Inventors:
Hua Quen Tserng - Dallas TX
Paul Saunier - Garland TX
Shashikant M. Sanzgiri - Seattle WA
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2941
H01Q 1308
H01Q 2300
Abstract:
A flip-chip integrated circuit having passive 302, 304, 306 as well as active 308, 310 components on a frontside surface of a substrate. The active device have airbridges which contact a heatsink to provide heat dissipation from the junctions of the devices.