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Srinath K Aanegola

from Cleveland, OH
Age ~56
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Also known as:
Angola A Srinath
Phone and address:
4811 Buckingham Ave, Cleveland, OH 44147
(440) 546-0552
Related to:
Lakshmi Aanegola, 51
Connected to:
Kayla J Aanenson, 60Dakotah J Aanerud, 37Gail E Aanestad, 63Alf S Aanonsen, 103Nicole M Aaqil, 34Yekta Aarabi, 45Mark A Aardahl, 36David C Aardal, 85Jonathan M Aardal, 53Robert G Aardal, 83

Srinath Aanegola Phones & Addresses

  • 4811 Buckingham Ave, Broadview Heights, OH 44147 (440) 546-0552
  • 11105 Apache Dr, Cleveland, OH 44130 (440) 887-1070
  • Parma Heights, OH
  • Grayslake, IL
  • Santa Clara, CA
  • San Jose, CA
  • Mankato, MN
  • Broadview Hts, OH

Work

Company: Ge Position: Director, led technology

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Srinath Aanegola Photo 1

Director, Led Technology At Ge

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Location:
2400 Miller Rd, Dearborn, MI 48120
Industry:
Electrical/Electronic Manufacturing
Work:
GE
Director, LED Technology

Publications

Us Patents

Parallel/Series Led Strip

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US Patent:
7114841, Oct 3, 2006
Filed:
Mar 22, 2004
Appl. No.:
10/805931
Inventors:
Srinath K. Aanegola - Broadview Heights OH, US
Mathew Sommers - Sagamore Hills OH, US
Matthew Mrakovich - Streetsborough OH, US
Christopher L. Bohler - North Royalton OH, US
Michael McCoy - Strongsville OH, US
Assignee:
GELcore LLC - Valley View OH
International Classification:
H01R 33/00
H02G 3/04
US Classification:
362640, 362249, 439460
Abstract:
An LED light engine includes a flexible electrical cable and a plurality of LEDs. The flexible electrical cable includes first, second and third electrical conductors and an electrically insulating covering for the electrical conductors. The conductors are arranged substantially parallel with one another having an insulating material therebetween. A first LED including a first lead electrically connects to the first electrical conductor and a second lead of the first LED electrically connects to the second conductor. A second LED includes a first lead electrically connected to the second electrical conductor and a second lead electrically connected to the third electrical conductor. A third LED includes first and second leads electrically connected to the second conductor. The third LED is interposed between the first LED and the second LED.

Illuminated Signage Employing Light Emitting Diodes

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US Patent:
7217012, May 15, 2007
Filed:
May 24, 2002
Appl. No.:
10/484674
Inventors:
Paul Southard - Broadview Heights OH, US
Srinath K. Aanegola - Broadview Heights OH, US
James T. Petroski - Parma OH, US
Christopher Bohler - North Royalton OH, US
Assignee:
Lumination, LLC - Valley View OH
International Classification:
F21V 21/00
US Classification:
362391, 362240, 362249, 362252, 362800, 362812, 439403, 439404, 439419, 439425
Abstract:
An illuminated sign () includes a flexible electrical power cord () including first and second parallel conductors () surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (). A plurality of light emitting diode (LED) devices () are affixed to the cord (). Each LED device () includes an LED () having a positive lead () electrically communicating with the first parallel conductor () and a negative lead () electrically communicating with the second parallel conductor (). A stencil () defines a selected shape, and the electrical cord () is arranged on the stencil (). Power conditioning electronics () disposed away from the stencil () electrically communicate with the first and second parallel conductors () of the electrical power cord (). The power conditioning electronics () power the LED devices () via the parallel conductors ().

Light Emitting Diode Component

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US Patent:
7224000, May 29, 2007
Filed:
Apr 26, 2004
Appl. No.:
10/831862
Inventors:
Srinath K. Aanegola - Broadview Heights OH, US
James T. Petroski - Parma OH, US
Emil Radkov - Euclid OH, US
Assignee:
Lumination, LLC - Valley View OH
International Classification:
H01L 29/22
H01L 29/227
H01L 27/15
H01L 29/267
H01L 29/24
US Classification:
257 98, 257 79, 257 81, 257100, 257E5118, 257E33001
Abstract:
A light emitting package () includes a printed circuit board () supporting at least one light emitting die (). A light transmissive cover () is disposed over the at least one light emitting die. The cover has an open end defining a cover perimeter () connected with the printed circuit board. An inside surface of the cover together with the printed circuit board defines an interior volume () containing the at least one light emitting die. An encapsulant () is disposed in the interior volume and covers at least the light emitting die.

Illuminated Signage Employing Light Emitting Diodes

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US Patent:
7399105, Jul 15, 2008
Filed:
Apr 16, 2007
Appl. No.:
11/787325
Inventors:
Paul Southard - Broadview Heights OH, US
Srinath K. Aanegola - Broadview Heights OH, US
James T. Petroski - Parma OH, US
Christopher Bohler - North Royalton OH, US
Assignee:
Lumination LLC - Valley View OH
International Classification:
F21V 21/00
US Classification:
362391, 362240, 362249, 362252, 362800, 362812, 439403, 439404, 439419, 439425
Abstract:
An illuminated sign () includes a flexible electrical power cord () including first and second parallel conductors () surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (). A plurality of light emitting diode (LED) devices () are affixed to the cord (). Each LED device () includes an LED () having a positive lead () electrically communicating with the first parallel conductor () and a negative lead () electrically communicating with the second parallel conductor (). A stencil () defines a selected shape, and the electrical cord () is arranged on the stencil (). Power conditioning electronics () disposed away from the stencil () electrically communicate with the first and second parallel conductors () of the electrical power cord (). The power conditioning electronics () power the LED devices () via the parallel conductors ().

Support With Recessed Electrically Conductive Chip Attachment Material For Flip-Chip Bonding A Light Emitting Chip

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US Patent:
7635869, Dec 22, 2009
Filed:
Sep 14, 2006
Appl. No.:
11/520905
Inventors:
Boris Kolodin - Beachwood OH, US
Michael Hsing - Sanchong, TW
Ivan Eliashevich - Maplewood NJ, US
Srinath K. Aanegola - Broadview Heights OH, US
Assignee:
Lumination LLC - Valley View OH
International Classification:
H01L 33/00
US Classification:
257 79, 257778, 257783, 257E33057
Abstract:
In a light emitting device, a light emitting chip () includes a stack of semiconductor layers () and an electrode () disposed on the stack of semiconductor layers. A support () has a generally planar surface () supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material () is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (′) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

Flexible Lighting Strips Employing Light-Emitting Diodes

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US Patent:
7686477, Mar 30, 2010
Filed:
Jul 14, 2008
Appl. No.:
12/172705
Inventors:
Paul Southard - Broadview Heights OH, US
Srinath K. Aanegola - Broadview Heights OH, US
James T. Petroski - Parma OH, US
Christopher Bohler - North Royalton OH, US
Assignee:
Lumination LLC - Cleveland OH
International Classification:
F21S 4/00
US Classification:
36224904, 36224902, 36224903, 36224908, 36224914, 439403, 439404, 439417, 439419, 439425
Abstract:
An illuminated sign () includes a flexible electrical power cord () including first and second parallel conductors () surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (). A plurality of light emitting diode (LED) devices () are affixed to the cord (). Each LED device () includes an LED () having a positive lead () electrically communicating with the first parallel conductor () and a negative lead () electrically communicating with the second parallel conductor (). A stencil () defines a selected shape, and the electrical cord () is arranged on the stencil (). Power conditioning electronics () disposed away from the stencil () electrically communicate with the first and second parallel conductors () of the electrical power cord (). The power conditioning electronics () power the LED devices () via the parallel conductors ().

Light Emitting Diode Component

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US Patent:
7800121, Sep 21, 2010
Filed:
Dec 20, 2005
Appl. No.:
11/312268
Inventors:
Srinath K. Aanegola - Parma Heights OH, US
Emil V. Radkov - Euclid OH, US
James Reginelli - North Royalton OH, US
Larry R. Stadelman - Stow OH, US
Matthew Mrakovich - Streetsboro OH, US
Tomislav J. Stimac - Concord OH, US
Assignee:
Lumination LLC - Cleveland OH
International Classification:
H01L 29/22
H01L 29/227
H01L 27/15
H01L 29/267
H01L 29/24
US Classification:
257 98, 257 79, 257 81, 257100, 257E5118, 257E33001
Abstract:
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Light Emitting Packages And Methods Of Making Same

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US Patent:
7842960, Nov 30, 2010
Filed:
Sep 6, 2006
Appl. No.:
11/516533
Inventors:
James Reginelli - Parma OH, US
Srinath K. Aanegola - Broadview Heights OH, US
Emil Radkov - Euclid OH, US
Assignee:
Lumination LLC - Cleveland OH
International Classification:
H01L 21/00
US Classification:
257 98, 257100, 257E33056, 257E33073
Abstract:
In a light emitting package (), at least one light emitting chip () is supported by a board (). A light transmissive encapsulant () is disposed over the at least one light emitting chip and over a footprint area () of the board. A light transmissive generally conformal shell () is disposed over the encapsulant and has an inner surface () spaced apart by an air gap (G) from, and generally conformal with, an outer surface () of the encapsulant. At least one phosphor () is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell () is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0. 3 W/(mK).
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Srinath K Aanegola from Cleveland, OH, age ~56 Get Report