Inventors:
Willy C. Wang - San Francisco CA
Steve Kun Sue - Richmond CA
Assignee:
Integrated Device Technology, Inc. - Santa Clara CA
International Classification:
G01N 2918
Abstract:
A non-destructive method of identifying a type of compound in a sample using an acoustic microscope, particularly, identifying the type of compound used in an integrated circuit package by comparing attributes of the tested molding compound with known attributes of known compounds to identify the compound being evaluated. The attributes that are compared include voltage, attenuation, peak frequency, average frequency, and the velocity of reflected sound.
