Search

Steven J Seipp

from Stanfordville, NY
Age ~62
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Also known as:
Steve J Seipp, Stephen Seipp
Phone and address:
92 Millis Ln, Stanfordville, NY 12581
(845) 868-7113
Related to:
Vivian Seipp, 71Taylor J Triola, 25Marlene Harris, 90Donald O Harris, 94Jodi Triola, 58Theresa TriolaJeanette Mikulski, 71
Connected to:
Bonnie L Seipp, 57Joel L Seipp, 44Julie A Seipp, 59Kelly J Seipp, 59Melanie J Seipp, 54Scott M Seipp, 48Theresa J Seipp, 70Michael G Seippel, 70Peter J Seippel, 110Kerry L Seir, 57

Steven Seipp Phones & Addresses

  • 92 Millis Ln, Stanfordville, NY 12581 (845) 868-7113
  • 93 Millis Ln, Stanfordville, NY 12581 (845) 868-7113
  • 3 White Gate Dr, Wappingers Falls, NY 12590 (845) 298-7214
  • Hopewell Junction, NY
  • 92 Millis Ln, Stanfordville, NY 12581

Work

Company: Ibm May 2001 to Jul 2015 Position: Ibm 300mm development line - optical metrology engineer

Education

School / High School: Dutchess Community College

Skills

Semiconductors • Spc • Process Engineering • Design of Experiments • Thin Films • Failure Analysis • Manufacturing • Characterization • Automation • Metrology • Cmos • Simulations • Six Sigma • Process Simulation • R&D • Engineering Management • Process Integration • Lean Manufacturing • Integration • Materials Science • Debugging • Labview • Root Cause Analysis • Electronics • C++ • Fmea • Circuit Design • Perl • Dimensional Metrology • Photoluminescence • Xrr • Youth Development • Spectroscopy • Measurement System Analysis • Predictive Maintenance • Spectral Analysis

Interests

Education • Science and Technology • Disaster and Humanitarian Relief • Animal Welfare • Health

Emails

s***[email protected]

Industries

Information Technology And Services

Resumes

Resumes

Steven Seipp Photo 1

Principal Metrology Equipment And Process Engineer - Ame

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Location:
Stanfordville, NY
Industry:
Information Technology And Services
Work:
Ibm May 2001 - Jul 2015
Ibm 300Mm Development Line - Optical Metrology Engineer
Globalfoundries May 2001 - Jul 2015
Principal Metrology Equipment and Process Engineer - Ame
Ibm Dec 1998 - May 2001
Ibm Avanced Semiconductor Technology Center
Ibm Jun 1982 - Dec 1998
Ibm Packaging
Harris Semiconductor Apr 1981 - Jun 1982
Production Operator
Education:
Dutchess Community College
Grantham University
Skills:
Semiconductors
Spc
Process Engineering
Design of Experiments
Thin Films
Failure Analysis
Manufacturing
Characterization
Automation
Metrology
Cmos
Simulations
Six Sigma
Process Simulation
R&D
Engineering Management
Process Integration
Lean Manufacturing
Integration
Materials Science
Debugging
Labview
Root Cause Analysis
Electronics
C++
Fmea
Circuit Design
Perl
Dimensional Metrology
Photoluminescence
Xrr
Youth Development
Spectroscopy
Measurement System Analysis
Predictive Maintenance
Spectral Analysis
Interests:
Education
Science and Technology
Disaster and Humanitarian Relief
Animal Welfare
Health

Publications

Us Patents

Alignment Routine For Optically Based Tools

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US Patent:
7545497, Jun 9, 2009
Filed:
Mar 10, 2008
Appl. No.:
12/045192
Inventors:
Steven J Seipp - Stanfordville NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01B 11/00
G06K 9/00
G03B 27/32
G03C 5/00
US Classification:
356401, 382151, 355 77, 430 30
Abstract:
A method is provided for using a point of interest as a starting point where an alignment is automatically selected by recognition software for a patterned substrate. The method includes disposing the patterned substrate on a stage of an exposure system, the exposure system having an alignment routine including; locating a first point of interest on the patterned substrate; scanning a first area proximate the first point of interest for a first unique feature; defining a periodicity for the patterned substrate; locating a second point of interest based on the periodicity; scanning a second area proximate the second point of interest for a second unique feature corresponding to the first unique feature; gathering alignment data from at least scanning the first and second areas; and determining substrate position relative to the exposure system from alignment data of at least the first and second scanned areas.

Alignment Routine For Optically Based Tools

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US Patent:
7375809, May 20, 2008
Filed:
Jun 20, 2003
Appl. No.:
10/604010
Inventors:
Steven J. Seipp - Stanfordville NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01B 11/00
G06K 9/00
G03B 27/32
G03C 5/00
US Classification:
356401, 382151, 355 77, 430 30
Abstract:
A method is provided for using a point of interest as a starting point where an alignment is automatically selected by recognition software for a patterned substrate. The method includes disposing the patterned substrate on a stage of an exposure system, the exposure system having an alignment routine including; locating a first point of interest on the patterned substrate; scanning a first area proximate the first point of interest for a first unique feature; defining a periodicity for the patterned substrate; locating a second point of interest based on the periodicity; scanning a second area proximate the second point of interest for a second unique feature corresponding to the first unique feature; gathering alignment data from at least scanning the first and second areas; and determining substrate position relative to the exposure system from alignment data of at least the first and second scanned areas.
Control profile
Steven J Seipp from Stanfordville, NY, age ~62 Get Report