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Timothy Skunes Phones & Addresses

  • 102 Dylan Ct, Saint Paul, MN 55115 (651) 426-4301
  • Mahtomedi, MN
  • Minneapolis, MN
  • 102 Dylan Ct, Mahtomedi, MN 55115 (952) 201-9894

Work

Position: Executive, Administrative, and Managerial Occupations

Education

Degree: High school graduate or higher

Publications

Us Patents

Optical Module With Solder Bond

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US Patent:
6443631, Sep 3, 2002
Filed:
Feb 20, 2001
Appl. No.:
09/789185
Inventors:
Steven K. Case - St. Louis Park MN
Gregory S. Mowry - Burnsville MN
Timothy A. Skunes - Mahtomedi MN
Assignee:
Avanti Optics Corporation - Minneapolis MN
International Classification:
G02B 636
US Classification:
385 91, 385137, 385 52
Abstract:
An optical module for use in an optical device is provided which includes an optical component. The optical component is bonded to a relative reference mount which can be attached to couple to a fixed reference mount. The bond is formed by solder.

High Speed Optical Sensor Inspection System

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US Patent:
2012032, Dec 27, 2012
Filed:
May 24, 2012
Appl. No.:
13/480079
Inventors:
Steven K. Case - St. Louis Park MN,
Beverly Caruso - St. Louis Park MN,
Todd D. Liberty - Apple Valley MN,
Timothy A. Skunes - Mahtomedi MN,
Carl E. Haugan - St. Paul MN,
Chuanqi Chen - Singapore,
Hiroshi Anzai - Kanagawa,
International Classification:
H04N 7/18
G06F 17/00
US Classification:
348 92, 235375, 348E07085
Abstract:
An optical inspection sensor is provided. The sensor includes an array of cameras configured to acquire image data relative to a workpiece that moves relative to the array of cameras in a non-stop fashion. An illumination system is disposed to provide a pulse of illumination when the array of cameras acquires the image data. At least some image data includes data regarding a skip mark or barcode on the workpiece.

Optical Device With Alignment Compensation

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US Patent:
2004021, Oct 28, 2004
Filed:
Apr 22, 2003
Appl. No.:
10/420349
Inventors:
Steven Case - St. Louis Park MN,
Timothy Skunes - Mahtomedi MN,
Michael Knipfer - Maple Grove MN,
Gregory Mowry - Burnsville MN,
International Classification:
G01B011/00
US Classification:
356/401000
Abstract:
An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device. The alignment compensation module removes residual alignment errors of the optical device.

Optical Alignment Mount With Height Adjustment

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US Patent:
2004026, Dec 30, 2004
Filed:
Aug 20, 2003
Appl. No.:
10/644650
Inventors:
Timothy Skunes - Mahtomedi MN,
John Konicek - Minneapolis MN,
Michael Knipfer - Maple Grove MN,
International Classification:
G02B006/26
US Classification:
385/052000
Abstract:
An optical alignment mount for adjusting a height of an optical component includes a component mount adapted to receive an optical component. A height of the optical component in the mount can be adjusted and fixed as desired.

On-Head Component Alignment Using Multiple Area Array Image Detectors

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US Patent:
2010029, Nov 25, 2010
Filed:
Apr 28, 2010
Appl. No.:
12/769151
Inventors:
Steven K. Case - St. Louis Park MN,
Timothy A. Skunes - Mahtomedi MN,
David W. Duquette - Minneapolis MN,
Sean D. Smith - Woodbury MN,
Beverly Caruso - St. Louis Park MN,
International Classification:
H04N 7/18
US Classification:
348 95, 348E07085
Abstract:
A sensor for sensing component offset and orientation when held on a nozzle of a pick and place machine is provided. The sensor includes a plurality of two-dimensional cameras, a backlight illuminator and a controller. Each camera has a field of view that includes a nozzle of the pick and place machine. The backlight illuminator is configured to direct illumination toward the plurality of two-dimensional cameras. The backlight illuminator is positioned on an opposite side of a nozzle from the plurality of two-dimensional cameras. The controller is coupled to the plurality of two-dimensional cameras and the backlight illuminator. The controller is configured to determine offset and orientation information of the component(s) based upon a plurality of backlit shadow images detected by the plurality of two-dimensional cameras. The controller provides the offset and orientation information to a controller of the pick and place machine.

High Speed Optical Inspection System With Adaptive Focusing

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US Patent:
2011009, Apr 21, 2011
Filed:
Nov 4, 2010
Appl. No.:
12/939267
Inventors:
Carl E. Haugan - St. Paul MN,
Steven K. Case - St. Louis Park MN,
Beverly Caruso - St. Louis Park MN,
Timothy A. Skunes - Mahtomedi MN,
International Classification:
H04N 7/18
US Classification:
348136, 348139, 348E07085
Abstract:
An optical inspection system for inspecting a substrate is provided. The system includes an array of cameras configured to acquire a plurality of sets of images as the substrate and the array undergo relative motion with respect to each other. At least one focus actuator is operably coupled to each camera of the array of cameras to cause displacement of at least a portion of each camera that affects focus. A substrate range calculator is configured to receive at least portions of images from the array and to calculate range between the array of cameras and the substrate. A controller is coupled to the array of cameras and to the range calculator. The controller is configured to provide a control signal to each of the at least one focus actuator to adaptively focus each camera of the array during the relative motion.

High Speed Distributed Optical Sensor Inspection System

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US Patent:
2011010, May 5, 2011
Filed:
Nov 5, 2010
Appl. No.:
12/940214
Inventors:
Steven K. Case - St. Louis Park MN,
Beverly Caruso - St. Louis Park MN,
Todd D. Liberty - Apple Valley MN,
Timothy A. Skunes - Mahtomedi MN,
Carl E. Haugan - St. Paul MN,
Chuanqi Chen - Singapore,
International Classification:
H04N 7/18
US Classification:
348 87, 348E07085
Abstract:
An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion. A computer is operably coupled to the first and second optical inspection sensors and is configured to provide an inspection result based upon at least one of the first and second inspection image data.

High Speed, High Resolution, Three Dimensional Printed Circuit Board Inspection System

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US Patent:
2012013, May 31, 2012
Filed:
Dec 1, 2011
Appl. No.:
13/309211
Inventors:
Timothy A. Skunes - Mahtomedi MN,
Carl E. Haugan - St. Paul MN,
Paul R. Haugan - Bloomington MN,
Eric P. Rudd - Hopkins MN,
Steven K. Case - St. Louis Park MN,
Beverly Caruso - St. Louis Park MN,
International Classification:
G01P 3/40
US Classification:
356 23
Abstract:
An optical inspection system includes a printed circuit board (PCB) transport and an illuminator that provides at least a first strobed illumination field. The illuminator includes a light pipe having a first end proximate the PCB, and a second end opposite the first end and spaced from the first end. An array of cameras is configured to digitally image the PCB and to generate a plurality of images of the PCB with the at least first strobed illumination field type. At least one structured light projector is disposed to project structured illumination on the PCB. The at least one array of cameras is configured to digitally image the PCB while the PCB is illuminated with structured light, to provide a plurality of structured light images. A processing device is configured to generate an inspection result as a function of the plurality of images and the plurality of structured light images.
Timothy A Skunes from Mahtomedi, MN, age ~58 Get Report