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Sheng Chung Liao

from Fremont, CA
Age ~78
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Also known as:
Sheng Chung Dr Liao, Sheng Chun Liao, Sheng Wei Liao, Sheng C Liao, Shengchung C Liao, Chung Liao Sheng, Chengjou Liao, Sheng-Chung Liao, Shengching Liao
Related to:
Chengjou J Liao, 39Jomei R Liao, 44Wei Duan, 74
Connected to:
Allen H Liao, 70Benedict S Liao, 84Celina S Liao, 30Chong Liao, 79Christy Liao, 38Chunyuan Liao, 48Danny J Liao, 44Edward R Liao, 51Elena T Liao, 42Elyse A Liao, 42

Sheng Liao Phones & Addresses

  • Fremont, CA
  • Bridgeville, PA
  • 3714 Gleneagle Dr, Murrysville, PA 15668 (724) 327-5291
  • Brooklyn, NY
  • Pittsburgh, PA
  • Mesa, AZ
  • Lawrence, KS
  • 3714 Gleneagle Dr, Murrysville, PA 15668 (724) 584-5122

Work

Position: Food Preparation and Serving Related Occupations

Education

Degree: Associate degree or higher

Emails

c***[email protected]

Business Records

Name / Title
Company / Classification
Phones & Addresses
Sheng Liao
M
Titan Biosciences
Nonclassifiable Establishments · Marketing Health Supplement Products
650 Castro St, Mountain View, CA 94041

Publications

Us Patents

Dual Row Quad Flat No-Lead Semiconductor Package

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US Patent:
20140069703, Mar 13, 2014
Filed:
Sep 10, 2013
Appl. No.:
14/023259
Inventors:
- St. Michael, BB
Sheng C. Liao - San Jose CA, US
Assignee:
Marvell World Trade Ltd. - St. Michael
International Classification:
H01L 23/50
US Classification:
174261
Abstract:
Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.

Dual Row Quad Flat No-Lead Semiconductor Package

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US Patent:
20160358845, Dec 8, 2016
Filed:
Aug 22, 2016
Appl. No.:
15/243302
Inventors:
- St. Michael, BB
Sheng C. Liao - San Jose CA, US
Shiann-Ming Liou - Campbell CA, US
International Classification:
H01L 23/495
Abstract:
Some of the embodiments of the present disclosure provide a Quad Flat No-Lead package comprising: an outer row of outer peripheral leads disposed on an outer periphery of a bottom surface of the Quad Flat No-Lead package; and an inner row of inner peripheral leads disposed on an inner periphery of the bottom surface of the Quad Flat No-Lead package, wherein each of the inner peripheral leads has a substantially rectangular shape, and wherein the substantially rectangular shape has two rounded corners adjacent to the outer row of outer peripheral leads.
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Sheng Chung Liao from Fremont, CA, age ~78 Get Report