signaling includes the following. A preamble signal and an end of packet (EOP) signal are transmitted at a low frequency using rail-to-rail voltage signal levels. Later, high frequency signaling is transmitted using a voltage signal level swing that is less than rail-to-rail.

Signal Repeater For Voltage Intolerant Components Used In A Serial Data Line

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US Patent:
6744810, Jun 1, 2004
Filed:
Dec 10, 1999
Appl. No.:
09/459744
Inventors:
Venkatraman Iyer - Beaverton OR
John Todd West - Seattle WA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
G06F 15167
US Classification:
375214, 375257, 709213
Abstract:
A signal repeater for use between a serial data line and a peripheral device is disclosed. The signal repeater receives bus signals on the serial data line at a first voltage and translates the bus signal into a device signal of a second voltage. Also, the signal repeater is operative to receives device signals from the device at the second voltage and translates the device signal into a bus signal at the first voltage.

Link Power Savings With State Retention

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US Patent:
20100330927, Dec 30, 2010
Filed:
Jun 30, 2009
Appl. No.:
12/495706
Inventors:
Naveen Cherukuri - San Jose CA, US
Jeffrey Wilcox - Boulder Creek CA, US
Venkatraman Iyer - Portland OR, US
Selim Bilgin - Hillsboro OR, US
David D. Dunning - Portland OR, US
Robin Tim Frodsham - Portland OR, US
Theodore Z. Schoenborn - Portland OR, US
Sanjay Dabral - Palo Alto CA, US
International Classification:
H04B 7/00
US Classification:
455 68, 455522
Abstract:
Methods and apparatus relating to link power savings with state retention are described. In one embodiment, one or more components of two agents coupled via a serial link are turned off during idle periods while retaining link state in each agent. Other embodiments are also disclosed.

Method And System Of Adapting Communication Links To Link Conditions On A Platform

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US Patent:
20120079160, Mar 29, 2012
Filed:
Sep 24, 2010
Appl. No.:
12/890252
Inventors:
VENKATRAMAN IYER - Austin TX, US
Arvind Kumar - Brookline MA, US
Santanu Chaudhuri - Mountain View CA, US
Darren S. Jue - Sunnyvale CA, US
Dennis R. Halicki - Hillsboro OR, US
International Classification:
G06F 13/36
US Classification:
710311
Abstract:
A method and system to adapt communication links statically and/or dynamically to their individual link conditions on a platform. The communicatively coupled devices have logic to adapt one or more settings of a respective one or more communication links with another device based at least in part on a respective metric of received data patterns from the respective one or more communication links. The communicatively coupled devices in the platform have a back channel to allow feedback or information to be sent from one receiving device to a transmitting device in one embodiment of the invention.

Enhanced Interconnect Link Width Modulation For Power Savings

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US Patent:
20130007491, Jan 3, 2013
Filed:
Jul 1, 2011
Appl. No.:
13/175794
Inventors:
VENKATRAMAN IYER - Austin TX, US
ROBERT G. BLANKENSHIP - Tacoma WA, US
DENNIS R. HALICKI - Hillsboro OR, US
International Classification:
G06F 1/32
US Classification:
713321
Abstract:
Methods and apparatus relating to enhanced interconnect link width modulation for power savings are described. In one embodiment, the width of a link is modified from a first width to a second width in response to a power management flit, while non-idle flits continue to be transmitted over the link after transmission of the power management flit. Other embodiments are also disclosed and claimed.

Repurposing Data Lane As Clock Lane By Migrating To Reduced Speed Link Operation

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US Patent:
20130007502, Jan 3, 2013
Filed:
Jul 1, 2011
Appl. No.:
13/175798
Inventors:
VENKATRAMAN IYER - Austin TX, US
ROBERT G. BLANKENSHIP - Tacoma WA, US
ALLEN J. BAUM - Palo Alto CA, US
International Classification:
G06F 11/20
US Classification:
714 3, 714E11071
Abstract:
Methods and apparatus relating to repurposing a data lane as a clock lane by migrating to reduced speed link operation are described. In one embodiment, speed of a link is reduced upon detection of failure on a clock lane of the link and one of a plurality of data lanes of a link is repurposed as a replacement clock lane. Other embodiments are also disclosed and claimed.

Method And System Of Reducing Power Supply Noise During Training Of High Speed Communication Links

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US Patent:
20130279622, Oct 24, 2013
Filed:
Sep 30, 2011
Appl. No.:
13/976680
Inventors:
Venkatraman Iyer - Austin TX, US
Santanu Chaudhuri - Mountain View CA, US
Stephen S. Chang - Portland OR, US
International Classification:
H04L 1/00
US Classification:
375285
Abstract:
A method and system to reduce the power supply noise of a platform during the training of high speed communication links. In one embodiment of the invention, the device has logic to stagger a bit lock pattern for each of one or more communication links and scramble a training sequence for each of the one or more communication links. By doing so, it removes the need for anti-noise circuits and in turn, reduces the silicon area and power of the devices. Further, by having the logic in the physical layers to facilitate the training of the communication links, it eliminates the need to redesign the package of the devices to shift the resonant frequencies.

Electrical Margining Of Multi-Parameter High-Speed Interconnect Links With Multi-Sample Probing

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US Patent:
20140002102, Jan 2, 2014
Filed:
Dec 28, 2012
Appl. No.:
13/729756
Inventors:
Thanunathan Rangarajan - Bangalore, IN
Shreesh Chhabbi - Bangalore, IN
Arvind A. Kumar - Beaverton OR, US
Venkatraman Iyer - Austin TX, US
International Classification:
G01R 31/04
US Classification:
324538
Abstract:
Methods and apparatus relating to electrical margining of multi-parameter high-speed interconnect links with multi-sample probing are described. In one embodiment, logic is provided to generate one or more parameter values, corresponding to an electrical operating margin of an interconnect. The one or more parameter values are generated based on a plurality of eye observation sets to be detected in response to operation of the interconnect in accordance with a plurality of parameter sets (e.g., by using quantitative optimization techniques). In turn, the interconnect is to be operated at the one or more parameter values if it is determined that the one or more parameter values cause the interconnect to operate at an optimum level relative to an operation of the interconnect in accordance with one or more less optimum parameter levels. Other embodiments are also disclosed and claimed.
Venkatraman E Iyer from Austin, TX, age ~67 Get Report