Steven A Castaldi

6585904, Jul 1, 2003

Feb 15, 2001

09/784242

Peter Kukanskis - Woodbury CT, 06798
Dennis Fritz - Brookville IN, 47012
Frank Durso - Cheshire CT, 06410
Steven Castaldi - Torrington CT, 06790
David Sawoska - Watertown CT, 06795

H01B 1300

216 13, 216 67, 216 65, 216 74, 216 75, 21912169, 438382, 257690, 174250

A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

6773757, Aug 10, 2004

Apr 14, 2003

10/412932

Ronald Redline - Prospect CT, 06712
David Angelone - Waterbury CT, 06705
Steven A. Castaldi - Torrington CT, 06790
Lenora M Toscano - Bristol CT, 06010

B05D 136

427404, 427405, 4274071, 427409, 427343, 427436, 427437

A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.

7022464, Apr 4, 2006

Aug 25, 2004

10/925589

Peter Kukanskis - Woodbury CT, US
Steven Castaldi - Torrington CT, US

G03F 7/00
C22C 18/32

430315, 430311, 430313, 427 995, 4271266

An integral plated resistor having an improved range of resistance is produced by uniformly dispersing an effective amount of various particles in an electroless nickel phosphorus plating composition so that the particles are codeposited with the electroless nickel phosphorus plating composition. Preferred particles include, polytetrafluoroethylene, silicon carbide, tungsten carbide, and other particles that fully sinter at a temperature of less than about 170 C. The improved nickel phosphorus plated resistors of the invention demonstrate increased stability during manufacturing press cycles and a greater range of resistance values than have previously been achieved.

7034231, Apr 25, 2006

Apr 21, 2003

10/419651

Peter Kukanskis - Woodbury CT, US
Dennis Fritz - Brookville IN, US
Frank Durso - Cheshire CT, US
Steven Castaldi - Torrington CT, US
David Sawoska - Watertown CT, US

H05K 1/16

174260, 174256, 174258, 361751, 361761, 361762, 361765, 361766, 361777, 361779, 213 13

A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

7279108, Oct 9, 2007

Feb 6, 2006

11/348941

Peter Kukanskis - Woodbury CT, US
Dennis Fritz - Brookville IN, US
Frank Durso - Cheshire CT, US
Steven Castaldi - Torrington CT, US
David Sawoska - Watertown CT, US

H01B 13/00
H01L 23/48

216 13, 216 41, 216 65, 216 67, 216 74, 216 75, 174250, 438382, 438689, 21912167

A process is revealed whereby resistors can be manufactured integral with a printed circuit board by plating the resistors onto the insulative substrate. Uniformization of the insulative substrate through etching and oxidation of the plated resistor are discussed as techniques for improving the uniformity and consistency of the plated resistors. Trimming and baking are also disclosed as methods for adjusting and stabilizing the resistance of the plated resistors.

7456114, Nov 25, 2008

Dec 21, 2005

11/316010

Kesheng Feng - Cheshire CT, US
Nilesh Kapadia - Shelton CT, US
Steven A. Castaldi - Torrington CT, US

C09K 13/00
C09K 13/04

438745, 438754, 252 791, 252 792, 252 793, 252 794, 216 93, 216105, 216106

The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

7631798, Dec 15, 2009

Oct 2, 2008

12/244136

Ernest Long - Burlington CT, US
Lenora M. Toscano - Bristol CT, US
Paul Romaine - Oakville CT, US
Colleen McKirryher - Thomaston CT, US
Donna M. Kologe - Thomaston CT, US
Steven A. Castaldi - Torrington CT, US
Carl P. Steinecker - South Lyon MI, US

B23K 35/24
B23K 35/36
B05D 5/12

22826261, 228256, 427125

A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with a silver plate prior to soldering, which immersion silver plate is treated with an additive comprising a mercapto substituted or thio substituted silane compound. Preferred post treatments comprise 3-mercapto propyl trimethoxysilane and/or 3-oxtanoylthio-1-propyltriethoxy silane.

7645393, Jan 12, 2010

Apr 27, 2007

11/796660

Kesheng Feng - Cheshire CT, US
Ming De Wang - Naugatuck CT, US
Steven A. Castaldi - Torrington CT, US

C25F 3/00
C03C 15/00
C03C 25/68
C08K 5/16
C09K 13/04

216106, 524206, 252 792

A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile) polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for thermal stability. The polymer of the invention may be added to compositions containing for example, cupric chloride and hydrochloric acid and is also usable in compositions containing an oxidizer/acid/azole mixture. Other additives, such as adiponitrile may also be beneficially added to compositions of the invention.