Terry L Doyle

6952656, Oct 4, 2005

Apr 28, 2000

09/561440

Sherry Cordova - Sunnyvale CA, US
Terry L. Doyle - Portola Valley CA, US
Natalia Kroupnova - Sunnyvale CA, US
Evgueni Lobovski - San Jose CA, US
Inna Louneva - Palo Alto CA, US
Richard C. Lyon - Boulder Creek CA, US
Yukari Nishimura - Sunnyvale CA, US
Clari Nolet - Los Altos CA, US
Terry Reiss - San Jose CA, US
Woon Young Toh - San Jose CA, US
Michael E. Wilmer - Portola Valley CA, US

Applied Materials, Inc. - Santa Clara CA

G06F019/00

702117, 700121

The present invention provides a semiconductor processing device () including a tool () having one or more sensors, a primary data communication port () and a secondary data communication port (). A sensor data acquisition subsystem () acquires sensor data from the tool via the secondary port (). The data acquisition subsystem () acquires MES operation messages via the primary port (). Sensor data are communicated to a sensor processing unit () of a sensor data processing subsystem (). The sensor processing unit () processes and analyzes the sensor data. Additionally, the processing unit () can be adapted for making product or processing related decisions, for example activating an alarm if the process is not operating within control limits. In another embodiment, the present invention provides a method and apparatus for processing data from a wafer fab facility () including a plurality of tools () each having a primary data communication port () and a secondary data communication port ().

20060154569, Jul 13, 2006

Jan 11, 2005

11/034350

Terry Doyle - Redwood City CA, US
Lakshmanan Karuppiah - San Jose CA, US

B24B 49/00

451008000

Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip rings burdened with moving surfaces. In one embodiment, an apparatus for processing a substrate is provided. The apparatus includes a platen assembly having a surface for supporting a planarizing material and disposed on a stationary base so that the platen assembly may rotate relative to the base. The apparatus further includes a coupling assembly for transferring electrical energy from a primary coil to a secondary coil. The coupling assembly includes the primary coil of wire wrapped around a first core; the first core coupled to the base; the secondary coil of wire wrapped around a second core; and the second core coupled to the platen assembly.

6535779, Mar 18, 2003

Mar 6, 1998

09/036217

Manush Birang - Los Gatos CA
Gregory L. Kolte - San Jose CA
Terry Lee Doyle - Portola Vally CA
Nils Johansson - Los Gatos CA
Paul E. Luscher - Sunnyvale CA
Leonid Poslavsky - Sunnyvale CA

Applied Materials, Inc. - Santa Clara CA

G06F 766

700121, 700112, 700114, 700258, 713500

A substrate processing system having a bi-directional interface and concomitant communication protocol to allow a controller to communicate with an external endpoint system is disclosed. More specifically, the substrate processing system comprises a controller and an endpoint detection system that are coupled together via a RS-232 interface. A SECS compliant communication protocol is employed to effect communication between the controller and endpoint detection system to increase wafer processing information exchange and data exchange.