Inventors:
William H. Hill - Pala CA
John B. Gabaldon - San Diego CA
Todd G. Wieseler - Carlsbad CA
Assignee:
Palomar Technologies, Inc. - Vista CA
International Classification:
B65H 2000
Abstract:
A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical sidewalls, a substantially open top, a back opening and a front opening. The wire slacking device further includes a pressurized fluid source and first and second fluid orifices for receiving a pressurized fluid from the pressurized fluid source. The fluid orifices extend through the first or second sidewall of the wire support chamber with the second fluid orifice being positioned downstream of the first fluid orifice. First and second fluid paths are provided in fluid communication with the pressurized fluid source via the first and second fluid orifices. The first and second fluid paths extend upward between the first and second sidewalls of the wire support chamber and out the open top.