Venita Dyer Phones & Addresses
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5621 Bowcroft St, Los Angeles, CA 90016
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6259 La Tijera Blvd, La, CA 90056
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Windsor Hills, CA
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Torrance, CA
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Kenner, LA
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Rancho Cucamonga, CA
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Sherman Oaks, CA
Publications
Us Patents
Sealing Electronic Packages Containing Bumped Hybrids
View pageUS Patent:
60450304, Apr 4, 2000
Filed:
Mar 13, 1997
Appl. No.:
8/816632
Inventors:
O. Glenn Ramer - Los Angeles CA
John J. Drab - Santa Barbara CA
Venita L. Dyer - Sherman Oaks CA
John J. Drab - Santa Barbara CA
Venita L. Dyer - Sherman Oaks CA
Assignee:
Raytheon Company - Lexington MA
International Classification:
B23K 3102
B23K 120
B23K 120
US Classification:
2281246
Abstract:
A method of packaging hybrid wafers or die that are interconnected using soft metal bumps, such as indium, in a sealed ceramic package. The present invention passivates the hybrid die that are to be interconnected by way of the bumps, so that the metal in the bumps (indium) does not wet the surface of the hybrid die when the ceramic package is sealed at high temperature. Vias are formed in the passivated surfaces to expose underlying contact areas. Bumps are then formed on the contact areas, and the bumped and passivated hybrid die are electrically interconnected. The ceramic package containing the electrically interconnected hybrid die is processed at a temperature above the melting temperature of the bumps to attach a ceramic cover to the ceramic package. The method is performed at a temperature well in excess of the melting temperature of the bumps (. about. 155. degree. Celsius for indium), typically on the order of 325. degree. Celsius.
Hydrogen Getters And Methods For Fabricating Sealed Microelectronic Packages Employing Same
View pageUS Patent:
62038699, Mar 20, 2001
Filed:
Nov 12, 1996
Appl. No.:
8/747709
Inventors:
Thomas K. Dougherty - Playa Del Rey CA
O. Glenn Ramer - Los Angeles CA
Venita L. Dyer - Sherman Oaks CA
O. Glenn Ramer - Los Angeles CA
Venita L. Dyer - Sherman Oaks CA
International Classification:
B32B 104
B32B 1508
B32B 2738
B32B 1508
B32B 2738
US Classification:
428 357
Abstract:
A hydrogen getter comprising a thin film having a layer of inert material, and a hydrogen reactive material disposed in or attached to the layer of inert material. The hydrogen reactive material may comprise palladium oxide powder, and the layer of inert material may comprise an epoxy resin. Various forms of the hydrogen reactive material may be used including porous composite, or a solid composite comprising a powder coated organic thin film, for example. An alternative gettering system that is operative in an oxygen environment uses a thin film of hydrogen reactive material that catalyzes the reaction of hydrogen and oxygen to form water. Improved sealed microelectronic packages are also disclosed along with methods of fabricating same.