Surya N Pattanaik

6336581, Jan 8, 2002

Jun 19, 2000

09/629481

Tatsumi Tuchiya - Ayase, JP
Tatsushi Yoshida - Chigasaki, JP
Yasuhiro Mita - Fujisawa, JP
Tadaaki Tomiyama - Chofu, JP
Takao Kidachi - Yamato, JP
Surya Pattanaik - San Jose CA

International Business Machines Corporation - Armonk NY

B23K 100

228 33, 228 41, 228245, 228246

A capillary tube for a solder ball connection device connects a first connection surface of a pad to a second connection surface of a pad with a solder ball. The first connection surface is formed at a slider held by a slider holder in a disk unit. The second connection surface is formed at an end of a lead wired to the slider holder. The capillary tube has a ball regulator with a substantially conic, hollow portion. The solder ball regulator has an opening at its top that opens to the tip of the hollow portion. The center axes of the hollow portion and the opening are common. The solder ball regulator also has a pair of projections along the center axis around the opening, where the projections face each other with the center axis therebetween. The projections regulate the movement of the solder ball. The tip of the hollow portion is tapered when viewed from a line connecting the pair of projections and the extreme tips of the tapered tip portions.

6351348, Feb 26, 2002

Jul 22, 1996

08/685420

A. David Erpelding - San Jose CA
Darrell D. Palmer - San Jose CA
Oscar J. Ruiz - San Jose CA
Surya Pattanaik - San Jose CA

International Business Machines Corporation - Armonk NY

G11B 548

3602443, 3602454

A suspension system for supporting a magnetic read/write slider comprising a load beam, a slider support member and a flexure comprised of a first flexure arm and a second flexure arm. A plurality of electrical conductors extend along the edge of the load beam on the side of the load beam farthest away from the disk hub. The electrical conductors are positioned adjacent to, but outside of, the second flexure arm, so as not to contribute to the stiffness of the second flexure arm. The electrical conductors are comprised of a laminated material which includes a conductor layer, such as a high strength copper alloy, a dielectric layer and a support layer. In another embodiment, the flexure includes a first flexible finger recion and a second flexible finger region. A first plurality of slots extend completely through the first flexible finger region, and a second plurality of slots extend completely through the second flexible finger region for providing regions into which the electrical conductors can move when the flexure undergoes deflections.

6442828, Sep 3, 2002

Feb 18, 2000

09/506619

David W. Albrecht - San Jose CA
Thomas R. Albrecht - San Jose CA
Satya Prakash Arya - San Jose CA
Tzong-Shii Pan - San Jose CA
Surya Pattanaik - San Jose CA
Victor Wing Chun Shum - San Jose CA

International Business Machines Corporation - Armonk NY

G11B 542

2960303, 2960304, 2960306, 2960307, 360104

A method for making a suspension system comprising a multiple layer flexure, a load beam and an arm. The load beam extends from the tip of the suspension all the way back to the rear of the arm. Datum holes are located in the load beam such that during assembly all reference points are made from the single load beam piece.

6459549, Oct 1, 2002

Jun 5, 2000

09/586830

Tatsumi Tsuchiya - Ayase, JP
Tatsushi Yoshida - Chigasaki, JP
Hiroyasu Tsuchida - Yokohama, JP
Hiroo Inoue - Fujisawa, JP
Surya Pattanaik - San Jose CA
Hiromi Ishikawa - Fujisawa, JP
Masaaki Nanba - Yamato, JP

International Business Machines Corporation - Armonk NY

G11B 2116

3602459, 3602642

Apertures are formed in the portion of a flexure adjacent to the soldered portions between the bonding pads of the slider and the lead pads of lead end portions. With this, an adhesive agent for bonding the slider to a flexure tongue is moved downward from the apertures so there is no fear that the adhesive agent will contact the lead pads and the bonding pads. This design prevents the protrusion of an adhesive agent from short-circuiting the flexure, and absorbs a warp produced by shrinkage of a soldered portion by decreasing rigidity of the flexure. When both the bonding pad formed on the slider and the lead pad of a lead fixed to the platform of the flexure are disposed and soldered, the quality of the soldered portion is improved by locating the pads as close to each other as possible.

6523250, Feb 25, 2003

Mar 21, 2001

09/814567

A. David Erpelding - San Jose CA
Surya Pattanaik - San Jose CA
Calvin Dean Lantrip - San Jose CA

International Business Machines Corporation - Armonk NY

G11B 5127

2960304, 2960302, 2960306, 3602345, 3602346

A method for assembling a slider suspension assembly for use in a disk drive is disclosed. A ceramic slider with an attached recording head is placed on a suspension and is held in alignment by soldering the electrical connections while the epoxy placed between the slider and the suspension hardens. The method results in a much more economical process which does not require the number of expensive tools needed to carry out the conventional process.

6539609, Apr 1, 2003

Jul 2, 2001

09/898213

Darrell D. Palmer - San Jose CA
A. David Erpelding - San Jose CA
Oscar J. Ruiz - San Jose CA
Surya Pattanaik - San Jose CA

International Business Machines Corporation - Armonk NY

G11B 5127

2960303, 2960302, 2960306, 29834, 29832, 29860, 3602345, 3602459

A method for forming a head gimbal assembly in which the head gimbal assembly and a frame are formed from a continuous piece of laminated material comprised of a first layer, a second layer and a third layer. A plurality of electrical lines are formed in the third layer of the head gimbal assembly and a plurality of electrical line extensions are formed in the third layer of the frame. The slider is positioned at an angle to the frame and a plurality of termination pads on the slider are bonded to the electrical lines. The frame is partially separated from the head gimbal assembly and the relative position of the slider to the head gimbal assembly is changed by an amount sufficient to separate the plurality of electrical lines from the plurality of electrical line extensions.

6543677, Apr 8, 2003

May 31, 2001

09/872252

Surya Pattanaik - San Jose CA
Takuya Satoh - Hayama-machi, JP
Tatsumi Tsuchiya - Ayase, JP
Tatsushi Yoshida - Chigasaki, JP

International Business Machines Corporation - Armonk NY

B23K 3512

228246, 228245, 22818022, 228 33, 228 41, 2191216, 21912163

In devices for solder-ball bonding of a bonding pad of a slider of a head gimbal assembly to a lead pad of a lead, although a device that can perform (1) the supply of solder balls, (2) the positioning of a solder ball, (3) the blowing of nitrogen gas N , and (4) the melting of the solder ball by laser radiation in one device is available, there are various problems that cannot improve the efficiency of laser radiation, maintenance, or operation efficiency, due to spatial restriction, difficulty of weight reduction, or fixed operation procedures. A solder-ball holder and an optical device are configured separately, and a vacuum pad is provided. A solder ball held in a solder-ball holding hole of the solder-ball holder is transported by the vacuum pad to a connecting portion of a head gimbal assembly, and solder reflow is carried out by the optical device.

6676778, Jan 13, 2004

Jun 19, 2000

09/596630

Tatsumi Tuchiya - Aase, JP
Tatsushi Yoshida - Chigasaki, JP
Naoki Fujii - Fujisawa, JP
Surya Pattanaik - San Jose CA
William A. Childers - Morgan Hill CA
Diane Sprandel ORegan - Los Gatos CA
Naoki Suzuki - Yokohama, JP
Yuhsuke Matsumoto - Fujisawa, JP

Hitachi Global Storage Technologies Netherlands B.V.

B32B 3128

156 64, 156 736, 1562728, 1562755, 1562757, 3602346, 3602347

A slider and suspension of a hard disk drive are joined with a low modulus epoxy adhesive. The slider and suspension are set in a bonding jig while they are moving from process to process or subjected to a thermosetting treatment in a controlled temperature chamber. The slider and suspension must be kept bound together with the bonding jig until the adhesive is cured through a thermal treatment. The low modulus epoxy adhesive is cured with heat from a laser beam. In addition, a resistance value of the head disposed at the slider is measured so as to monitor the temperature of the head, thereby deciding both output and irradiation time of the laser beam for obtaining a desired strength of the bond within a predetermined temperature range.