Inventors:
Thomas Wegner - Cecil WI, US
Peter Hunnicutt - Greenville WI, US
Douglas Wegner - Shawano WI, US
Jeffrey Cogswell - Appleton WI, US
Scott Santaga - Green Bay WI, US
Michael Yuenger - Green Bay WI, US
International Classification:
B65B 65/00
Abstract:
A modular packaging system includes a base system configured to manipulate a product and configured to receive at least one of a group of packaging modules, wherein the base system is used with a variety of packaging modules depending on a desired packaged output. The system also includes a first packaging module selectively coupled to the base system, the packaging module having a first member coupled to the packaging module, the member configured to manipulate an object. The system may also include a second packaging module selectively coupled to the base system, the second packaging module having a lifting device coupled to the second packaging module, the lifting device configured to manipulate an object.