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Tifenn M Boisard

from Cedar Park, TX
Age ~51
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Also known as:
Tifenn M Rockey, Tifen Boisard
Related to:
Carol E Rockey, 64
Connected to:
Blue Boisaubin, 47Amber M Boisclair, 39Brian R Boisclair, 67Charles E Boisclair, 71Craig R Boisclair, 56Heidi C Boisclair, 55Jean P Boisclair, 94Jordan C Boisclair, 32Rosemary L Boisclair, 70Roxann Boisclair, 72

Tifenn Boisard Phones & Addresses

  • Cedar Park, TX
  • 8101 Luling Ln, Austin, TX 78729 (512) 331-9323
  • 12345 Lamplight Village Ave, Austin, TX 78758 (512) 490-6430
  • 8700 Birmingham Dr, Austin, TX 78748
  • 12349 Metric Blvd, Austin, TX 78758 (512) 490-0013
  • 2819 Rio Grande St, Austin, TX 78705
  • 502 Cameron Cv, Cedar Park, TX 78613 (512) 636-1205

Work

Company: Poly 2019 Position: Mechanical engineer

Education

Degree: Masters School / High School: The University of Texas at Austin 1996 to 1998 Specialities: Engineering

Skills

Pro Engineer • Design For Manufacturing • Engineering • Mechanical Engineering • Product Design • Six Sigma • Solidworks • Engineering Management • Product Management • Testing • Product Development • Cross Functional Team Leadership • Process Improvement • Sheet Metal • Program Management • Ptc Creo • Manufacturing • Business Process Improvement

Languages

English • French

Industries

Mechanical Or Industrial Engineering

Resumes

Resumes

Tifenn Boisard Photo 1

Mechanical Engineer

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Location:
Austin, TX
Industry:
Mechanical Or Industrial Engineering
Work:
Poly
Mechanical Engineer
Polycom 2017 - 2019
Mechanical Engineer
Emc 2012 - 2017
Mechanical System Architect
Dell 2011 - 2012
Enablement System Engineer
Dell 2005 - 2011
Lead Mechanical Engineer
Education:
The University of Texas at Austin 1996 - 1998
Masters, Engineering Epf Ecole D'ingénieur - E - S 1992 - 1997
Bachelors, Engineering
Skills:
Pro Engineer
Design For Manufacturing
Engineering
Mechanical Engineering
Product Design
Six Sigma
Solidworks
Engineering Management
Product Management
Testing
Product Development
Cross Functional Team Leadership
Process Improvement
Sheet Metal
Program Management
Ptc Creo
Manufacturing
Business Process Improvement
Languages:
English
French

Publications

Us Patents

Method And Apparatus For Retaining A Card In An Information Handling System

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US Patent:
20070004264, Jan 4, 2007
Filed:
Jun 30, 2005
Appl. No.:
11/170802
Inventors:
Gregory Brown - Austin TX, US
Tifenn Boisard - Austin TX, US
Marco Marroquin - Pflugerville TX, US
William Morris - Round Rock TX, US
Assignee:
Dell Products L.P. - Round Rock TX
International Classification:
H01R 13/627
US Classification:
439351000
Abstract:
A card retaining apparatus includes a reinforced card support post including a board mounting member and a card securing device which is operable to couple to the reinforced card support post. The reinforced card support post may be mounted to a board adjacent a card connector and the card securing device coupled to the card support post to retain a card in the card connector.

Coupling For A Modular Component And Chassis Combination

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US Patent:
20080068789, Mar 20, 2008
Filed:
Sep 14, 2006
Appl. No.:
11/531942
Inventors:
Darren B. Pav - Round Rock TX, US
Tifenn Boisard - Austin TX, US
Assignee:
Dell Products L.P. - Round Rock TX
International Classification:
G06F 1/20
US Classification:
361687
Abstract:
A modular component coupling apparatus includes a chassis defining a chassis housing. A modular component mounting member is pivotally coupled to the chassis, wherein the modular component mounting member defines a modular component housing, whereby the modular component mounting member is operable to pivot relative to the chassis between a first position that is outside of the chassis housing and a second position that is within the chassis housing.

Gradient Micro-Electro-Mechanical (Mems) Microphone Assembly

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US Patent:
20190379955, Dec 12, 2019
Filed:
Jun 6, 2019
Appl. No.:
16/434045
Inventors:
- San Jose CA, US
Tifenn Boisard - Austin TX, US
Erwin Mariano - Chonburi, TH
International Classification:
H04R 1/02
H04R 19/04
Abstract:
MEMS microphone assembly which is formed by the combination of front and rear single piece boots, which are configured to mate, and a MEMS microphone. The front boot includes two ports for receiving sound waves which are provided to ports of the MEMS microphone. The front boot includes two collars to form the ports and which are used to align the MEMS microphone assembly in a housing containing the MEMS microphone assembly. Acoustic tubes transfer the sound waves from the ports to the MEMS microphone. There can be air channels provided with the acoustic tubes to reduce microphonics. The front and rear boots contain recesses to capture the MEMS microphone to simplify alignment and assembly.

System And Method Of Unified Cooling Solution In An Iot Device

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US Patent:
20170231110, Aug 10, 2017
Filed:
Feb 10, 2016
Appl. No.:
15/040446
Inventors:
- Round Rock TX, US
Travis C. North - Cedar Park TX, US
Tifenn M. Boisard - Cedar Park TX, US
Deeder M. Aurongzeb - Austin TX, US
Assignee:
Dell Products, LP - Round Rock TX
International Classification:
H05K 7/20
H05K 9/00
Abstract:
A cooling assembly for an IOT wireless gateway device that includes a motherboard structure operatively coupled to one side of a first motherboard component, which is operatively coupled on the other side to one side of a first gap pad for conducting heat, an EMI shield operatively coupled to the other side of the first gap pad and surrounding the sides of the first motherboard component, the EMI shield also operatively coupled to the motherboard structure, the outside of the EMI shield operatively coupled to one side of a second gap pad for conducting heat, and a first heat sink operatively coupled to the other side of the second gap pad for conducting heat.
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Tifenn M Boisard from Cedar Park, TX, age ~51 Get Report