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Thor Juneau Phones & Addresses

  • 367 Waverley St, Menlo Park, CA 94025
  • Los Gatos, CA
  • 1812 Delaware St, Berkeley, CA 94703
  • Loveland, CO
  • Pacific Grove, CA

Work

Company: Linear technology Jan 2012 Position: System and wireless ic design engineer

Education

Degree: Doctorates, Doctor of Philosophy School / High School: University of California, Berkeley 1991 to 1997 Specialities: Statistics, Design

Skills

Mems • Semiconductors • Integrated Circuit Design • Power Management • Mixed Signal • Sensors • Ic • Asic • Simulations • Soc • Engineering Management • Wireless • Analog • Fpga • Rf • Cmos • Wireless Technologies

Industries

Semiconductors

Resumes

Resumes

Thor Juneau Photo 1

System And Wireless Ic Design Engineer

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Location:
Menlo Park, CA
Industry:
Semiconductors
Work:
Linear Technology
System and Wireless Ic Design Engineer

Dust Networks Jun 2007 - Dec 2011
System and Wireless Ic Design Engineer

Siti Aug 2005 - Jun 2007
Mems Engineer

Iris Ao Sep 2003 - Aug 2005
Mems Engineer

Analog Devices Apr 2003 - Sep 2003
Marketing Engineer, Power Management Group
Education:
University of California, Berkeley 1991 - 1997
Doctorates, Doctor of Philosophy, Statistics, Design
Carnegie Mellon University 1987 - 1991
Bachelors, Bachelor of Science, Mechanical Engineering
Skills:
Mems
Semiconductors
Integrated Circuit Design
Power Management
Mixed Signal
Sensors
Ic
Asic
Simulations
Soc
Engineering Management
Wireless
Analog
Fpga
Rf
Cmos
Wireless Technologies

Business Records

Name / Title
Company / Classification
Phones & Addresses
Thor Juneau
President
Integrated Micro Instruments
Commercial Physical Research
2140 Shattuck Ave, Berkeley, CA 94704

Publications

Us Patents

Micro-Machined Accelerometer With Improved Transfer Characteristics

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US Patent:
6386032, May 14, 2002
Filed:
Aug 1, 2000
Appl. No.:
09/630535
Inventors:
Mark A. Lemkin - El Cerrito CA
Allen W. Roessig - Fremont CA
Thor Juneau - Berkeley CA
William A. Clark - Fremont CA
Assignee:
Analog Devices IMI, Inc. - Berkeley CA
International Classification:
G01C 1900
US Classification:
7350402, 7351432, 7351418
Abstract:
A micromechanical, dithered device comprising a substrate, a movable mass connected to the substrate by a suspension, a position sensor, a dither signal generator, a dither force transducer connected between the substrate and the movable mass, the input of the dither force transducer being connected to the output of the dither signal generator and a calculator taking as inputs at least the position sensor output and the dither signal generator output. In one embodiment of the invention, the dithered device includes an electrostatic force transducer for applying feedback. In this embodiment, dither force may be directly applied to the mechanical proof-mass utilizing electrostatic structures similar to electrostatic structures used for feedback. The electrostatic dithering structures provide good matching between the feedback and dither electrodes, enabling the use of simple logic for subtraction of the dither signal from the accelerometer output.

Microfabricated Structures With Trench-Isolation Using Bonded-Substrates And Cavities

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US Patent:
6433401, Aug 13, 2002
Filed:
Apr 5, 2000
Appl. No.:
09/543936
Inventors:
William A. Clark - Fremont CA
Mark A. Lemkin - Berkeley CA
Thor N. Juneau - Berkeley CA
Allen W. Roessig - Fremont CA
Assignee:
Analog Devices IMI, Inc. - Berkeley CA
International Classification:
H01L 2900
US Classification:
257524, 257510
Abstract:
A microstructure and method for forming the microstructure are disclosed. The method includes: providing a handle substrate; providing a device substrate in which high-aspect-ratio structures and optional integrated circuitry will be fabricated; forming one or more filled isolation trenches within a recessed cavity on a first surface of the device substrate or alternatively forming one or more filled isolation trenches on a first surface of the device substrate and forming a recessed cavity on a first surface of the handle substrate; bonding the first surface of the device substrate to the first surface of the handle substrate; removing a substantially uniform amount of material from the second surface of the device substrate to expose at least one isolation trench; optionally forming circuits and interconnection on a second surface of the device substrate; and etching a set of features in the second surface of the device substrate to complete the definition of electrically isolated structural elements. The micromechanical device includes: a device substrate having a first surface, a second surface, and a semiconductor layer; a handle substrate, the first surface of the device substrate bonded to the handle substrate; one or more first trenches formed in the device substrate, the first trenches extending from the second surface of the device substrate through the device substrate towards the handle substrate; a dielectric within the first trenches; one or more cavities disposed below the second surface of the device layer, a cavity enclosing a portion of at least one trench; at least one second trench formed in the second surface of the device substrate, the second trench completing definition of one or more micromechanical devices.

Low-Resistivity Microelectromechanical Structures With Co-Fabricated Integrated Circuit

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US Patent:
6703679, Mar 9, 2004
Filed:
Jul 7, 2000
Appl. No.:
09/612482
Inventors:
Mark A. Lemkin - El Cerrito CA
William A. Clark - Fremont CA
Thor Juneau - Berkeley CA
Allen W. Roessig - Fremont CA
Assignee:
Analog Devices, IMI, Inc. - Berkeley CA
International Classification:
H01L 2900
US Classification:
257513, 257515, 257507, 257524, 7351433
Abstract:
A microfabricated device includes a substrate having a device layer and substantially filled, isolating trenches; a doped region of material formed by photolithographically defining a region for selective doping of said device layer, selectively doping said region, and thermally diffusing said dopant; circuits on said device layer formed using a substantially standard circuit technology; and at least one structure trench in the substrate which completes the definition of electrically isolated micromechanical structural elements.

Parallel Plate Electrostatic Actuation Of Mems Mirrors

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US Patent:
6822370, Nov 23, 2004
Filed:
Mar 6, 2002
Appl. No.:
10/092193
Inventors:
William A. Clark - Fremont CA
Thor Juneau - Berkeley CA
James Doscher - Westford MA
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
H02N 100
US Classification:
310309
Abstract:
A microactuator is disclosed including one or more stationary plates formed on a substrate, a mirror base plate on which a mirror is formed, and one or more actuation plates coupled to the mirror base plate by one or more microspring mechanisms. The mirror base plate, the one or more actuation plates and the one or more microspring mechanisms are suspended over the stationary plates by one or more anchors. The stationary plates and the actuation plates are formed of a doped material so as to be electrically conductive. Upon application of a voltage potential between the respective plates, the actuation plates are pulled down toward the stationary plates, thus exerting a drive force on the base mirror plate to actuate the mirror between switching positions.

Position Sensing With Improved Linearity

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US Patent:
6868726, Mar 22, 2005
Filed:
Jan 18, 2001
Appl. No.:
09/765521
Inventors:
Mark A. Lemkin - El Cerrito CA, US
Thor N. Juneau - Berkeley CA, US
William A. Clark - Fremont CA, US
Allen W. Roessig - Fremont CA, US
Assignee:
Analog Devices IMI, Inc. - Berkeley CA
International Classification:
G01P015/125
US Classification:
7351432
Abstract:
A position-sense interface with improved transfer characteristics. Electrical position detection circuitry, which may be substantially time-multiplexed or frequency-multiplexed, comprises a differential charge integrator with input-sensed output-driven common mode feedback. By placing sense capacitors in the feedback loop of said differential charge integrator with input-sensed output-driven common mode feedback, improved position sensing linearity is attained. In some embodiments of the invention, a compensating charge is applied to the sense capacitors in a fashion that minimizes the output common mode shift of the opamp. The magnitude of the compensating charge may be preset at a substantially constant level, or derived by a feedback loop that measures the shift in output common mode voltage in response to an excitation signal and adjusts the magnitude of the compensating charge to drive said shift towards zero. The invention has numerous advantages for acceleration measurement in both open-loop and force-balanced accelerometers, as well as rotation rate measurement in a vibratory rate gyroscope. Other applications in which the invention may prove advantageous include: motion detection for an oscillation-sustaining feedback loop; position detection of actuators, including micro-actuators used for effecting controlled motion of a disk-drive read/write head, or effecting controlled motion of an optically active device, such as a positionable mirror for use in fiber-optic data communications; and application of electrostatic forces for large motions.

Reducing Offset In Accelerometers

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US Patent:
6892576, May 17, 2005
Filed:
Jul 18, 2003
Appl. No.:
10/622380
Inventors:
Howard R. Samuels - Newton MA, US
David C. Hollocher - Norwood MA, US
Michael Judy - Wakefield MA, US
Thor Juneau - Berkeley CA, US
Assignee:
Analog Devices, Inc. - Norwood MA
International Classification:
G01P015/125
US Classification:
7351432
Abstract:
Accelerometer offset is reduced by forming mass support structures within an inner periphery of the mass, affixing the mass support structures to the substrate by at least one anchor positioned near the mass' center of mass, and affixing the sensing fingers proximate to the anchor. The mass support structures can be affixed to the substrate using a single anchor or multiple anchors that are positioned close together. The sensing fingers can be affixed to the substrate or to the mass support structures. The mass is typically suspended from within its periphery but toward its outer periphery.

Structure For Attenuation Or Cancellation Of Quadrature Error

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US Patent:
7051590, May 30, 2006
Filed:
Jun 13, 2000
Appl. No.:
09/593593
Inventors:
Mark A. Lemkin - El Cerrito CA, US
William A. Clark - Fremont CA, US
Thor N. Juneau - Berkeley CA, US
Allen W. Roessig - Fremont CA, US
Assignee:
Analog Devices IMI, Inc. - Berkeley CA
International Classification:
G01P 9/04
US Classification:
7350404, 7350412, 7350414
Abstract:
A movable microstructure includes a first finger set comprising two or more first fingers affixed to a substrate and extending substantially parallel to a defined displacement axis towards a proof-mass. The movable microstructure further includes a second finger set comprising at least one second finger, each member of the second finger set extending substantially parallel to the displacement axis from the proof-mass, terminating between two first fingers. Each second finger is substantially closer to one of the two first fingers between which it terminates. The first finger set, in conjunction with the second finger set, form two terminals of a capacitor. An electrical circuit is included that provides a voltage across the capacitor to generate a position-dependent force, the position-dependent force having a component along an axis substantially orthogonal to the displacement axis, the magnitude of the position-dependent force varying in proportion to displacement along the displacement axis.

Resonator Electrode Shields

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US Patent:
7808332, Oct 5, 2010
Filed:
Mar 24, 2008
Appl. No.:
12/054300
Inventors:
David Raymond Pedersen - Mountain View CA, US
Aaron Partridge - Cupertino CA, US
Thor Juneau - Menlo Park CA, US
Assignee:
SiTime Corporation - Sunnyvale CA
International Classification:
H03B 5/30
US Classification:
331155, 331154, 331156, 333186, 333197
Abstract:
One embodiment of the present invention sets forth a MEMS resonator system that reduces interference signals arising from undesired capacitive coupling between different system elements. The system includes a MEMS resonator, two or more resonator electrodes, and at least one resonator electrode shield. The resonator electrode shield ensures that the resonator electrodes interact with either one or more shunting nodes or the active elements of the MEMS resonator by preventing or reducing, among other things, capacitive coupling between the resonator electrodes and the support and auxiliary elements of the MEMS resonator structure. By reducing the deleterious effects of interfering signals using one or more resonator electrode shields, a simpler, lower interference, and more efficient system relative to prior art approaches is presented.
Thor N Juneau from Menlo Park, CA, age ~56 Get Report