Inventors:
Sivadasan Kulangara - Temecula CA, US
Amanullah Khan - Temecula CA, US
Assignee:
Magnecomp Corporation - Temecula CA
International Classification:
G11B 5/48
Abstract:
A disk drive electrical interconnect assembly and additive method therefor. The interconnect assembly has a supporting or fifth layer of metal, a fourth layer of a polyimide precursor or a polyimide with a first face directed away from the fifth layer, a third layer directly attached to the first face and defining a first subset of one or more conductive trace pair members, a second layer on the third and fourth layers of a polyimide precursor or a polyimide with a second face directed away from the third layer, and a first layer directly attached to the second layer and defining a second subset of one or more conductive trace pair members in spaced, paired and laterally offset relation respectively with one or more of the first subset pair members.