Inventors:
Frank J. Polese - San Diego CA
Walter V. Giniel - San Marcos CA
Terrence V. Hermes - San Diego CA
Vladimir Ocheretyansky - Santee CA
International Classification:
B22F 312
Abstract:
High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of copper and at least one other denser material such as tungsten and/or molybdenum, the proportions of which are adjusted to match the thermal expansion characteristics of the microcircuit material. The pressed compacts are then heated in a sintering furnace at 1,200. degree. C. to 1,350. degree. C. in order to effect an homogeneous distribution of the melting copper throughout the structure. The process results in a readily usable component having good thermal conductivity and matched thermal expansion that requires no further machining.