US Patent:
20180138064, May 17, 2018
Inventors:
- Grand Cayman, KY
Stephanie Waite - Saratoga Springs NY, US
Stephen B. Miner - Gansevoort NY, US
John Robinson - Saratoga Springs NY, US
International Classification:
H01L 21/673
H01L 21/677
B08B 9/00
B08B 5/02
B08B 5/00
Abstract:
A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.