US Patent:
20200371568, Nov 26, 2020
Inventors:
- San Jose CA, US
Hussam Zebian - San Jose CA, US
Haoyu Wu - Sunnyvale CA, US
Toshiki Hirano - San Jose CA, US
Jeff Wilke - Palmer Lake CO, US
Timothy Skarzynski - Colorado Springs CO, US
International Classification:
G06F 1/20
G06F 1/18
H05K 7/20
Abstract:
A data storage system may include multiple data storage devices, such as solid-state drives, an enclosure housing the devices, and a thermal bridge positioned in a gap between and in contact with each of the enclosure and a device, where the enclosure is cooler than the device. Thus, heat is conducted away from a hot spot of the device and to the enclosure. The thermal bridge may be flexible enough to bridge different sized gaps, while stiff enough to generate contact forces applied to the enclosure and the device. For example, the thermal bridge may be constructed primarily of copper and configured to function like a compression spring.