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Tygh James Newton

from Sherwood, OR
Age ~51

Tygh Newton Phones & Addresses

  • 18249 Mcconnell Rd, Sherwood, OR 97140 (503) 625-2427
  • 16100 Century Dr, Sherwood, OR 97140
  • Miami Beach, FL
  • 1228 Hartford Dr, Forest Grove, OR 97116
  • 19000 Evergreen St, Hillsboro, OR 97124 (503) 617-0104
  • 1580 187Th Ave, Beaverton, OR 97006 (503) 259-0505

Resumes

Resumes

Tygh Newton Photo 1

Process Development Manager

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Location:
18249 southwest Mcconnell Ct, Sherwood, OR 97140
Industry:
Information Technology And Services
Work:
Xerox May 2005 - Feb 2012
Process Development Engineer

Xerox May 2005 - Feb 2012
Process Development Manager

Merix Corporation Sep 2003 - May 2005
Process Engineer

Kyocera Tycom Jan 2000 - Sep 2003
Applications Engineer
Education:
Oregon State University 1996 - 1999
Masters, Industrial and Manufacturing Engineering
Eastern Oregon University 1992 - 1996
Bachelors, Bachelor of Science, Physics
Skills:
Dflss
Black Belt
Visual Basic
Microsoft Excel
Ms Access
Shainin
Analytic Problem Solving
Engineering Management
Process Improvement
Access
Six Sigma
Cross Functional Team Leadership
Process Engineering
Design For Manufacturing
Lean Manufacturing
Engineering
Minitab
Design of Experiments
Testing
Fmea
Process Simulation
Product Development
Tygh Newton Photo 2

Process Development Engineer At Xerox

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Position:
Process Development Engineer at Xerox
Location:
Portland, Oregon Area
Industry:
Electrical/Electronic Manufacturing
Work:
Xerox
Process Development Engineer

Publications

Us Patents

Electrically Grounded Inkjet Ejector And Method For Making An Electrically Grounded Inkjet Ejector

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US Patent:
20110175971, Jul 21, 2011
Filed:
Jan 19, 2010
Appl. No.:
12/689320
Inventors:
Tygh J. Newton - Sherwood OR, US
John R. Andrews - Fairport NY, US
David L. Knierim - Wilsonville OR, US
Assignee:
XEROX CORPORATION - Norwalk CT
International Classification:
B41J 2/045
US Classification:
347 71
Abstract:
An inkjet ejector provides electrical conductors for grounding electrically isolated layers in the ejector while electrically coupling a transducer of the ejector to a firing signal circuit. The inkjet ejector includes a diaphragm plate have a first side and a second side, a plurality of transducers mounted to the first side of the diaphragm plate, a polymer layer located on the second side of the diaphragm plate, an electrically conductive layer that is isolated from electrical ground by the polymer layer, and a plurality of electrical conductors, at least one of the electrical conductors extends from the electrically conductive layer to electrical ground through the polymer layer and other electrical conductors of the plurality of electrical conductors extend from each transducer to a firing signal circuit, the electrical conductor extending from the electrically conductive layer being the same material as the other electrical conductors in the plurality of electrical conductors.

Suspended Lattice For Electrical Interconnects

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US Patent:
20130180771, Jul 18, 2013
Filed:
Jan 17, 2012
Appl. No.:
13/352215
Inventors:
Chad David Freitag - Portland OR, US
Tygh James Newton - Sherwood OR, US
Chad Johan Slenes - Sherwood OR, US
Assignee:
XEROX CORPORATION - Norwalk CT
International Classification:
H05K 1/00
H05K 3/00
US Classification:
174261, 216 17
Abstract:
An electrical interconnect has a circuit substrate and an electrical connection point on the circuit substrate. The electrical connection point includes a lattice of conductive material that is adjacent a gap in the circuit substrate and has anchor points that are attached to the circuit substrate. In some configurations, a conductive epoxy encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.

Suspended Lattice For Electrical Interconnects

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US Patent:
20170135228, May 11, 2017
Filed:
Jan 19, 2017
Appl. No.:
15/409807
Inventors:
- Norwalk CT, US
Tygh James Newton - Sherwood OR, US
Chad Johan Slenes - Sherwood OR, US
International Classification:
H05K 3/40
Abstract:
A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.
Tygh James Newton from Sherwood, OR, age ~51 Get Report