US Patent:
20030020084, Jan 30, 2003
Inventors:
John Fan - Chestnut Hill MA, US
Brenda Dingle - Mansfield MA, US
Shambhu Shastry - Franklin MA, US
Mark Spitzer - Sharon MA, US
Robert McClelland - Norwell MA, US
Assignee:
Kopin Corporation - Taunton MA
International Classification:
H01L033/00
Abstract:
Light emitting diodes (LEDs) and LED bars and LED arrays formed of semiconductive material such as III-V and particularly AIGaAs/GaAs material are formed in very thin structures using organometallic vapor deposition (OMCVD). Semiconductor p-n junctions are formed as deposited using carbon as the p-type impurity dopant. Various lift-off methods are described which permit back side processing when the growth substrate is removed and also enabled device registration for LED bars and arrays to be maintained.