Steven M Lardizabal

6439763, Aug 27, 2002

Feb 8, 2001

09/780754

Robert S. Roeder - Dunedin FL
Matthew C. Smith - Largo FL
Lawrence P. Dunleavy - Land of Lakes FL
Steven M. Lardizabal - Tampa FL

Raytheon Company - Lexington MA

G01K 730

374 1, 374175, 342351, 342174

A radiometer calibrating system utilizes an adjustable noise source for calibrating a radiometer. The noise source includes a transistor configured as a noise equivalent circuit having a gate port, drain port and source port. A source inductance providing series feedback for the noise source has one end coupled to the source port of the noise equivalent circuit and another end connected to the ground. A bias circuit controls the amount of DC bias applied to the noise equivalent circuit. In order to match the impedances in the noise source, an output impedance matching network is connected to the drain port and an input impedance matching network is connected to the gate port of the noise equivalent circuit. The output and input impedance networks have an output port and input port, respectively. Included in the noise source is a port switch that terminates a matched load to the output port when a cold thermal radiation temperature is generated at the input port, and alternatively, the port switch terminates the matched load to the input port when the warm thermal radiation temperature is generated at the output port.

7387958, Jun 17, 2008

Jul 8, 2005

11/177732

Christopher P. McCarroll - Andover MA, US
Jerome H. Pozgay - Marblehead MA, US
Steven M. Lardizabal - Westford MA, US
Thomas E. Kazior - Sudbury MA, US
Michael G. Adlerstein - Wellesley MA, US

Raytheon Company - Waltham MA

H01L 21/4763

438622, 438151, 257621, 257758, 257778

A method includes providing a single crystal wafer having MMIC chips. Each chip has an active device in a first surface portion of a semiconductor substrate provided by the wafer and an electrical interconnect having a first portion disposed on a second surface of the semiconductor substrate. The semiconductor substrate structure has a via therethrough, a second portion of the electrical interconnect passing though the via and being electrically connected to the active device. A multilayer interconnect structure is formed on the wafer providing a signal routing section on the second surface portion of a corresponding one of the chips. Each section has dielectric layers and an electrical conductor, such electrical conductor being electrically coupled to the active device to route an electrical signal to such active device. Each chip and the corresponding signal routing section are separated from the wafer.

62172107, Apr 17, 2001

Aug 23, 1999

9/319520

Robert S. Roeder - Dunedin FL
Matthew C. Smith - Largo FL
Lawrence P. Dunleavy - Land of Lakes FL
Steven M. Lardizabal - Tampa FL

Raytheon Company - Lexington MA
University of South Florida - Tampa FL

G01K 1500
G01K 730

374 1

A radiometer calibrating system utilizes an adjustable noise source for calibrating a radiometer. The noise source includes a transistor configured as a noise equivalent circuit having a gate port, drain port and source port. A source inductance providing series feedback for the noise source has one end coupled to the source port of the noise equivalent circuit and another end connected to the ground. A bias circuit controls the amount of DC bias applied to the noise equivalent circuit. In order to match the impedances in the noise source, an output impedance matching network in connected to the drain port and an input impedance matching network is connected to the gate port of the noise equivalent circuit. The output and input impedance networks have an output port and input port, respectively. Included in the noise source is a port switch that terminates a matched load to the output port when a cold thermal radiation temperature is generated at the input port, and alternatively, the port switch terminates the matched load to the input port when the warm thermal radiation temperature is generated at the output port.

20210273558, Sep 2, 2021

Jan 13, 2020

16/741318

- Waltham MA, US
Steven D. Bernstein - Brighton MA, US
Steven M. Lardizabal - Westford MA, US
Jason Adams - Medway MA, US
Jeffrey R. Laroche - Austin TX, US

H02M 1/44
H01F 27/28
H05K 1/16
H01F 27/36
H02M 1/42

A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

20190190456, Jun 20, 2019

Dec 15, 2017

15/843922

- Waltham MA, US
Valery S. Kaper - Winchester MA, US
Steven M. Lardizabal - Westford MA, US

Raytheon Company - Waltham MA

H03F 1/02
H03F 3/193
H01L 29/20
H03F 1/22
H03F 3/345
H03F 1/30

A circuit having (A) a transistor, (B) a bias circuit for providing setting a bias current for the transistor, the bias current having a current level in accordance with a reference current fed to the bias circuit; and (C) a bias current level controller, comprising: (i) a plurality of switches, each one of the switches comprises: a MOS FET and a GaN FET connected in a cascode configuration; and (ii) current source circuitry, comprising a plurality of current sources, each one of the current sources being connected between a voltage source and a corresponding one of the plurality of switches, the current source circuit combining currents produced by the current source in response a binary control signal fed to a gate of the MOS FET, the combined current providing the reference current fed to the bias circuit.

20190149039, May 16, 2019

Aug 6, 2018

16/055792

- Waltham MA, US
Steven D. Bernstein - Brighton MA, US
Steven M. Lardizabal - Westford MA, US
Jason Adams - Medway MA, US
Jeffrey R. Laroche - Austin TX, US

H02M 1/44
H01F 27/28
H01F 27/36
H05K 1/16
H02M 1/42

A power converter assembly is provided and includes high quality factor (Q) shield-to-transistor integrated low-inductance capacitor elements to divert common mode (CM) currents, high Q shield-to-shield integrated low-inductance capacitor elements to compliment line-to-line filter capacitors and high Q baseplate integrated low-inductance capacitor elements to attenuate residual CM currents.

20190081567, Mar 14, 2019

Sep 13, 2017

15/703455

- Waltham MA, US
Steven D. Bernstein - Brighton MA, US
Steven M. Lardizabal - Westford MA, US
Jason Adams - Medway MA, US
Jeffrey R. Laroche - Austin TX, US

H02M 7/00
H01F 27/28
H01F 27/42
H03M 1/12
H02J 50/40

A modular high-power converter system includes an electronic power distribution unit configured to output an analog current (AC) voltage to a power bus, and at least one Transmit or Receive Integrated Microwave Module (T/RIMM) that includes a voltage converter unit and a transmitter and receiver (T/R) unit. The voltage converter unit includes at least one analog-to-digital converter (ADC) to convert the AC voltage into a direct current (DC) voltage having a first DC voltage level. The transmitter and receiver (T/R) unit includes a modular-based DC/DC converter to convert the DC voltage into a second DC voltage having a second voltage. The modular-based DC/DC converter includes a modular power converter unit configured to generate the second DC voltage. The modular converter unit is configured to be independently interchangeable with a different modular converter unit.

20170033817, Feb 2, 2017

Jul 29, 2015

14/812283

- Waltham MA, US
Steven M. Lardizabal - Westford MA, US

RAYTHEON COMPANY - Waltham MA

H04B 1/12
H04B 1/10

A method and receiver for detecting a signal wherein the signal is encoded the signal with a pair of spaced predetermined frequencies and wherein energy is detected in each of the pair of predetermined frequencies and in a predetermined frequency between the pair of predetermined frequencies. Energy detected in each of the pair of predetermined frequencies is compared with the energy detected in the predetermined frequency between the pair of predetermined frequencies. The detecting includes passing the encoded signal through narrow band filters, each one of the filters being tuned to a corresponding one of the pair of predetermined frequencies and the predetermined frequency between the pair of predetermined frequencies.