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Tuyen Pham Phones & Addresses

  • San Gabriel, CA
  • Houston, TX

Professional Records

License Records

Tuyen Minh Pham

License #:
PST.017896 - Expired
Issued Date:
Apr 21, 2006
Expiration Date:
Dec 31, 2007
Type:
Pharmacist

Tuyen Tk Pham

License #:
1214000317
Category:
Wax Technician License

Tuyen Thi Pham

Address:
10310 Grand Brk Dr, Houston, TX 77089
Phone:
(713) 376-6685
License #:
1440499 - Active
Category:
Cosmetology Operator
Expiration Date:
May 15, 2017

Tuyen Lam Pham

Address:
13107 Gatton Park Dr, Houston, TX 77066
Phone:
(281) 777-4136
License #:
1464110 - Active
Category:
Cosmetology Manicurist
Expiration Date:
Sep 9, 2017

Tuyen T Pham

Address:
7330 Autumn Sun Dr, Houston, TX 77083
Phone:
(713) 517-9240
License #:
1591825 - Active
Category:
Cosmetology Manicurist
Expiration Date:
May 8, 2017

Tuyen T Pham

Address:
7330 Autumn Sun Dr, Houston, TX 77083
Phone:
(713) 517-9240
License #:
1677130 - Active
Category:
Cosmetology Esthetician
Expiration Date:
Nov 3, 2018

Tuyen Thi Pham

Address:
6323 Lost Timber Ln, Houston, TX 77066
Phone:
(281) 445-0014
License #:
INSTDE00002469 - Active
Expiration Date:
Apr 29, 2017

Tuyen T Pham

License #:
70783 - Expired
Category:
Nursing Support
Issued Date:
Jul 22, 2005
Effective Date:
Nov 15, 2007
Type:
Nurse Aide

Business Records

Name / Title
Company / Classification
Phones & Addresses
Tuyen Pham
President
ASOEN BRIDAL, INC
Ret Women's Clothing
232 W Maple Ave, Monrovia, CA 91016
511 E Garvey Ave, Monterey Park, CA 91755
Tuyen C. Pham
President
PHENO-TEK, INC
2221 W Olive Ave #O, Burbank, CA 91506
Tuyen Kim Pham
Managing
Oddball Properties, LLC
Nonresidential Building Operator · Property Rental · Rental Properties
6828 Rio Grande Dr, Mira Loma, CA 91752
5302 E Ryals Ln, Orange, CA 92869

Publications

Us Patents

Temperature-Controlled Semiconductor Wafer Chuck System

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US Patent:
6583638, Jun 24, 2003
Filed:
Jan 26, 1999
Appl. No.:
09/238009
Inventors:
Simon Costello - Los Angeles CA
Tuyen Paul Pham - Sunland CA
Assignee:
Trio-Tech International - San Fernando CA
International Classification:
G01R 102
US Classification:
324760, 3241581
Abstract:
A temperature-controlled semiconductor wafer chuck system, the chuck being configured for mounting on a prober stage of a wafer probe test station, the chuck having a top surface and a bottom surface and including a heat sink configured for removing thermal energy from the chuck, a primary heater configured to add heat to the chuck adjacent the top surface of the chuck and a secondary heater adjacent the bottom of the chuck, whereby the temperature of the top surface of the chuck and the bottom of the chuck can be independently controlled; and wherein the chuck can include a plurality of layers above the heat sink which are connected so as to accommodate differential expansion and contraction and thereby minimize distortion of the chuck due to thermal effects; and wherein the heat sink and associated layers integrally connected are configured to stiffen the chuck and resist deformation due to forces applied to the chuck by probe pins.

Temperature Controlled Wafer Chuck System With Low Thermal Resistance

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US Patent:
6605955, Aug 12, 2003
Filed:
Jan 26, 2000
Appl. No.:
09/491275
Inventors:
Simon Costello - Los Angeles CA
Tuyen Paul Pham - Sunland CA
Assignee:
Trio-Tech International - Van Nuys CA
International Classification:
G01R 3102
US Classification:
324760, 3241581
Abstract:
A temperature-controlled semiconductor wafer chuck system, the chuck being configured for mounting on a prober stage of a wafer probe test station. The chuck having a top surface and a bottom surface including a heat sink configuration for removal of thermal energy from the chuck. A primary heater configured to add heat to the chuck is adjacent the top surface of the chuck. A secondary heater is adjacent to the bottom of the chuck, whereby the temperature of the top surface of the chuck and the bottom of the chuck can be independently controlled. The chuck may include a plurality of layers above the heat sink which may be connected to accommodate differential expansion and contraction, thereby minimizing distortion of the chuck due to thermal effects. The heat sink and associated layers are integrally connected and are configured to stiffen the chuck to resist deformation due to forces applied to the chuck by probe pins. Still further, the chuck has cooling channels closer to the top surface than the heater and is disclosed to reduce the thermal resistance of the chuck.
Tuyen K Pham from San Gabriel, CA, age ~53 Get Report